Pumped fluid cooling system and method

Abstract

The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.

1 . A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising: 
 a. a heat exchanger, the heat exchanger including an interface layer coupled to the device for cooling the device; and    b. a fluid pumped through the interface layer of the heat exchanger, the fluid having an inlet temperature and an outlet temperature,    wherein the pumped fluid cooling system is configured such that the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.    
   
   
       2 . The pumped fluid cooling system as claimed in  claim 1  further comprising a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.  
   
   
       3 . The pumped fluid cooling system as claimed in  claim 2  wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m −1 .  
   
   
       4 . The pumped fluid cooling system as claimed in  claim 1  further comprising a plurality of pillars configured in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.  
   
   
       5 . The pumped fluid cooling system as claimed in  claim 4  wherein the plurality of pillars have a surface to volume ratio greater than 1000 m −1 .  
   
   
       6 . The pumped fluid cooling system as claimed in  claim 1  further comprising a microporous structure disposed on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.  
   
   
       7 . The pumped fluid cooling system as claimed in  claim 6  wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m −1 .  
   
   
       8 . The pumped fluid cooling system as claimed in  claim 1  wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.  
   
   
       9 . The pumped fluid cooling system as claimed in  claim 1  wherein the viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water.  
   
   
       10 . The pumped fluid cooling system as claimed in  claim 1  wherein the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water.  
   
   
       11 . The pumped fluid cooling system as claimed in  claim 1  wherein the fluid consists of at least 90% water by mass.  
   
   
       12 . A method of efficiently cooling a device in a pumped fluid cooling system, the method comprising: 
 a. decreasing a spread resistance between an interface layer of a heat exchanger and the device;    b. decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature;    c. increasing an advection resistance; and    d. adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity,    wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.    
   
   
       13 . The method as claimed in  claim 12  wherein the step of decreasing the convention resistance includes configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.  
   
   
       14 . The method as claimed in  claim 13  wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m −1 .  
   
   
       15 . The method as claimed in  claim 12  wherein the step of decreasing the convection resistance includes configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.  
   
   
       16 . The method as claimed in  claim 15  wherein the plurality of pillars have a surface to volume ratio greater than 1000 m −1 .  
   
   
       17 . The method as claimed in  claim 12  wherein the step of decreasing the convection resistance includes disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.  
   
   
       18 . The method as claimed in  claim 17  wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m −1 .  
   
   
       19 . The method as claimed in  claim 12  wherein the step of decreasing the spread resistance includes reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.  
   
   
       20 . The method as claimed in  claim 12  wherein the step of adjusting the composition of the fluid includes decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.  
   
   
       21 . The method as claimed in  claim 12  wherein the step of adjusting the composition of the fluid includes increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.  
   
   
       22 . The method as claimed in  claim 12  wherein the fluid consists of at least 90% water by mass.  
   
   
       23 . A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising: 
 a. means for decreasing a spread resistance between an interface layer of a heat exchanger and the device;    b. means for decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature,    c. means for increasing an advection resistance; and    d. means for adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity,    wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.    
   
   
       24 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for decreasing the convention resistance includes means for configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.  
   
   
       25 . The pumped fluid cooling system as claimed in  claim 24  wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m −1 .  
   
   
       26 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for decreasing the convection resistance includes means for configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.  
   
   
       27 . The pumped fluid cooling system as claimed in  claim 26  wherein the plurality of pillars have a surface to volume ratio greater than 1000 m −1 .  
   
   
       28 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for decreasing the convection resistance includes means for disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.  
   
   
       29 . The pumped fluid cooling system as claimed in  claim 28  wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m −1 .  
   
   
       30 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for decreasing the spread resistance includes means for reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.  
   
   
       31 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for adjusting the composition of the fluid includes means for decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.  
   
   
       32 . The pumped fluid cooling system as claimed in  claim 23  wherein the means for adjusting the composition of the fluid includes means for increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.  
   
   
       33 . The pumped fluid cooling system as claimed in  claim 23  wherein the fluid consists of at least 90% water by mass.  
   
   
       34 . An apparatus for cooling an integrated circuit, the apparatus comprising: 
 a. a heat exchanger including an interface layer coupled to the integrated circuit, wherein a first surface area of the interface layer that is coupled to the integrated circuit is less than or equal to 150% of a second surface area of the integrated circuit that is coupled to the interface layer, such that a spread resistance between the interface layer and the integrated circuit is decreased;    b. a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m −1 , such that a convection resistance is decreased; and    c. a fluid pumped through the heat exchanger, such that a flowrate of the fluid increases an advection resistance,    wherein the fluid consists of at least 90% water by mass.    
   
   
       35 . The apparatus as claimed in  claim 34  wherein the viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water.  
   
   
       36 . The apparatus as claimed in  claim 34  wherein the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water.  
   
   
       37 . A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising: 
 a. a spread resistance, wherein the spread resistance is decrease when a heat exchanger including an interface layer is coupled to the device, further wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer;    b. a convection resistance, wherein the convection resistance is decreased when a plurality of microchannels is configured in a predetermined pattern along the interface layer, and further wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 10000 m −1 ; and    c. an advection resistance, wherein the advection resistance is increased when a fluid is pumped through the heat exchanger, such that a flowrate of the fluid decreases,    wherein the fluid consists of at least 90% water by mass.    
   
   
       38 . The pumped fluid cooling system as claimed in  claim 37  wherein the fluid is water.