US2005284789A1PendingUtilityA1

Laser-scored push-through blister backing and methods of making same

49
Individually held — no corporate assignee on recordPriority: Jun 29, 2004Filed: Jun 29, 2004Published: Dec 29, 2005
Est. expiryJun 29, 2024(expired)· nominal 20-yr term from priority
Inventors:Dennis Carespodi
B32B 2310/0843B32B 2309/105B32B 2553/00B32B 15/20Y10T428/1355B32B 15/09B65D 75/327B32B 7/12B32B 15/08
49
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Push-through blister backing laminates providing a laser-scored outer layer and a metal substrate layer, and methods of making such laminates are disclosed. The laser-scored blister backing may allow for the use of a reduced amount of metal substrate as compared to blister backing that is not laser scored. The laser-scored push-through blister backing laminate may include a first, laser-scored outer layer, and a push-through metal layer such that the laminate functions as a push-through blister backing when it is applied to a blister film.

Claims

exact text as granted — not AI-modified
1 . A blister backing laminate comprising a first outer layer and a second metal substrate layer, wherein the outer layer is at least partially scored with a laser such that the laminate functions as a push-through blister backing.  
     
     
         2 . The blister backing of  claim 1 , further comprising a layer of adhesive bonding agent between the first outer layer and the metal substrate layer and a layer of sealant for adhering the blister backing to a blister film.  
     
     
         3 . The blister backing of  claim 2 , wherein the outer layer is scored through only part of the depth of the outer layer.  
     
     
         4 . The blister backing of  claim 2 , wherein at least one score cuts substantially through the entire depth of the outer layer.  
     
     
         5 . The blister backing of  claim 2 , wherein at least one score cuts substantially through the outer layer and at least part of the adhesive bonding layer.  
     
     
         6 . The blister backing of  claim 2 , wherein at least one score cuts substantially through the entire depth of the outer layer and the bonding layer down to the metal layer.  
     
     
         7 . The blister backing of  claim 1 , wherein the outer layer comprises a polymer film.  
     
     
         8 . The blister backing of  claim 1 , wherein the outer layer comprises polyethylene terephthalate (PET).  
     
     
         9 . The blister backing of  claim 1 , wherein the outer layer comprises a cellulosic substrate.  
     
     
         10 . The blister backing of  claim 1 , wherein the metal layer comprises aluminum foil.  
     
     
         11 . The blister backing of  claim 10 , wherein the foil comprises a thickness of about 0.0002 inches to about 0.002 inches.  
     
     
         12 . The blister backing of  claim 10 , wherein the foil comprises a thickness of about 0.00025 inches to about 0.001 inches.  
     
     
         13 . The blister backing of  claim 10 , wherein the foil comprises a thickness of about 0.0003 inches to about 0.0008 inches.  
     
     
         14 . The blister backing of  claim 1 , wherein the laminate comprises at least one layer of printing.  
     
     
         15 . The blister backing of  claim 1 , wherein the laser comprises a CO 2  laser.  
     
     
         16 . The blister backing of  claim 1 , wherein the laminate is adhered to a blister film.  
     
     
         17 . The blister backing of  claim 16 , wherein the portion of the laminate that is laser scored is positioned over the opening of the blister.  
     
     
         18 . A push-through blister packaging comprising a blister backing laminate applied to a blister film, the blister backing laminate comprising a first outer layer and a second metal substrate layer, wherein the outer layer is at least partially scored with a laser such the laminate functions as a push-through blister backing.  
     
     
         19 . A method for producing a push-through blister backing laminate comprising forming a blister backing laminate comprising a first outer layer and a second metal substrate layer, and using a laser to at least partially score the outer layer of the laminate such that the laminate functions as a push-through blister backing.  
     
     
         20 . The method of  claim 19 , further comprising applying a layer of adhesive bonding agent between the first outer layer and the metal substrate layer and a layer of sealant to the surface of the metal substrate layer that is opposite of the outer layer for adhering the blister backing to a blister film.  
     
     
         21 . The method of  claim 20 , wherein the outer layer is scored through only part of the depth of the outer layer.  
     
     
         22 . The method of  claim 20 , wherein at least one score cuts substantially through the entire depth of the outer layer.  
     
     
         23 . The method of  claim 20 , wherein at least one score cuts substantially through the outer layer and at least part of the adhesive bonding layer.  
     
     
         24 . The method of  claim 20 , wherein at least one score cuts substantially through the entire depth of the outer layer and the bonding layer down to the metal layer.  
     
     
         25 . The method of  claim 19 , wherein the outer layer comprises a polymer film.  
     
     
         26 . The method of  claim 25 , wherein the polymer film comprises polyethylene terephthalate (PET).  
     
     
         27 . The method of  claim 19 , wherein the outer layer comprises a cellulosic substrate.  
     
     
         28 . The method of  claim 19 , wherein the metal layer comprises aluminum foil.  
     
     
         29 . The method of  claim 28 , wherein the foil comprises a thickness of about 0.0002 inches to about 0.002 inches.  
     
     
         30 . The method of  claim 28 , wherein the foil comprises a thickness of about 0.00025 inches to about 0.001 inches.  
     
     
         31 . The method of  claim 28 , wherein the foil comprises a thickness of about 0.0003 inches to about 0.0008 inches.  
     
     
         32 . The method of  claim 19 , wherein the laminate comprises at least one layer of printing.  
     
     
         33 . The method of  claim 19 , wherein the laser comprises a CO 2  laser.  
     
     
         34 . The method of  claim 19 , wherein the blister backing laminate is adhered to a blister film.  
     
     
         35 . The method of  claim 34 , wherein the portion of the blister backing laminate that is laser scored is positioned over the opening of the blister.  
     
     
         36 . The method of  claim 34 , wherein the blister backing laminate is scored by a laser prior to adhering the backing to a blister film.  
     
     
         37 . The method of  claim 34 , wherein the blister backing laminate is scored by a laser after adhering the backing to a blister film.

Join the waitlist — get patent alerts

Track US2005284789A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.