Heat sink electronic components

Abstract

A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.

1 . A heat sink for an electronic component comprising: 
 a base made of a first metal material and including a heat absorbing portion which has a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of the heat absorbing portion;    a first heat dissipation member thermally coupled to the heat absorbing portion of the base and made of a second metal material; and    a second heat dissipation member thermally coupled to the heat conductive portion of the base;    wherein the first metal material differs from the second metal and has a higher heat conductivity than the second metal material.    
   
   
       2 . The heat sink as claimed in  claim 1 , wherein the first metal material is copper, and the second metal material is aluminum.  
   
   
       3 . The heat sink as claimed in  claim 1 , wherein the heat conductive portion is perpendicular to the heat absorbing portion.  
   
   
       4 . The heat sink as claimed in  claim 1 , further comprising at least a heat pipe thermally coupling the heat absorbing portion to the heat conductive portion.  
   
   
       5 . The heat sink as claimed in  claim 4 , wherein the second heat dissipation member comprises a plurality of fins perpendicular to the heat conductive portion.  
   
   
       6 . The heat sink as claimed in  claim 1 , wherein a plurality of fins for increasing heat dissipation surface is formed on the first heat dissipation member.  
   
   
       7 . The heat sink as claimed in  claim 1 , further comprising a cover body covering the second heat dissipation member.  
   
   
       8 . A heat sink for a heat generating member comprising: 
 a base comprising a heat absorbing portion having a bottom surface for contacting with the heat generating member and a heat conductive portion extending from the heat absorbing portion away from the heat generating member;    a first heat dissipation member attached to the heat absorbing portion and stretching in a plane parallel to the bottom surface of the heat absorbing portion;    at least one heat pipe embedded in the base for transferring heat from the heat absorbing portion to the heat conductive portion; and    a second heat dissipating member comprising a plurality of fins each contacting with the heat conductive portion.    
   
   
       9 . The heat sink as claimed in  claim 8 , wherein the base is made of a first metal material with a first heat conductivity, and the first heat dissipation member is made of a second metal material with a second heat conductivity higher than the first metal material.  
   
   
       10 . The heat sink as claimed in  claim 9 , wherein the first metal material is copper, and the second metal material is aluminum.  
   
   
       11 . The heat sink as claimed in  claim 8 , wherein the base has an inverted-T structure that comprises a horizontal heat absorbing portion and an erect heat conductive portion.  
   
   
       12 . The heat sink as claimed in  claim 11 , wherein the base defined at least a groove extending from the heat absorbing portion to the heat conductive portion for receiving said heat pipes.  
   
   
       13 . The heat sink as claimed in  claim 8 , wherein a plurality of fins is formed on the first heat dissipation member.  
   
   
       14 . The heat sink as claimed in  claim 8 , further comprising a cover body covering the second heat dissipation member.  
   
   
       15 . The heat sink as claimed in  claim 8 , wherein each fin of the second heat dissipation contacts with said heat pipe.  
   
   
       16 . A heat dissipation assembly for a heat generating member comprising: 
 a base disposed next to said heat generating member and having a heat absorbing portion to thermally contact with said heat generating member;    a first heat dissipation member thermally contacting with said heat absorbing portion of said base and defining a first heat dissipation area extending from said heat absorbing portion of said base; and    a second heat dissipation member thermally contacting with a portion of said base other than said heat absorbing portion and defining a second heat dissipation area extending from said portion of said base and independent from said first heat dissipation area.    
   
   
       17 . The heat dissipation assembly as claimed in  claim 16 , wherein said base is made by material different from at least one of said first and second heat dissipation member.  
   
   
       18 . The heat dissipation assembly as claimed in  claim 16 , wherein said heat absorbing portion defines a surface to contact with said heat generating member and said first dissipation area of said first dissipation member is disposed by surrounding said surface.  
   
   
       19 . The heat dissipation assembly as claimed in  claim 16 , wherein said portion of said base extends vertically from said heat absorbing portion away from said heat generating member and said second dissipation area of said second dissipation member is disposed by surrounding said portion.  
   
   
       20 . The heat dissipation assembly as claimed in  claim 16 , further comprising a heat pipe attached to said base and extending from said heat absorbing portion to said portion of said base, said heat pipe having thermal contact with said base and at least one of said first and second heat dissipation member.