US2006000325A1PendingUtilityA1

Linear via punch

44
Individually held — no corporate assignee on recordPriority: Mar 12, 1997Filed: Jul 7, 2005Published: Jan 5, 2006
Est. expiryMar 12, 2017(expired)· nominal 20-yr term from priority
Inventors:Ferdinand D. Dimaria
H10W 70/095B26F 1/02Y10T83/8831Y10T83/04Y10T83/8785Y10T83/7487Y10T83/8733H05K 1/0306Y10T83/8855B26F 2210/08H05K 3/005Y10T83/943H05K 2203/167
44
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Claims

Abstract

A method and apparatus for punching holes in a substrate which is disposed between a punch head with a fixed partial pattern of holes and a die having a full array pattern of holes. The punch head punches holes in the substrate by aligning with the die and contacting the substrate. Punches contained in the punch head articulate in at least one of x, y, and theta positions in order to precisely align with holes in the die thereby producing holes in the substrate which precisely match holes in the die.

Claims

exact text as granted — not AI-modified
1 . A tool for punching holes in a substrate comprising: 
 a punch head having a fixed partial pattern, and    a die having a full array pattern with a portion corresponding to said fixed partial pattern and adapted to support said substrate wherein said substrate is disposed between said punch head and said die such that said punch head is disposed above said substrate, said punch head punching holes in said substrate in a pattern which corresponds to said die array pattern.    
     
     
         2 . The tool of  claim 1  wherein said full array pattern is based on a via fill mask.  
     
     
         3 . The tool of  claim 2  wherein said die is comprised of a plurality of holes.  
     
     
         4 . The tool of  claim 1  further comprising alignment means to align said punch head with said die.  
     
     
         5 . The tool of  claim 4  wherein said alignment means is comprised of at least one alignment pin on said punch head and at least one locator hole in said die.  
     
     
         6 . The tool of  claim 1  wherein said punch head articulates in at least one of an x position, a y position, and a theta position with respect to said die.  
     
     
         7 . The tool of  claim 1  wherein said punch head articulates in at least one of an x position, a y position, and a theta position with respect to said die with each position having an accuracy of approximately +/−0.00381 cm. (0.0015 in.)  
     
     
         8 . A process for punching and filling vias in a substrate comprising the steps of: 
 a) fabricating a die having a full array die pattern corresponding to a via fill mask,    b) placing the substrate on the die,    c) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,    d) positioning the substrate and the die at a position below the punch head,    e) punching at least one via in the substrate corresponding to the die pattern of the die,    f) stepping the substrate and the die to a further position below the punch head, and    g) repeating steps e) and f) until the die pattern is complete.    
     
     
         9 . The process of  claim 8  wherein said substrate is a greensheet.  
     
     
         10 . The process of  claim 8  wherein in the punching step the punch head articulates in at least one of an x position, a y position, and a theta position with respect to said die.  
     
     
         11 . The process of  claim 8  further comprising fixing means to detachably fix said substrate to said die.  
     
     
         12 . The process of  claim 11  wherein said fixing means is a clamp.  
     
     
         13 . The process of  claim 11  wherein said fixing means is a vacuum.  
     
     
         14 . A process for punching and filling vias in a substrate comprising the steps of: 
 a) fabricating a die having a full array die pattern corresponding to a via fill mask,    b) placing the substrate on the die,    c) detachably fixing the substrate to the die,    d) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,    e) positioning the substrate and the die at a position below the punch head,    f) aligning the substrate and the die with the punch head,    g) punching at least one via in the substrate corresponding to the die pattern of the die,    h) stepping the substrate and the die to a further position below the punch head, and,    i) repeating steps f), g), and h) until the die pattern is complete.    
     
     
         15 . The process of  claim 14  wherein said substrate is a greensheet.  
     
     
         16 . The process of  claim 14  wherein in the punching step the punch head articulates in at least one of an x position, a y position, and a theta position with respect to said die.  
     
     
         17 . The process of  claim 14  wherein said die is comprised of a plurality of holes.  
     
     
         18 . A process for punching and filling vias in a substrate comprising the steps of 
 a) fabricating a die having a full array die pattern corresponding to a via fill mask,    b) placing the substrate on the die,    c) detachably fixing the substrate to the die,    d) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,    e) positioning the substrate and the die at a position below the punch head,    f) aligning the substrate and the die with the punch bead,    g) placing the punch head in contact with a top surface of the substrate,    h) Articulating the punch head in at least one of an x position, a y position, and a theta position with respect to said die,    i) punching at least one via in the substrate corresponding to the die pattern of the die,    j) stepping the substrate and the die to a further position below the punch head, and    l) repeating steps f) through j) until the die pattern is complete.    
     
     
         19 . The process of  claim 18  wherein said substrate is a greensheet.  
     
     
         20 . The processor  claim 18  wherein said substrate is a flexible plastic film.  
     
     
         21 . An tool for punching holes in a substrate comprising: 
 a punch head having a fixed partial pattern,    a die having a full array pattern with a portion corresponding to said fixed partial pattern and adapted to support said substrate wherein said substrate is disposed between said punch head and said die such that said punch head is disposed above said substrate, said punch head punching holes in said substrate in a pattern which corresponds to said die array pattern, and    alignment means for aligning said punch head with said die, said alignment means having at least one alignment pin on said punch head and at least one locator hole in said die,    wherein said punch head articulates in at least one of an x position, y position, and a theta position with respect to said die.    
     
     
         22 . The tool of  claim 21  wherein said punch head articulates with respect to said die with each position having an accuracy of approximately +/−0.00381 cm. (0.0015 in.)  
     
     
         23 . The tool of  claim 21  wherein said substrate is a greensheet.  
     
     
         24 . The tool of  claim 21  wherein said substrate is a flexible plastic film.

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