US2006000747A1PendingUtilityA1
Shipping container for integrated circuit wafers
Assignee: 3M INNOVATIVE PROPERTIES COPriority: Jun 30, 2004Filed: Jun 30, 2004Published: Jan 5, 2006
Est. expiryJun 30, 2024(expired)· nominal 20-yr term from priority
H10P 72/1916H10P 72/1902
37
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A shipping container for integrated circuit wafers has a lower section and an upper section releasably connected to the lower section, and a seal is received on a shoulder of the lower section. The seal is in contact with a lower edge portion of the upper section and extends in a flat reference plane when the sections are assembled together in order to help protect the wafers from moisture, airborne particulates and/or other contaminates. The shipping container also preferably includes at least one info pad plug that comprises a body and an adhesive for connecting the body to the lower section of the container.
Claims
exact text as granted — not AI-modified1 . A shipping container for integrated circuit wafers comprising:
a lower section including a base and a wall extending upwardly from the base, the base and the wall of the lower section defining a chamber for receiving a plurality of integrated circuit wafers, wherein the base includes a shoulder that extends next to the wall of the lower section along a path that lies in a flat reference plane; an upper section including a top and a wall depending from the top, the wall of the upper section extending continuously along a path adjacent the periphery of the top and having a lower edge portion, wherein the lower edge portion extends along a path that lies in a flat reference plane and is adjacent the shoulder when the lower section and the upper section are assembled together; and a seal in contact with the lower edge portion and the shoulder when the lower section and the upper section are assembled together.
2 . A shipping container for integrated circuit wafers according to claim 1 wherein the shoulder includes a groove having a circular shape in plan view.
3 . A shipping container for integrated circuit wafers according to claim 2 wherein the wall of the lower section and the groove extend along concentric circular paths.
4 . A shipping container for integrated circuit wafers according to claim 2 wherein the lower edge portion includes a pair of side-by-side ribs.
5 . A shipping container for integrated circuit wafers according to claim 4 wherein both of the ribs are in contact with the seal.
6 . A shipping container for integrated circuit wafers according to claim 4 wherein the ribs extend along a circular path in plan view.
7 . A shipping container for integrated circuit wafers according to claim 2 wherein the lower edge portion includes at least one depending rib that extends over the shoulder along a circular path.
8 . A shipping container for integrated circuit wafers according to claim 1 wherein the wall of the lower section and the wall of the upper section extend along concentric circular paths.
9 . A shipping container for integrated circuit wafers according to claim 1 wherein the seal is comprised of a polymeric foam material.
10 . A shipping container for integrated circuit wafers according to claim 1 wherein the base has an overall polygonal configuration in plan view, and wherein the shoulder has a groove with a circular shape in plan view.
11 . A shipping container for integrated circuit wafers according to claim 1 wherein the lower section additionally includes a plurality of cavities for receiving info pad plugs, wherein the shipping container includes at least one info pad plug received in one of the cavities, and wherein at least one info pad plug comprises a body and an adhesive for connecting the body to the lower section.
12 . A shipping container for integrated circuit wafers according to claim 11 wherein the adhesive releasably connects the body to the lower section.
13 . A shipping container for integrated circuit wafers according to claim 12 wherein the adhesive is a pressure sensitive adhesive.
14 . A shipping container for integrated circuit wafers according to claim 1 wherein the wall of the lower section includes at least one opening for accessing the wafers in the chamber.
15 . A shipping container for integrated circuit wafers according to claim 1 wherein the lower edge portion includes a pair of side-by-side ribs in contact with the seal when the lower section and the upper section are assembled together, and wherein a gap is present between the lower edge portion and the seal in the region between the ribs when the lower section and the upper section are assembled together.
16 . A shipping container for integrated circuit wafers comprising:
an upper section including a top and a wall depending from the top; a lower section releasably connected to the upper section, the lower section including a base and a wall extending upwardly from the base, wherein the base and the wall of the lower section define a chamber for receiving a plurality of integrated circuit wafers, wherein the lower section additionally includes a plurality of cavities for receiving info pad plugs; and at least one info pad plug received in one of the cavities, wherein at least one info pad plug comprises a body and an adhesive for connecting the body to the lower section.
17 . A shipping container for integrated circuit wafers according to claim 16 wherein the adhesive releasably connects the body to the lower section.
18 . A shipping container for integrated circuit wafers according to claim 17 wherein the adhesive is a pressure sensitive adhesive.
19 . A shipping container for integrated circuit wafers according to claim 16 wherein the cavities each include a ledge, and wherein the adhesive is in contact with the ledge.
20 . A shipping container for integrated circuit wafers according to claim 19 wherein the ledge has an annular configuration.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.