Heat pipe heat sink with holeless fin module

Abstract

A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins. The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place. The top of the heat conducting plate is attached to the bottom surface of the heat conducting member, while the bottom of the heat conducting plate is thermally connected to the top surface of an electrical component. Via the heat conducting plate, a uniform heat connection end surface is formed below the heat conducting member.

1 . A heat pipe heat sink with a holeless fin module, comprising: 
 a heat dissipating fin module which is assembled by stacking a plurality of independent heat dissipating fins;    a heat conducting member with a plurality of concave trenches formed on a bottom and at least one side surfaces thereof, which is combined with the heat dissipating fin module;    a heat pipe installed on the heat conducting member with one end embedded in one trench on the bottom surface and the other end embedded in another trench on the side surface, the top thereof being exposed from the concave trenches; and    a heat conducting plate which is thermally connected to the bottom surface of the heat conducting member, providing the heat conducting member a uniform plane for combining with an electrical component.    
     
     
         2 . The heat pipe heat sink of  claim 1 , wherein the heat dissipating fin module has a connecting portion for providing the heat conducting member installed with the heat pipe a high fitness multi-areas contact thermal connection.  
     
     
         3 . The heat pipe heat sink of  claim 2 , wherein the connecting portion of the heat dissipating fin module is formed by stacking the connecting end of each of the heat dissipating fins which have connecting ends formed by bending one edge thereof.  
     
     
         4 . The heat pipe heat sink of  claim 1 , wherein the heat dissipating fin module has a concave connecting portion which has a plurality of concave portions formed on the bottom thereof for providing the heat conducting member installed with the heat pipe a high fitness multi-areas contact thermal connection.  
     
     
         5 . The heat pipe heat sink of  claim 2 , wherein the shape of the heat conducting member is formed in accordance with the shape of the connecting portion of the heat dissipating fin module.  
     
     
         6 . The heat pipe heat sink of  claim 1 , wherein the heat pipe is semi-inserted into the concave trench of the heat conducting member with the top surface thereof exposed outside the concave trench for thermally connecting to the connecting portion of the heat dissipating fin module.  
     
     
         7 . The heat pipe heat sink of  claim 2 , wherein the exposed portion of the heat pipe is a planar pipe wall which is coplanar with the end surface of the concave trench for thermally connecting to the connecting portion of the heat dissipating fin module.  
     
     
         8 . The heat pipe heat sink of  claim 1 , wherein the exposed portion of the heat pipe is an arch pipe wall which is raised above the end surface of the concave trench for thermally connecting to the corresponding concave portion of the connecting portion of the heat dissipating fin module.  
     
     
         9 . (canceled)  
     
     
         10 . The heat pipe heat sink of  claim 1 , wherein the heat conducting plate has a planar upper surface thermally connected to the bottom surface of the heat conducting member, and a planar lower surface thermally connected to the top surface of the electrical component.  
     
     
         11 . The heat pipe heat sink of  claim 1 , wherein the heat conducting plate has an upper surface with several concave trenches thermally connected to the heat pipes installed in the heat conducting member, and a planar lower surface thermally connected to the top surface of an electrical component.