Fluidized bed cooler for electronic components

Abstract

A fluidized bed cooler comprises a blower and a heatsink with a base and heat exchanging means. The blower comprises an electric drive with a stator and a rotor, an impeller and a casing with blower inlet and outlet. The base made as a heat spreader with a plate and provides a thermal contact with the electronic components and the heat exchanging means. The heat exchanging means are surrounded by a housing thus forms a fluidized bed chamber with inflow and outflow side openings. The fluidized bed chamber partially filled up with particulate solids and covered from both openings by intake and outtake grilled structures. The blower hydraulically connected by the inlet with the outflow side opening, so cooling gas flows through the inflow side opening, the fluidized bed chamber thus fluidizing the particulate solids, the outflow side opening, the blower inlet, the impeller and the blower outlet.

1 . A fluidized bed cooler for electronic components comprising: 
 a blower and a heatsink comprising a base and heat exchanging means, wherein    (i) said blower comprising an electric drive with a stator and a magnetized rotor, an impeller and a casing with blower inlet and outlet;    (ii) said base being made as a heat spreader with a plate and providing a thermal contact with said electronic components and said heat exchanging means;    (iii) said heat exchanging means being surrounded by a housing thus forming a fluidized bed chamber with inflow and outflow side openings;    (iv) said fluidized bed chamber partially being filled up with particulate solids and being covered from said both openings by intake and outtake grilled structures;    (v) said blower hydraulically connected by said inlet with said outflow side opening, so cooling gas flows through said inflow side opening, said fluidized bed chamber thus fluidizing said particulate solids, said outflow side opening, said blower inlet, said impeller and said blower outlet in a series way.    
   
   
       2 . The fluidized bed cooler as claimed in  claim 1 , wherein said heat exchanging means being spacing apart from each other at a distance of at least 20 mean sizes of said particulate solids.  
   
   
       3 . The fluidized bed cooler as claimed in  claim 1 , wherein said heat exchanging means being made as parallel vertical located fins surrounding by a box-shaped housing.  
   
   
       4 . The fluidized bed cooler as claimed in  claim 3 , wherein said plate being located horizontally at a bottom part of said cooler thus serving for horizontal located electronic components.  
   
   
       5 . The fluidized bed cooler as claimed in  claim 3 , wherein said plate being located vertically at a side part of said cooler thus serving for vertical located electronic components.  
   
   
       6 . The fluidized bed cooler as claimed in  claim 1 , wherein said heat exchanging means being made as radial vertical located fins surrounding by a cylinder-shaped housing.  
   
   
       7 . The fluidized bed cooler as claimed in  claim 6 , wherein said plate being located horizontally at a bottom part of said cooler thus serving for horizontal located electronic components.  
   
   
       8 . The fluidized bed cooler as claimed in  claim 6 , wherein said plate being located vertically at a side part of said cooler thus serving for vertical located electronic components.  
   
   
       9 . The fluidized bed cooler as claimed in  claim 1 , wherein said heat exchanging means and said housing further comprising electromagnetic coils creating an alternating motive electromagnetic field and said particulate solids being made from magnetizable material thus said particulate solids realizing a recirculation motion inside said fluidized bed chamber.