Thermal management system and computer arrangement

Abstract

It is the object of the present invention to provide a low weight, compact, low vertical profile thermal management system for removing heat from electronic components. The thermal management system comprises of a plurality of “flow-through” type cooling devices, a source of filtered pressurized fluid suitable for use as a coolant, and a fluid delivering device that supplies the cooling devices with fluid. A preferred fluid is air, such as a filtered pressurized air. The cooling device is comprised of a high conductivity metal matrix composite heat spreader, a miniature heat sink, preferably of the same material, a permeable heat exchanger with high specific surface, and a closure that provides structural integrity of the cooling device.

1 . A thermal heat management system comprising flow-through cooling device, a source of filtered pressurized air and a closure that provides structural integrity of the cooling device.  
     
     
         2 . The thermal heat management system of  claim 1  further comprising a heat spreader, a heat sink, a substrate and a permeable heat exchanger.  
     
     
         3 . A thermal heat management system for removing heat from electronic components comprising: 
 a) a plurality of flow-through type cooling devices;    b) a source of pressurized air; and    c) an air delivering device wherein the cooling device of (a) further comprises a heat spreader, a heat sink, a substrate and a heat exchanger.    
     
     
         4 . The thermal heat management system of  claim 3 , wherein the source of pressurized air of (b) is filtered.  
     
     
         5 . The thermal heat management system of  claim 3 , wherein the heat exchanger is permeable.  
     
     
         6 . The thermal heat management system of  claim 3 , wherein the heat spreader is metal matrix.  
     
     
         7 . The thermal heat management system of  claim 6 , wherein the metal matrix possesses high conductivity.  
     
     
         8 . The thermal heat management system of  claim 6 , wherein the heat spreader is a microcomposite heat spreader.  
     
     
         9 . The heat spreader of  claim 8 , wherein the thermal conductivity and the CTE are isotropic.  
     
     
         10 . The thermal heat management system of  claim 6 , wherein the heat spreader is a macrocomposite heat spreader.  
     
     
         11 . The thermal heat management system of  claim 3 , wherein the heat spreader is made of material selected from the group consisting of graphite foams, metal foams, ceramic foams, graphic fabrics, porous metals and nanotubes.  
     
     
         12 . The thermal heat management system of  claim 3 , wherein the heat sink is ceramic.  
     
     
         13 . The thermal heat management system of  claim 3 , wherein the heat sink is made of the same material as the heat spreader.  
     
     
         14 . The thermal heat management system of  claim 3 , wherein the substrate has a thermal expansion coefficient compatible with semiconductor materials.  
     
     
         15 . The thermal heat management system of  claim 14 , wherein the substrate is ceramic.  
     
     
         16 . The thermal heat management system of  claim 3 , wherein the substrate is a metal matrix composite.  
     
     
         17 . The thermal heat management system of  claim 16 , wherein the metal matrix composite possess high thermal conductivity.  
     
     
         18 . The thermal heat management system of  claim 3 , wherein the heat exchanger is permeable.  
     
     
         19 . The heat exchanger of  claim 18  having a high specific surface area.  
     
     
         20 . The heat exchanger of  claim 18  further comprising a high thermal conductivity.  
     
     
         21 . The heat exchanger of  claim 18  further comprising porosity in range of about 50 to about 60 percent.  
     
     
         22 . The heat exchanger of  claim 18  further comprising graphite foams, metal foams, ceramic foams, graphic fabrics, and porous metals.  
     
     
         23 . The heat exchanger of  claim 18  further comprising carbon nanotubes.  
     
     
         24 . The heat exchanger of  claim 3 , wherein the heat exchanger is a labyrinth type heat exchanger.  
     
     
         25 . The labyrinth type heat exchanger of  claim 24 , wherein the heat exchange is branched.  
     
     
         26 . A method of producing an integrated cooling system comprising forming a silicon die integrated metallurgically into the flow-through cooling structure to form a single whole thermally uninterrupted body.