Apparatus for loading wafers and method for loading wafers using the same

Abstract

The present invention relates to an apparatus for loading wafers, a semiconductor manufacturing apparatus and a method for loading wafers comprising: a disk pad for supporting a wafer, the disk pad having a fixing member mounted on a front surface thereof for fixing the wafer and a hole extending therethrough; and a pusher positioned at the back of the disk pad, the pusher having a pushing member for moving the fixing member and a sensing member for sensing a contact between the disk pad and the wafer. According to the present invention, it is possible to exactly determine if a wafer is adhered closely to a disk pad by a sensor before regular processes are performed. Accordingly, an expected wafer loss during a process at an unstable wafer clamping state can be minimized or avoided. Resultantly, productivity or yield of a semiconductor chip can be improved.

1 . An apparatus for loading a wafer comprising: 
 a disk pad for supporting a wafer;    a member defining a hole mounted on a front surface of the disk pad for affixing the wafer to the disk pad; and    a pusher positioned at the back of the disk pad, the pusher having a pushing member for moving the affixing member and a sensing member for sensing contact between the disk pad and the wafer.    
     
     
         2 . The apparatus of  claim 1 , wherein the sensing member is located within the hole at a front surface of the disk pad.  
     
     
         3 . The apparatus of  claim 1 , wherein the sensing member is in the hole at a higher point than a front surface of the disk pad.  
     
     
         4 . The apparatus of  claim 1 , wherein the sensing member is a contact sensor for determining wafer loading by locating the rear surface of the wafer loaded on the front surface of the disk pad and defining the relative degree of adhesion of the rear surface of the wafer to the disk pad.  
     
     
         5 . The apparatus of  claim 1 , wherein the hole is formed at substantially the center portion of the disk pad.  
     
     
         6 . A semiconductor manufacturing apparatus comprising: 
 a rotatable disk located in a process chamber in a substantially vertical position;    a plurality of disk pads mounted on a perimeter of the disk for supporting wafers, each disk pad including a clamp for engaging the wafer and a hole formed at substantially the center portion of the wafer;    an arm for transferring the wafer to the front surface of the disk pad in a substantially vertical position; and    a pusher positioned at the back of the disk pad, the pusher having a pushing member for moving the clamp to be unclamped and a sensing member for sensing contact between the disk pad and the wafer.    
     
     
         7 . The semiconductor manufacturing apparatus of  claim 6 , wherein the sensing member is located within the hole at the front surface of the disk pad.  
     
     
         8 . The semiconductor manufacturing apparatus of  claim 6 , wherein the sensing member is located within the hole and positioned at a higher point than the front surface of the disk pad.  
     
     
         9 . The semiconductor manufacturing apparatus of  claim 6 , wherein the sensing member is a contact sensor for determining wafer loading by locating the rear surface of the wafer loaded on the front surface of the disk pad and defining the relative degree of adhesion of the rear surface of the wafer to the disk pad.  
     
     
         10 . The semiconductor manufacturing apparatus of  claim 6 , further comprising a holder positioned at the front surface of the disk for releasing the wafer from the disk pad.  
     
     
         11 . The semiconductor manufacturing apparatus of  claim 10 , wherein the holder and the pusher are symmetrically located on opposite sides of the disk.  
     
     
         12 . A wafer loading method comprising: 
 providing a wafer and a disk pad;    transferring the wafer to the disk pad;    providing a pusher;    moving the pusher toward the back of the disk pad;    loading the wafer to the disk pad; and    clamping the wafer by moving the pusher from the disk pad until the wafer is adherely engaged with the disk pad.    
     
     
         13 . The wafer loading method of  claim 12 , comprising further interlocking enaging the wafer so that it is more closely adhered to the disk pad.  
     
     
         14 . The wafer loading method of  claim 12 , which further comprises sensing contact between the disk pad and the wafer.  
     
     
         15 . The wafer loading method of  claim 12 , further comprising transferring the wafer to the front surface of the disk pad in a substantially vertical position.  
     
     
         16 . A method for loading a wafer on a front surface of the disk pad using an apparatus comprising a disk pad for supporting a wafer, the disk pad having a fixing member mounted on a front surface thereof for fixing the wafer and a hole extending therethrough; and a pusher positioned at the back of the disk pad, the pusher having a pushing member for moving the fixing member fixing and a sensing member for sensing a contact between the disk and the wafer: 
 transferring the wafer to the front surface of the disk pad;    moving the pusher toward the disk pad so that the pushing member of the pusher moves the fixing member to be unclamped, and inserting the sensing member into the hole to constitute the same surface as the front surface of the disk pad;    loading the wafer on the front surface of the disk pad; and    moving the pusher from the disk pad so that the fixing member fixes the wafer to the front surface of the disk pad, when the sensing member contacts the rear surface of the wafer.    
     
     
         17 . The method of  claim 16 , further comprising interlocking a wafer loading if the sensing member does not contact the rear surface of the wafer.  
     
     
         18 . The method of  claim 16 , comprising further interlocking enaging the wafer so that it is more closely adhered to the disk pad.  
     
     
         19 . The method of  claim 16 , which further includes the step of sensing contact between the disk pad and the wafer.  
     
     
         20 . The method of  claim 16 , further comprising transferring the wafer to the front surface of the disk pad in a substantially vertical position.