Configurable heat sink

Abstract

Systems, methodologies, media, and other embodiments associated with a configurable heat sink are described. One exemplary system embodiment includes a base portion of a heat sink to which different accessories may be removably attached. The example system may include a first accessory like a cover that forms an assembly with the base portion of the heat sink and causes the assembly to operate in a first manner.

1 . A configurable heat sink apparatus, comprising: 
 a base having a first surface and one or more second surfaces, the first surface being configured to be positioned in contact with a heat source, the one or more second surfaces being configured with one or more apertures, and the base including a heat dissipation apparatus configured to dissipate heat from the heat source; and    one or more accessories that are removably attachable to the one or more second surfaces, the one or more accessories being configured to be positioned over at least a portion of one or more of the one or more apertures, the one or more accessories being configured to control, at least in part, the flow of one or more mediums experienced by the heat dissipation apparatus.    
   
   
       2 . The configurable heat sink apparatus of  claim 1 , the one or more accessories comprising one or more of, a cover, an air moving apparatus, and a fluid moving apparatus.  
   
   
       3 . The configurable heat sink apparatus of  claim 2 , the one or more mediums comprising one or more of, a gas, air, a liquid, water, and a solution.  
   
   
       4 . The configurable heat sink apparatus of  claim 3 , the heat source being an integrated circuit.  
   
   
       5 . The configurable heat sink apparatus of  claim 4 , where a first accessory may be removed from the configurable heat sink apparatus and replaced with a second accessory, the first and second accessories being provided with the configurable heat sink apparatus.  
   
   
       6 . A user configurable heat sink, comprising: 
 a base having a first surface and one or more second surfaces, the first surface being configured to be positioned in contact with an integrated circuit, the one or more second surfaces being configured with one or more apertures, the base including a heat dissipation apparatus configured to dissipate heat from the integrated circuit; and    one or more accessories including a cover, a fan, or a pump, that are removably attached to one or more of the one or more second surfaces, the one or more accessories being configured to be positioned over at least a portion of one or more of the one or more apertures, the one or more accessories being configurable to control, at least in part, a flow of one or more of, a gas, and a fluid in the heat dissipation apparatus.    
   
   
       7 . A multi-directional flow heat sink assembly, comprising: 
 a heat dissipation component configured to conduct heat away from a heat source to which the multi-directional flow sink assembly may be attached; and    one or more flow components configured to influence a flow of a medium in the heat dissipation component, the one or more flow components being removably attachable to the multi-directional flow heat sink assembly.    
   
   
       8 . The multi-directional flow heat sink of  claim 7 , the one or more flow components being configured to produce a flow of a medium in the heat dissipation component that is one of, an impinging flow, and a straight-through flow.  
   
   
       9 . The multi-directional flow heat sink of  claim 7 , where the one or more flow components include one or more of, a cover, and a flow generator.  
   
   
       10 . The multi-directional flow heat sink of  claim 9 , the flow generator comprising one or more of, a gas moving fan, and a fluid moving pump.  
   
   
       11 . A multi-directional flow heat sink assembly, comprising: 
 a heat dissipation component configured to conduct heat away from a an integrated circuit to which the multi-directional flow sink assembly may be attached; and    one or more of a cover, a gas moving fan, and a fluid moving pump that are removably attachable to the multi-directional flow heat sink assembly and that are configured to produce one or more of, an impinging flow in the heat dissipation component, and a straight-through flow in the heat dissipation component.    
   
   
       12 . A processor assembly, comprising: 
 a heat sink configured to be cooled by one of two or more air flows, the heat sink including a fin configured to dissipate heat; and    a control element configured to control an air flow in an area of the processor assembly containing the fin.    
   
   
       13 . The processor assembly of  claim 12 , the control element comprising one of, an air blocking element, an air directing element, and an air moving element.  
   
   
       14 . The processor assembly of  claim 13 , the air blocking element being configured to control air to flow from a passive input region, past the fin, and out a passive output region.  
   
   
       15 . The processor assembly of  claim 13 , the air moving element being configured to control air to flow from an active input region, past the fin, and out an active output region.  
   
   
       16 . The processor assembly of  claim 13 , the air directing element being configured to shape a path of an air flow in the area of the processor assembly containing the fin.  
   
   
       17 . The processor assembly of  claim 12 , the control element comprising one of a cover, a duct, and a fan.  
   
   
       18 . The processor assembly of  claim 17 , the cover being configured to control air to flow from a passive input region, past the fin, and out a passive output region.  
   
   
       19 . The processor assembly of  claim 17 , the fan being configured to control air to flow from an active input region, past the fin, and out an active output region.  
   
   
       20 . The processor assembly of  claim 17 , the duct being configured to shape a path of an air flow in the area of the processor assembly containing the fin.  
   
   
       21 . A processor assembly, comprising: 
 a heat sink configured to be cooled by a medium flowing in one of two or more configurations; and    an apparatus configured to affect the flow configuration of the medium, the apparatus being attached to the heat sink, the apparatus being configurable to take on an open, active state and a closed, inactive state.    
   
   
       22 . The processor assembly of  claim 21 , the apparatus being configurable to take on the open, active state when a cover associated with the apparatus is at least partially open.  
   
   
       23 . The processor assembly of  claim 22 , the heat sink experiencing an impinging flow configuration when the apparatus is configured in the open, active state.  
   
   
       24 . The processor assembly of  claim 21 , the apparatus being configurable to take on the closed, inactive state when a cover associated with the apparatus is closed.  
   
   
       25 . The processor assembly of  claim 24 , the heat sink experiencing a straight-through flow configuration when the apparatus is configured in the closed, inactive state.  
   
   
       26 . The processor assembly of  claim 21 , the medium being a gas.  
   
   
       27 . The processor assembly of  claim 21 , the medium being a fluid.  
   
   
       28 . A heat dissipation apparatus, comprising: 
 a heat sink configured to be cooled by one of two or more air flows; and    a fan attached to the heat sink, the fan being configurable to take on an open, active state and a closed, inactive state, where the fan is configured to take on the open, active state when a cover attached to the fan is in an open position, and where the fan is configured to take on the closed, inactive state when the cover is in a closed position; and    where the heat sink is cooled by an impinging air flow when the fan is configured in the open, active state and the heat sink is cooled by a straight-through air flow when the fan is configured in the closed, inactive state.    
   
   
       29 . A computer executable method, comprising: 
 identifying a heat source for which heat dissipation is desired;    producing a heat sink assembly configured to provide heat dissipation for the heat source, where the heat sink assembly includes a configurable heat sink and two or more accessories that are removably attachable to the heat sink assembly; and    providing the heat sink assembly as a single part.    
   
   
       30 . The method of  claim 29 , including: 
 determining a range of heat dissipation requirements for the heat source; and    selecting the two or more accessories based, at least in part, on the range of heat dissipation requirements for the heat source.    
   
   
       31 . The method of  claim 29 , where providing the heat sink assembly as a single part includes one or more of, packaging the heat sink and the two or more accessories in a single package, warehousing the heat sink and the two or more accessories under a single picking number, and inventorying the heat sink and the two or more accessories under a single inventory number.  
   
   
       32 . A system, comprising: 
 means for dissipating heat from an integrated circuit;    first means for altering an airflow through the means for dissipating heat, where the first means are swappable with second means for altering the airflow through the means for dissipating heat; and    means for removably attaching the first and second means for altering the airflow to the means for dissipating heat.    
   
   
       33 . A method for removing heat from a heat source, comprising: 
 providing a configurable heat sink assembly having an interface surface, a heat dissipation apparatus, and one or more accessories configurable to control an air flow in the area of the heat dissipation apparatus;    configuring the configurable heat sink assembly by manipulating one or more of the one or more accessories;    contacting the heat source with the interface surface; and    causing a first air flow in the area of the heat dissipation apparatus, where the first air flow is controlled, at least in part, by the one or more accessories.    
   
   
       34 . The method of  claim 33 , including: 
 reconfiguring the configurable heat sink assembly by manipulating one or more of the one or more accessories; and    causing a second air flow in the area of the heat dissipation apparatus, where the second air flow is controlled, at least in part, by the one or more accessories.