Vibration severity monitor for a press die

Abstract

A die monitoring system for use in a press machine includes a die element, a vibration severity monitor, and a monitor receiving portion. The vibration severity monitor is configured for monitoring a vibration severity condition of the die element. The monitor receiving portion is associated with the die element and includes a monitor cavity. This monitor cavity is configured for an operable mounting of the vibration severity monitor therewithin. A primary feature of the vibration severity monitor is that it can remain with a particular die throughout the lifetime thereof, even if the die is interchanged between machine presses.

1 . A die system for use in a machine press, said die system comprising: 
 a die element;    a vibration severity monitor configured for monitoring a vibration severity condition of said die element; and    a monitor receiving portion associated with said die element, said monitor receiving portion including a monitor cavity configured for an operable mounting of said vibration severity monitor therewithin.    
   
   
       2 . The die system of  claim 1 , wherein said die element is capable of use in any one of a chosen plurality of machine presses.  
   
   
       3 . The die system of  claim 1 , wherein said die element is covered by a warranty program, said vibration severity monitor being configured for generating vibration severity data for use in connection with said warranty program.  
   
   
       4 . The die system of  claim 1 , wherein said vibration severity monitor is configured for generating vibration severity data, said vibration severity monitor being configured for communicating said vibration severity data to another source in at least one of a real-time format and a historically-captured format.  
   
   
       5 . The die system of  claim 4 , wherein said vibration severity monitor includes a wireless transmitter configured for transmitting data online in a real-time format.  
   
   
       6 . The die system of  claim 1 , wherein said monitor receiving portion is one of an integral portion of said die element and a separate plate attached to said die element.  
   
   
       7 . The die system of  claim 6 , wherein said monitor receiving portion is a separate plate attached to said die element.  
   
   
       8 . The die system of  claim 7 , wherein said separate plate and an accompanying said vibration severity monitor are capable of being retrofit on an existing said die element.  
   
   
       9 . The die system of  claim 1 , wherein said vibration severity monitor is mounted in said monitor receiving portion in such a manner so as to remain with said die element throughout a die lifetime thereof.  
   
   
       10 . The die system of  claim 9 , wherein said vibration severity monitor circuit is shock mounted in said monitor receiving portion and said sensor is hard mounted.  
   
   
       11 . The die system of  claim 1 , wherein said vibration severity monitor is in the form of a computer-on-a-chip.  
   
   
       12 . The die system of  claim 1 , wherein said vibration severity monitor is operatively associated with at least one accelerometer configured for sensing an acceleration of said die element during use thereof.  
   
   
       13 . The die system of  claim 1 , wherein said vibration severity monitor is further configured for tracking a tipping moment severity of said die element.  
   
   
       14 . A machine press, comprising: 
 a first die; and    a second die operatively coupled with said first die, wherein at least one of said first die and said second die constitutes a chosen die, each said chosen die having a monitor receiving portion and a process severity monitor associated therewith, said monitor receiving portion including a monitor cavity, said process severity monitor being mounted in said monitor cavity, said process severity monitor being configured for monitoring a process severity condition of one said chosen die.    
   
   
       15 . The machine press of  claim 14 , wherein said monitor receiving portion is one of an integral portion of said one said chosen die and a separate plate attached to said one said chosen die.