Shaped lead assembly for optoelectronic devices

Abstract

A shaped lead configuration for use with optoelectronic packages, such as optical subassemblies, is disclosed. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

1 . An optical transceiver module, comprising: 
 a housing;    a printed circuit board at least partially received by the housing;    an optoelectronic package, comprising: 
 a header containing optoelectronic components; and  
 a plurality of conductive leads that are in operable communication with the optoelectronic components, each lead including: 
 a straight portion extending from a surface of the header;  
 an end portion oriented so as to be retained within one of a plurality of vias defined in the printed circuit board; and  
 a shaped portion defining at least one bend in a first plane.  
 
   
   
   
       2 . The optical transceiver module as defined in  claim 1 , wherein the shaped portion is interposed between the straight and end portions.  
   
   
       3 . The optical transceiver module as defined in  claim 1 , wherein the optoelectronic package is an optical subassembly.  
   
   
       4 . The optical transceiver module as defined in  claim 1 , the end portions are linearly arranged for insertion into linearly arranged vias on the printed circuit board.  
   
   
       5 . The optical transceiver module as defined in  claim 1 , wherein at least one of the leads includes a shaped portion having bends defined in a first and a second plane.  
   
   
       6 . The optical transceiver module as defined in  claim 5 , wherein the first and second planes are orthogonal.  
   
   
       7 . The optical transceiver module as defined in  claim 1 , wherein the optoelectronic component includes five leads.  
   
   
       8 . The optical transceiver module as defined in  claim 1 , wherein the shaped portion of each lead provides stress relief for retaining the end portion of the lead within the via.  
   
   
       9 . A method for attaching an optoelectronic package to a printed circuit board, the method comprising: 
 shaping a plurality of leads that extend from the package such that each lead includes a first portion extending from the package surface, an end portion oriented for insertion into a corresponding via defined in a printed circuit board, and a shaped portion interposed between the first portion and the end portion, the shaped portion including at least one bend defined in a first plane;    receiving at least part of the shaped portion of each lead into a clip assembly that maintains the orientation of the end portion of each lead; and    inserting the end portion of each lead into a corresponding through-hole via defined in a first surface of the printed circuit board.    
   
   
       10 . The method for attaching as defined in  claim 9 , further comprising: 
 soldering each lead inserted into the corresponding through-hole via such that a segment of the end portion extends beyond a second surface of the printed circuit board.    
   
   
       11 . The method for attaching as defined in  claim 9 , wherein shaping the plurality is manually performed.  
   
   
       12 . The method for attaching as defined in  claim 9 , wherein receiving at least part of the shaped portion further includes: 
 receiving at least part of the shaped portion of each lead into a base of the clip assembly; and    attaching a cap on the base to cover a portion of each lead.    
   
   
       13 . The method for attaching as defined in  claim 9 , wherein receiving at least part of the shaped portion further includes: 
 receiving at least part of the shaped portion of each lead into the clip assembly such that the leads are electrically isolated from one another.    
   
   
       14 . An optical subassembly, comprising: 
 a header containing at least one optoelectronic component;    a plurality of conductive leads that are in operable communication with the at least one optoelectronic component, each lead including: 
 a straight portion extending from a surface of the header;  
 an end portion oriented so as to be received by a through-hole via defined in a printed circuit board; and  
 a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane; and  
   a clip assembly having a plurality of cavities that each receive a corresponding one of the leads such that the end portion of each lead extends from a surface of the clip.    
   
   
       15 . The optical subassembly as defined in  claim 14 , wherein the clip assembly maintains the orientation of the end portion of each lead in engaging a corresponding via defined in a printed circuit board.  
   
   
       16 . The optical subassembly as defined in  claim 15 , wherein the clip assembly is formed from a material that assists in controlling impedances of the leads.  
   
   
       17 . The optical subassembly as defined in  claim 16 , wherein the clip assembly further comprises: 
 a base portion including the plurality of cavities; and    a cap that removably attaches to the base portion.    
   
   
       18 . The optical subassembly as defined in  claim 17 , wherein the cap includes a tongue that covers a portion of at least some of the leads, and wherein the base portion includes at least one post that cooperates with at least one recess defined in the cap.  
   
   
       19 . The optical subassembly as defined in  claim 18 , wherein the base portion of the clip assembly includes extended portions that provide spacing between the base portion and a surface of the printed circuit board proximate the vias such that a solder fillet may be formed on each via.  
   
   
       20 . The optical subassembly as defined in  claim 19 , wherein the cavities include beveled surfaces to assist in receiving the leads.  
   
   
       21 . The optical subassembly as defined in  claim 20 , wherein the leads are received by vias that are defined on a single surface of the printed circuit board.