Receptacles for inkjet deposited PLED/OLED devices and method of making the same

Abstract

Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.

1 . A system for providing an electronic display assembly, comprising: 
 a substrate;    at least one receptacle structure disposed over the substrate, the receptacle structure being formed by employing a shadow mask aligned with a surface of the substrate; and    a light-emissive material contained in the receptacle structure.    
     
     
         2 . The system of  claim 1 , wherein the receptacle structure has a predetermined configuration that allows a predetermined volume of a light-emissive material to be contained within the receptacle structure.  
     
     
         3 . The system of  claim 1 , wherein the receptacle structure comprises a plurality of cross segments disposed on a grid over the substrate, and a plurality of connecting segments for interconnecting the cross segments.  
     
     
         4 . The system of  claim 1 , wherein the light-emissive material is an inkjet deposited light-emissive material.  
     
     
         5 . The system of  claim 1 , further comprising at least one electrode disposed on the substrate and under the receptacle structure.  
     
     
         6 . An electronic display assembly, comprising: 
 a substrate;    an electrode formed on the substrate;    a plurality of receptacles provided over the substrate, the receptacles being formed by employing deposition of material through a shadow mask aligned with a surface of the substrate; and    an emissive medium provided within the plurality of receptacles formed by employing deposition through the shadow mask.    
     
     
         7 . The electronic display assembly of  claim 6 , wherein the emissive medium forms an active display element.  
     
     
         8 . The electronic display assembly of  claim 7 , wherein the active display element is a light-emitting device.  
     
     
         9 . An organic light-emitting diode, comprising: 
 a substrate;    an electrode formed on the substrate;    at least one receptacle provided over the substrate, the at least one receptacle being formed by employing deposition of material through a shadow mask aligned with a surface of the substrate; and    a light emissive polymer provided within the at least one receptacle formed by employing deposition through the shadow mask.    
     
     
         10 . A receptacle structure for containing a light-emissive material of a light-emitting display, the receptacle structure being formed by a process comprising the steps of: 
 employing a first shadow mask provided in a first deposition vacuum vessel to deposit a first material over a substrate and to thereby form a plurality of cross segments; and    employing a second shadow mask provided in a second deposition vacuum vessel to deposit a second material over the substrate and to thereby form a plurality of connecting segments for connecting the plurality of cross segments.    
     
     
         11 . A method of forming an electronic device, comprising the steps of: 
 providing a substrate having at least one electrode formed thereon;    aligning at least one shadow mask with a surface of the substrate; and    forming at least one receptacle structure on the surface of the substrate using the shadow mask.    
     
     
         12 . The method of  claim 11 , wherein the step of forming the receptacle structure on the surface of the substrate further comprises the steps of: 
 advancing the substrate through a plurality of deposition vacuum vessels, each deposition vacuum vessel having at least one material deposition source and a shadow mask position therein; and    depositing on the surface of the substrate the material from the material deposition source through the shadow mask to form on the surface of the substrate the receptacle structure.    
     
     
         13 . The method of  claim 11  further comprising the step of providing a light-emissive material within the receptacle structure by inkjet deposition.  
     
     
         14 . A method of forming a light-emitting display, comprising the steps of: 
 providing a substrate having at least one electrode formed thereon;    using a first shadow mask and a second shadow mask to form at least one receptacle on the surface of the substrate; and    inkjet depositing a light-emissive material within the receptacle.    
     
     
         15 . The method of  claim 14 , wherein the step of using the first shadow mask and the second shadow mask further comprises the steps of: 
 advancing the substrate through first and second deposition vacuum vessels, the first deposition vacuum vessel having a first material deposition source and the first shadow mask positioned therein, and the second deposition vacuum vessel having a second material deposition source and the second shadow mask positioned therein; and    depositing on the surface of the substrate the first material from the first material deposition source through the first shadow mask to form on the surface of the substrate a first pattern of segments of the receptacle.    
     
     
         16 . The method of  claim 15  further comprising the step of depositing on the surface of the substrate the second material from the second material deposition source through the second shadow mask to form on the surface of the substrate a second pattern of segments of the receptacle.  
     
     
         17 . The method of  claim 16 , wherein the first pattern of segments corresponds to a plurality of cross segments provided on the surface of the substrate, and wherein the second pattern of segments corresponds to a plurality of interconnects for interconnecting the plurality of cross segments.