Optical or electronic module and method for its production

Abstract

One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.

1 . An optical or electronic module, comprising: 
 at least one optical or electronic component which has an operative region that facilitates an operative connection to surroundings, and    a plastic package within which the component is embedded, where the plastic package has a first region which comprises a transparent polymer compound, and a second region which comprises a non-transparent polymer compound, and where the first region extends such that it borders the operative region of the component.    
     
     
         2 . The module of  claim 1 , wherein an opening is formed in the second region and borders the first region, the operative region of the component being in operative connection with the surroundings via the first region and the opening.  
     
     
         3 . The module of  claim 1 , wherein the first region forms a light-shaping or light-guiding structure above the operative region of the component.  
     
     
         4 . The module of  claim 1 , wherein the second region laterally adjoins the first region and thereby encapsulates further components of the module with the non-transparent polymer compound.  
     
     
         5 . The module of  claim 4 , wherein the component and the first region of the plastic package are formed as a prefabricated package and are placed as such onto a carrier of the module, the subsequently provided second region of the plastic package partly enclosing the prefabricated package, but not covering the first region.  
     
     
         6 . The module of  claim 4 , further comprising a bonding interconnector at the border between the first region of the plastic package and the second region of the plastic package from which a first bonding wire extends into the first region and a second bonding wire extends into the second region.  
     
     
         7 . The module of  claim 1 , further comprising a carrier, where the optical or electronic component is arranged on a first side of the carrier and at least one further component of the module is arranged on a second side of the carrier, the second region of the plastic package encapsulating the components arranged on the second side of the carrier.  
     
     
         8 . The module of  claim 7 , wherein the second region of the plastic package partly extends onto the first side of the carrier, but does not cover the first region with the non-transparent polymer compound.  
     
     
         9 . The module of  claim 7 , wherein the optical or electronic component is arranged on the carrier via a printed circuit board with via holes.  
     
     
         10 . The module of  claim 1 , wherein the optical component comprises at least one of an optoelectronic transmitting component and an optoelectronic receiving component.  
     
     
         11 . The module of  claim 1 , wherein the electronic component comprises at least one of a pressure sensor and a temperature sensor.  
     
     
         12 . A method for producing an optical or electronic module provided with a plastic package, comprising: 
 providing at least one optical or electronic component, the component having an operative region that facilitates operative connection with surroundings of the module,    encapsulatiing the component with a first transparent polymer compound that at least borders the operative region,    encapsulating the component, the first, transparent polymer compound and, if present, further components of the module with a second, non-transparent polymer compound, and    removing at least some of the second polymer compound such that the first polymer compound is exposed allowing the component to enter into operative connection with the surroundings via the operative region.    
     
     
         13 . The method of  claim 12 , wherein, after the partial removal of the second polymer compound, a light-shaping or light-guiding structure is formed in the first polymer compound above the operative region of the component.  
     
     
         14 . The method of  claim 12 , wherein the optical or electronic component is arranged on a carrier before the encapsulation.  
     
     
         15 . A method for producing an optical or electronic module provided with a plastic package, comprising: 
 providing at least one prefabricated package having an optical or electronic component and an encapsulation of the component, where the encapsulation comprises a first, transparent polymer compound, the component having an operative region that facilites operative connection with surroundings of the module, and the encapsulation bordering at least the operative region,    arranging the prefabricated package on a carrier, and    encapsulating the package, the carrier and, if present, further components of the module with a second, non-transparent polymer compound, where the second polymer compound partly encloses the prefabricated package, but does not cover the first polymer compound of the prefabricated package.    
     
     
         16 . A method for producing an optical or electronic module provided with a plastic package, comprising: 
 providing at least one prefabricated package having an optical or electronic component and an encapsulation of the component, where the encapsulation comprises a first, transparent polymer compound, the component having an operative region that facilitates operative connection with surroundings of the module, and the encapsulation bordering at least the operative region,    arranging the prefabricated package on a carrier,    encapsulating the package, the carrier and, if present, further components of the module with a second, non-transparent polymer compound, and    removing at least some of the second polymer compound such that the first polymer compound is exposed allowing the component to enter into operative connection with the surroundings via operative region.    
     
     
         17 . The method of  claim 12 , wherein the partial removal of the second polymer compound comprises at least one of a milling process and a laser ablation process, the second polymer compound being removed down to the first, transparent polymer compound.  
     
     
         18 . A method for producing an optical or electronic module provided with a plastic package, comprising: 
 providing at least one optical or electronic component, the component having an operative region that facilitates operative connection with surroundings of the module,    encapsulating the operative region with a first, transparent polymer compound, and    encapsulating a further component of the module with a second, non-transparent polymer compound, where the first and second polymer compounds are formed in different regions of the module.    
     
     
         19 . The method of  claim 18 , where the first and second polymer compounds are formed next to each other in the module.  
     
     
         20 . The method of  claim 18 , where the optical or electronic component is located on a first side of a carrier, where at least one further component of the module is located on a second side of the carrier, and where the first and second polymer compounds are provided on different sides of the module.  
     
     
         21 . The method of  claim 20 , where the second polymer compound extends onto the first side of the carrier.  
     
     
         22 . The method of  claim 18 , where the first polymer compound and the second polymer compound are provided in a two-component injection-molding process.