Method and system for packaging MEMS devices with incorporated getter

Abstract

Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

1 . A microelectromechanical system (MEMS) device package, comprising: 
 a substrate;    a MEMS device formed on said substrate;    a backplane; and    a seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said seal comprises a chemically reactant getter.    
     
     
         2 . The MEMS system of  claim 1 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.  
     
     
         3 . The MEMS system of  claim 1 , wherein said seal comprises an adhesive.  
     
     
         4 . The MEMS system of  claim 1 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.  
     
     
         5 . A microelectromechanical system (MEMS) device package, comprising: 
 a substrate;    a MEMS device formed on said substrate;    a backplane;    a primary seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said primary seal includes a getter; and    a secondary seal positioned proximate said primary seal at an outer periphery.    
     
     
         6 . The MEMS device package of  claim 5 , wherein said secondary seal comprises a hydrophobic material.  
     
     
         7 . The MEMS device package of  claim 5 , wherein said getter comprises a desiccant.  
     
     
         8 . The MEMS device package of  claim 5 , wherein said primary seal comprises an adhesive.  
     
     
         9 . A microelectromechanical system (MEMS) device package, comprising: 
 a substrate;    a MEMS device formed on said substrate;    a backplane;    a seal positioned around a periphery of said MEMS device and in contact with said substrate and said backplane; and    a getter positioned proximate said seal at an inner periphery.    
     
     
         10 . The MEMS device package of  claim 9 , wherein said seal comprises at least one of a metal and an adhesive.  
     
     
         11 . The MEMS device package of  claim 9 , wherein said getter comprises a desiccant.  
     
     
         12 . The MEMS device package of  claim 9 , wherein said getter is positioned in contact with said seal.  
     
     
         13 . A method of sealing a microelectromechanical system (MEMS) device package, comprising: 
 forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and    attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.    
     
     
         14 . The method of  claim 13 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.  
     
     
         15 . The method of  claim 13 , wherein said seal comprises an adhesive.  
     
     
         16 . The method of  claim 13 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.  
     
     
         17 . A microelectromechanical system (MEMS) device package produced by the method comprising: 
 forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and    attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.    
     
     
         18 . The MEMS device package of  claim 17 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.  
     
     
         19 . The MEMS device package of  claim 17 , wherein said seal comprises an adhesive.  
     
     
         20 . The MEMS device package of  claim 17 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.  
     
     
         21 . A system for sealing a microelectromechanical system (MEMS) device package, comprising: 
 means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant desiccant; and    means for attaching said substrate, said seal, and said backplane to thereby encapsulate said MEMS device.    
     
     
         22 . The system of  claim 21 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.  
     
     
         23 . The system of  claim 21 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.  
     
     
         24 . A method of sealing a microelectromechanical system (MEMS) device package, comprising: 
 forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;    attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and    forming a secondary seal proximate said primary seal at an outer periphery.    
     
     
         25 . The method of  claim 24 , wherein said secondary seal comprises a hydrophobic material.  
     
     
         26 . The method of  claim 24 , wherein said getter comprises a desiccant.  
     
     
         27 . The method of  claim 24 , wherein said primary seal comprises an adhesive.  
     
     
         28 . A microelectromechanical system (MEMS) device package produced by the method comprising: 
 forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;    attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and    forming a secondary seal proximate said primary seal at an outer periphery.    
     
     
         29 . The MEMS device package of  claim 28 , wherein said secondary seal comprises a hydrophobic material.  
     
     
         30 . The MEMS device package of  claim 28 , wherein said getter comprises a desiccant.  
     
     
         31 . The MEMS device package of  claim 28 , wherein said primary seal comprises an adhesive.  
     
     
         32 . A system for sealing a microelectromechanical system (MEMS) device package, comprising: 
 means for forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;    means for attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and    means for forming a secondary seal proximate said primary seal at an outer periphery.    
     
     
         33 . The system of  claim 32 , wherein said secondary seal comprises a hydrophobic material.  
     
     
         34 . The system of  claim 32 , wherein said getter comprises a desiccant.  
     
     
         35 . A method of sealing a microelectromechanical system (MEMS) device package, comprising: 
 forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;    forming a getter positioned proximate said seal at an inner periphery; and    attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.    
     
     
         36 . The method of  claim 35 , wherein said seal comprises at least one of a metal and an adhesive.  
     
     
         37 . The method of  claim 35 , wherein said getter comprises a desiccant.  
     
     
         38 . The method of  claim 35 , wherein said getter is positioned in contact with said seal.  
     
     
         39 . A microelectromechanical system (MEMS) device package produced by the method comprising: 
 forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;    forming a getter positioned proximate said seal at an inner periphery; and    attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.    
     
     
         40 . The MEMS device package of  claim 39 , wherein said seal comprises at least one of a metal and an adhesive.  
     
     
         41 . The MEMS device package of  claim 39 , wherein said getter comprises a desiccant.  
     
     
         42 . The MEMS device package of  claim 39 , wherein said getter is positioned in contact with said seal.  
     
     
         43 . A system for sealing a microelectromechanical system (MEMS) device package, comprising: 
 means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;    means for forming a getter positioned proximate said seal at an inner periphery; and    means for attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.    
     
     
         44 . The system of  claim 43 , wherein said seal comprises at least one of a metal and an adhesive.  
     
     
         45 . The system of  claim 43 , wherein said getter comprises a desiccant.