Color organic EL display and method for manufacturing the same

Abstract

A color organic EL display includes: a substrate; a color filter layer disposed on the substrate; a gas barrier layer disposed on the color filter layer; and an organic EL structural body disposed on the gas barrier layer. The substrate and the color filter layer provide an underlayer of the gas barrier layer. The underlayer is a degassed underlayer. The gas barrier layer is provided by an atomic layer deposition method at a temperature equal to or lower than a decomposition starting temperature of the color filter layer.

1 . A color organic EL display comprising: 
 a substrate;    a color filter layer disposed on the substrate;    a gas barrier layer disposed on the color filter layer; and    an organic EL structural body disposed on the gas barrier layer, wherein    the substrate and the color filter layer provide an underlayer of the gas barrier layer,    the underlayer is a degassed underlayer, and    the gas barrier layer is provided by an atomic layer deposition method at a temperature equal to or lower than a decomposition starting temperature of the color filter layer.    
   
   
       2 . The display according to  claim 1 , further comprising: 
 an overcoat layer disposed between the color filter layer and the gas barrier layer so that the substrate, the color filter layer and the overcoat layer provide the underlayer of the gas barrier layer, wherein    the overcoat layer is made of organic material, and    the gas barrier layer is provided by the atomic layer deposition method at the temperature equal to or lower than a decomposition starting temperature of the overcoat layer.    
   
   
       3 . The display according to  claim 2 , wherein 
 the color filter layer and the overcoat layer are degassed by discharging water molecules at 200° C. in vacuum, and the discharged water molecules are equal to or smaller than 2×10 16  molecules per mm 3 .    
   
   
       4 . The display according to  claim 1 , wherein 
 the gas barrier layer is made of at least one material selected from the group consisting of Al 2 O 3 , TiO 2 , SiN, SiO 2 , SiON, ZrO 2 , MgO, CaO, GeO 2 , HfO 2  and ZnO.    
   
   
       5 . The display according to  claim 1 , wherein 
 the gas barrier layer has a film thickness equal to or thinner than 100 nm.    
   
   
       6 . The display according to  claim 5 , wherein 
 the gas barrier layer has a film thickness equal to or thinner than 60 nm.    
   
   
       7 . The display according to  claim 1 , wherein 
 the gas barrier layer is made of a multi-layered film including an Al 2 O 3  layer and a TiO 2  layer.    
   
   
       8 . The display according to  claim 7 , wherein 
 the Al 2 O 3  layer of the gas barrier layer has a total film thickness defined as X,    the TiO 2  layer of the gas barrier layer has a total film thickness defined as Y, and    the thicknesses of X and Y have a relationship of 37≧3×10 8 ×X+1.4×10 9 ×Y.    
   
   
       9 . The display according to  claim 1 , wherein 
 the underlayer of the gas barrier layer has a contact angle of a water drop equal to or smaller than 10 degrees.    
   
   
       10 . The display according to  claim 1 , wherein 
 the substrate is made of resin.    
   
   
       11 . The display according to  claim 1 , further comprising: 
 a SiO 2  layer, wherein    the organic EL structural body includes a transparent conductive film, and    the SiO 2  layer is disposed between the gas barrier layer and the transparent conductive film so that adhesiveness between the gas barrier layer and the transparent conductive film is increased.    
   
   
       12 . The display according to  claim 1 , wherein 
 the gas barrier layer includes a first film and a second film, which are stacked in this order,    the first film is capable of blocking gas generated from the underlayer, and    the second film has resistance to chemicals, which are used after the gas barrier layer covers the color filter layer.    
   
   
       13 . The display according to  claim 12 , wherein 
 the first film of the gas barrier layer is made of at least one material selected from the group consisting of Al 2 O 3 , TiO 2 , SiN, SiO 2 , SiON, ZrO 2 , MgO, CaO, GeO 2 , HfO 2  and ZnO.    
   
   
       14 . The display according to  claim 12 , wherein 
 the second film of the gas barrier layer is made of material, which is hardly connected to a hydroxyl group for providing hydroxide.    
   
   
       15 . The display according to  claim 14 , wherein 
 the second film of the gas barrier layer is made of at least one material selected from the group consisting of TiO 2 , SiN, SiO 2 , SiON, and Ta 2 O 5 .    
   
   
       16 . The display according to  claim 12 , wherein 
 the second film of the gas barrier layer has a thickness equal to or larger than 5 nm.    
   
   
       17 . The display according to  claim 12 , further comprising: 
 an insulation layer, wherein    the second film of the gas barrier layer has conductivity, and    the insulation layer is disposed between the second film and the organic EL structural body.    
   
   
       18 . The display according to  claim 17 , wherein 
 the insulation layer is made of at least one material selected from the group consisting of SiN, SiO 2 , SiON, Ta 2 O 5 , AlN, MgO, CaO, and GeO 2 .    
   
   
       19 . The display according to  claim 1 , wherein 
 the substrate is made of non-alkali glass.    
   
   
       20 . The display according to  claim 1 , wherein 
 the substrate includes a glass substrate and an inorganic film,    the inorganic film covers the glass substrate, and    the inorganic film includes no alkali component.    
   
   
       21 . A method for manufacturing a color organic EL display including a substrate, a color filter layer, a gas barrier layer and an organic EL structural body, which are stacked in this order, wherein the substrate and the color filter layer provide an underlayer of the gas barrier layer, the method comprising the steps of: 
 degassing the underlayer of the gas barrier layer; and    forming the gas barrier layer by an atomic layer deposition method in such a manner that a plurality of raw material gases is alternately introduced on the substrate under reduced pressure at a temperature equal to or lower than a decomposition starting temperature of the color filter layer.    
   
   
       22 . The method according to  claim 21 , further comprising: 
 forming an overcoat layer disposed between the color filter layer and the gas barrier layer so that the substrate, the color filter layer and-the overcoat layer provide the underlayer of the gas barrier layer, wherein    the overcoat layer is made of organic material, and    the gas barrier layer is formed at the temperature equal to or lower than a decomposition starting temperature of the overcoat layer.    
   
   
       23 . The method according to  claim 21 , wherein 
 the step of degassing is performed at a temperature equal to or lower than the decomposition starting temperature of the color filter layer and equal to or higher than a temperature of the substrate applied after the step of degassing.    
   
   
       24 . The method according to  claim 21 , wherein 
 the step of degassing is performed in dry atmosphere.    
   
   
       25 . The method according to  claim 22 , wherein 
 the step of degassing is performed in such a manner that the color filter layer and the overcoat layer is heated at 200° C. in vacuum, and    the step of degassing is controlled to maintain the number of degassed water molecules to be equal to or smaller than 2×10 16  molecules per mm 3 .    
   
   
       26 . The method according to  claim 21 , wherein 
 the substrate is preserved in dry atmosphere after the step of degassing and before the step of forming the gas barrier layer.    
   
   
       27 . The method according to  claim 21 , wherein 
 the gas barrier layer is formed at a temperature equal to or higher than a temperature of the substrate applied after the step of forming the gas barrier layer.    
   
   
       28 . The method according to  claim 21 , wherein 
 the gas barrier layer is made of at least one material selected from the group consisting of Al 2 O 3 , TiO 2 , SiN, SiO 2 , SiON, ZrO 2 , MgO, CaO, GeO 2 , HfO 2  and ZnO.    
   
   
       29 . The method according to  claim 21 , wherein 
 the gas barrier layer is made of a multi-layered film including an Al 2 O 3  layer and a TiO 2  layer.    
   
   
       30 . The method according to  claim 29 , wherein 
 the Al 2 O 3  layer of the gas barrier layer has a total film thickness defined as X,    the TiO 2  layer of the gas barrier layer has a total film thickness defined as Y, and    the thicknesses of X and Y have a relationship of 37≧3×10 8   ×X+1.4×10   9 ×Y    
   
   
       31 . The method according to  claim 21 , wherein 
 the underlayer of the gas barrier layer has a contact angle of a water drop equal to or smaller than 10 degrees.    
   
   
       32 . The method according to  claim 21 , wherein 
 the gas barrier layer includes a first film and a second film, which are stacked in this order,    the first film is capable of blocking gas generated from the underlayer, and    the second film has resistance to chemicals, which are used after the step of forming the gas barrier layer.    
   
   
       33 . The method according to  claim 32 , wherein 
 the first film of the gas barrier layer is made of at least one material selected from the group consisting of Al 2 O 3 , TiO 2 , SiN, SiO 2 , SiON, ZrO 2 , MgO, CaO, GeO 2 , HfO 2  and ZnO.    
   
   
       34 . The method according to  claim 32 , wherein 
 the second film of the gas barrier layer is made of at least one material selected from the group consisting of TiO 2 , SiN, SiO 2 , SiON, and Ta 2 O 5 .    
   
   
       35 . The method according to  claim 21 , wherein 
 the gas barrier layer is formed at the temperature equal to or higher than 200° C.