Methods and apparatuses for electronics cooling

Abstract

Methods and apparatuses for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger. At least two configurations are disclosed: one with a pump and another without a pump.

1 . An apparatus for cooling a device comprising: 
 (a) a fluid near or above its critical pressure;    (b) at least one heat exchanger;    (c) a pump for circulation of the fluid; and    (d) a fluid connection between the heat exchanger and the pump.    
   
   
       2 . The apparatus as in  claim 1 , wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.  
   
   
       3 . The apparatus as in  claim 1 , wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.  
   
   
       4 . The apparatus as in  claim 1 , wherein the pump utilizes electrical, electromechanical, mechanical or magnetic means of fluid flow.  
   
   
       5 . The apparatus as in  claim 4 , wherein the actuation of the pump is selected from the group consisting of electrohydrodynamic, magnetic and electromechanical actuations.  
   
   
       6 . The apparatus as in  claim 1 , wherein the at least one heat exchanger is of microchannel type.  
   
   
       7 . The apparatus as in  claim 1 , wherein an absence of lubricants increases performance of the apparatus.  
   
   
       8 . The apparatus as in  claim 1 , further comprising control by software, hardware or other method.  
   
   
       9 . The apparatus as in  claim 1 , further comprising at least one sensor to monitor and control temperature and temperature-related phenomena.  
   
   
       10 . The apparatus as in  claim 1 , wherein power is derived from a public power network of the device.  
   
   
       11 . The apparatus as in  claim 1 , wherein power is derived from an independent source.  
   
   
       12 . The apparatus as in  claim 1 , wherein the at least one heat exchanger and the pump are contained in the apparatus package.  
   
   
       13 . The apparatus as in  claim 12 , further comprising at least one heat exchanger that is external to the apparatus package.  
   
   
       14 . The apparatus as in  claim 13 , wherein the external heat exchanger is connected to the apparatus by a fluidic connection.  
   
   
       15 . The apparatus as in any one of claims  12 - 14 , wherein the heat exchanger is integrated into a package of the device.  
   
   
       16 . The apparatus as in  claim 15 , wherein the external heat exchanger is in thermal contact with the device.  
   
   
       17 . The apparatus as in  claim 1 , wherein the fluid comprises thermally conductive nanoparticles to increase cooling performance.  
   
   
       18 . The apparatus as in  claim 1 , further comprising an additional effect selected from the group consisting of electrohydrodynamic and magnetic effect to increase cooling performance.  
   
   
       19 . An apparatus for cooling a device comprising: 
 (a) a fluid near or above its critical pressure;    (b) at least two heat exchangers; and    (c) a fluid connection between the heat exchangers.    
   
   
       20 . The apparatus as in  claim 19 , wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.  
   
   
       21 . The apparatus as in  claim 19 , wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.  
   
   
       22 . The apparatus as in  claim 19 , wherein the at least one heat exchanger is of microchannel type.  
   
   
       23 . The apparatus as in  claim 19 , further comprising a control by software, hardware or other method.  
   
   
       24 . The apparatus as in  claim 19 , further comprising a sensor to monitor and control temperature and temperature-related phenomena.  
   
   
       25 . The apparatus as in  claim 19 , wherein the at least one heat exchanger is contained in the apparatus package.  
   
   
       26 . The apparatus as in  claim 25 , further comprising at least one heat exchanger external to the apparatus package.  
   
   
       27 . The apparatus as in  claim 26 , wherein the external heat exchanger is connected to the apparatus by a fluidic connection.  
   
   
       28 . The apparatus as in any one of claims  25 - 27 , wherein the heat exchanger is integrated into the package of the device.  
   
   
       29 . The apparatus as in  claim 28 , wherein the external heat exchanger is in thermal contact with the device.  
   
   
       30 . The apparatus as in  claim 19 , wherein a density difference is maintained between at least two heat exchangers.  
   
   
       31 . The apparatus as in  claim 19 , wherein the fluid comprises thermally conductive nanoparticles to increase cooling performance.  
   
   
       32 . The apparatus as in  claim 19 , further comprising an additional effect selected from the group consisting of electrohydrodynamic and magnetic effect to increase cooling performance.  
   
   
       33 . A method of cooling a device, the method comprising: 
 (a) providing a fluid near or above its critical pressure;    (b) transferring heat from the device to the fluid;    (c) transferring heat from the fluid to an external environment; and    (d) providing a pump for fluid flow.    
   
   
       34 . The method as in  claim 33 , wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.  
   
   
       35 . The method as in  claim 33 , wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.  
   
   
       36 . The method as in  claim 33 , wherein the pump utilizes an electrical, electromechanical, mechanical or magnetic means for fluid flow.  
   
   
       37 . The method as in  claim 33 , wherein the actuation of the pump is selected from the group consisting of electrohydrodynamic, magnetic and electromechanical actuations.  
   
   
       38 . The method as in  claim 33 , wherein an absence of lubricants increases the performance of the apparatus.  
   
   
       39 . The method as in  claim 33 , further providing a control by software, hardware or other method.  
   
   
       40 . The method as in  claim 33 , further providing at least one sensor to monitor and control temperature and temperature-related phenomena.  
   
   
       41 . The method as in  claim 33 , further providing power from a public power network of the device.  
   
   
       42 . The method as in  claim 33 , further providing power from an independent source.  
   
   
       43 . The method as in  claim 33 , further adding thermally conductive nanoparticles to the fluid to increase cooling performance.  
   
   
       44 . The method as in  claim 33 , further adding an electrohydrodynamic or magnetic effect to increase cooling performance.  
   
   
       45 . A method for cooling a device comprising 
 (a) providing a fluid near or above its critical pressure;    (b) transferring heat from the device to the fluid; and    (c) transferring heat from the fluid to an external environment.    
   
   
       46 . The method as in  claim 45 , wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.  
   
   
       47 . The method as in  claim 45 , wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.  
   
   
       48 . The method as in  claim 45 , further providing a control by software, hardware or other method.  
   
   
       49 . The method as in  claim 45 , further providing at least one sensor to monitor and control temperature and temperature-related phenomena.  
   
   
       50 . The method as in  claim 45 , further providing an addition of thermally conductive nanoparticles to the fluid to increase cooling performance.  
   
   
       51 . The method as in  claim 45 , further providing an addition of an electrohydrodynamic or magnetic effect to increase cooling performance.  
   
   
       52 . The method as in  claim 33  or  claim 45  wherein, nanomaterials with high heat capacity are added to the fluid to reduce the fluid flow rate.  
   
   
       53 . The apparatus as in  claim 1  or  claim 19  wherein, nanomaterials with high heat capacity are added to the fluid to reduce the fluid flow rate.  
   
   
       54 . The method as in  claim 33  or  claim 45  wherein the fluid is a high thermal conducting fluid.  
   
   
       55 . The apparatus as in  claim 1  or  claim 19  wherein the fluid is a high thermal conducting fluid.  
   
   
       56 . The method as in  claim 39  or  claim 48  wherein the control software and hardware are integrated with the device.  
   
   
       57 . The apparatus as in  claim 8  or  claim 23  wherein the control software and hardware are integrated with the device.  
   
   
       58 . A method of removing heat from a printed circuit boards consisting of: 
 (a) Impelling means to impel a fluid;    (b) At least one heat exchanger for transferring heat from the heat-transfer fluid to an external environment;    (c) At least one heat exchanger for accepting heat to the heat-transfer fluid from within a printed circuit board;    (d) A closed loop connecting a-c.    
   
   
       59 . An apparatus for removing heat from a printed circuit board consisting of: 
 (a) A mechanism to impel a fluid;    (b) At least one heat exchanger for rejecting heat;    (c) At least one heat exchanger that accepts heat laminated to a printed circuit board;    (d) Fluid connections among a-c.    
   
   
       60 . The apparatus as in  claim 59  wherein the heat-accepting heat exchanger incorporates microchannels of a depth of less than 500 micro meters.  
   
   
       61 . The apparatus as described in  claim 59  wherein the heat exchanger that accepts heat is formed from materials from the group consisting of metallic, ceramic, polymeric or a combination thereof.  
   
   
       62 . The apparatus as described in  claim 59  wherein the fluid is chosen from the group consisting of water, carbon dioxide, ammonia, sulfur dioxide, chlorofluorocarbon, hydrofluorocarbon, hydrocarbon or combination thereof.  
   
   
       63 . The apparatus as described in  claim 59  wherein the impelling means is a pump.  
   
   
       64 . The apparatus as described in  claim 59  wherein the impelling means is a compressor.  
   
   
       65 . The apparatus as described in  claim 59  wherein heat is removed from multiple sources on the printed circuit board.  
   
   
       66 . The apparatus as described in  claim 59  wherein the printed circuit board has thermal vias.