Thermoelectric heat dissipation device and method for fabricating the same

Abstract

A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.

1 . A method for fabricating a thermoelectric heat dissipation device, comprising: 
 providing a base plate having one surface patterned with a plurality of first conductive lines;    providing a heat sink having one surface patterned with a plurality of second conductive lines; and    adhering a thermoelectric semiconductive element to be sandwiched between the base plate and the heat sink so that a plurality of P-N posts of the thermoelectric semiconductive element are electrically connected with the first and the second conductive lines, respectively.    
   
   
       2 . The method as claimed in  claim 1 , wherein the step of providing the base plate further including providing the base plate made of ceramic material with heat conductivity but electrically insulated.  
   
   
       3 . The method as claimed in  claim 1 , wherein the adhering step further comprising adhering a cooling end of the thermoelectric semiconductive element to the base plate.  
   
   
       4 . The method as claimed in  claim 1 , wherein the adhering step further comprising adhering a heat dissipation end of the thermoelectric semiconductive element to the heat sink.  
   
   
       5 . The method as claimed in  claim 1 , wherein the step of providing the including providing the heat sink made of material with heat conductivity but electrically insulated.  
   
   
       6 . The method as claimed in  claim 1 , wherein the step of providing the heat sink including providing the heat sink made of a metal with high heat conductivity, and the surface of the heat sink utilized to adhere to the thermoelectric semiconductive element is coated with an anodic coating,  
   
   
       7 . A thermoelectric heat dissipation device comprising: 
 a thermoelectric semicondutive element;    a base plate with a plurality of first conductive lines patterned on one surface thereof so as to be adhered to one end of the semiconductive element; and    a heat sink with a plurality of conductive lines patterned on one surface thereof so as to be stacked on the other end of the thermoelectric semiconductive element.    
   
   
       8 . The thermoelectric heat dissipation device as claimed in  claim 7 , wherein the thermoelectric semiconductive element includes a plurality of P-N posts for electrically connecting with the second conductive lines when the heat sink stacked thereon.  
   
   
       9 . The thermoelectric heat dissipation device as claimed in  claim 7 , wherein the heat sink comprises a plate and a plurality of fins.  
   
   
       10 . The thermoelectric heat dissipation device as claimed in  claim 7 , wherein the heat sink is in a form of plate construction with an upper plate and a bottom plate.