Electronic module with conductive polymer

Abstract

An electronic module includes a substrate, at least one surface mountable integrated circuit (IC) component and a conductive polymer. The substrate includes a plurality of electrically conductive traces formed on at least one surface of the substrate. The at least one surface mountable integrated circuit component includes a plurality of conductive pads formed on at least a first surface of the component and the conductive pads are electrically coupled to at least one of the conductive traces. The conductive polymer is in contact with at least a portion of a second surface, which is opposite the first surface, of the component and the substrate.

1 . An electronic module, comprising: 
 a substrate including a plurality of electrically conductive traces formed on at least a first surface of the substrate;    at least one surface mountable integrated circuit (IC) component including a plurality of conductive pads formed on at least a first surface of the component, wherein the plurality of conductive pads are electrically coupled to at least one of the conductive traces; and    a conductive polymer in contact with at least a portion of a second surface of the component and the substrate, wherein the second surface of the component is opposite the first surface of the component.    
   
   
       2 . The module of  claim 1 , further including: 
 an electrically non-conductive overmold material encapsulating the component, the conductive polymer and at least a portion of the substrate.    
   
   
       3 . The module of  claim 2 , wherein the overmold material is an epoxy molding compound.  
   
   
       4 . The module of  claim 1 , wherein the conductive polymer is a thermally conductive polymer.  
   
   
       5 . The module of  claim 1 , wherein the conductive polymer is an electrically conductive polymer.  
   
   
       6 . The module of  claim 1 , wherein the conductive polymer is a silver paste.  
   
   
       7 . The module of  claim 1 , wherein the substrate is one of a ceramic substrate and a printed circuit board (PCB).  
   
   
       8 . The module of  claim 1 , wherein the component is a flip-chip.  
   
   
       9 . An electronic module, comprising: 
 a substrate including a plurality of electrically conductive traces formed on at least a first surface of the substrate;    at least one surface mountable integrated circuit (IC) component including a plurality of conductive pads formed on at least a first surface of the component, wherein the plurality of conductive pads are electrically coupled to at least one of the conductive traces; and    a conductive polymer in contact with at least a portion of a second surface of the component and the substrate, wherein the second surface of the component is opposite the first surface of the component and the conductive polymer is a thermally conductive polymer.    
   
   
       10 . The module of  claim 9 , further including: 
 an electrically non-conductive overmold material encapsulating the component, the conductive polymer and at least a portion of the substrate.    
   
   
       11 . The module of  claim 9 , wherein the overmold material is an epoxy molding compound.  
   
   
       12 . The module of  claim 9 , wherein the conductive polymer is an electrically conductive polymer.  
   
   
       13 . The module of  claim 12 , wherein the conductive polymer is a silver paste.  
   
   
       14 . The module of  claim 9 , wherein the substrate is one of a ceramic substrate and a printed circuit board (PCB).  
   
   
       15 . The module of  claim 9 , wherein the component is a flip-chip.  
   
   
       16 . A method for manufacturing an electronic module, comprising the steps of: 
 providing a substrate including a plurality of electrically conductive traces formed on at least a first surface of the substrate;    providing at least one surface mountable integrated circuit (IC) component including a plurality of conductive pads formed on at least a first surface of the component;    electrically coupling one or more of the conductive pads of the component to at least one of the conductive traces; and    depositing a conductive polymer on at least a portion of the second surface of the component and the substrate.    
   
   
       17 . The method of  claim 16 , further comprising the step of: 
 encapsulating the component, the conductive polymer and at least a portion of the substrate with an electrically non-conductive overmold material.    
   
   
       18 . The method of  claim 16 , wherein the conductive polymer is at least one of a thermally conductive polymer and an electrically conductive polymer.  
   
   
       19 . The method of  claim 16 , wherein the conductive polymer is a silver paste.  
   
   
       20 . The method of  claim 16 , wherein the substrate is one of a ceramic substrate and a printed circuit board (PCB) and the component is a flip-chip.