Transparent member, optical device using transparent member and method of manufacturing optical device

Abstract

In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.

1 . A transparent member used for the purpose of protecting a chip in an optical device including a substrate and said chip as an optical element mounted to said substrate, wherein 
 said transparent member has a rectangular shape in plan view and is formed by dividing one integral molded body along phantom lines in a grid pattern.    
   
   
       2 . An optical device comprising a substrate, a chip as an optical element mounted to said substrate, a protecting member provided on said substrate so as to surround said chip and a transparent member attached to a top surface of said protecting member, wherein 
 said transparent member has a rectangular shape in plan view and is formed by dividing one integral mold body along phantom lines in a grid pattern.    
   
   
       3 . The optical device according to  claim 2 , wherein said optical device is formed by dividing an intermediate body along said phantom lines in a grid pattern, 
 said intermediate body including    a whole substrate having a plurality of regions corresponding to a plurality of substrates,    a plurality of chips mounted to said plurality of regions, respectively, sectioned by said phantom lines in a grid pattern,    a whole protecting member integrally provided on said whole substrate and having a plurality of protecting members corresponding to said plurality of regions, respectively, and    said one molded body attached to a top surface of said whole protecting member and having a plurality of transparent members.    
   
   
       4 . An optical device comprising a substrate, a chip as an optical element mounted to said substrate and a sealing member with transparency provided at said substrate for the purpose of sealing said chip, wherein 
 said optical device is formed by dividing an immediate body along phantom lines in a grid pattern, and wherein    said intermediate body comprises    a whole substrate having a plurality of regions sectioned by the phantom lines in the grid pattern to correspond to a plurality of substrates, respectively,    a plurality of chips mounted to said plurality of regions, respectively,    a whole sealing member having a plurality of sealing members corresponding to said plurality of regions, respectively, and integrally provided on said whole substrate.    
   
   
       5 . A method of manufacturing an optical device, comprising the steps of: 
 mounting a chip as an optical element to a substrate;    fixing a protecting member to said substrate so as to surround said chip; and    attaching a transparent member to a top surface of said protecting member, wherein    said step of attaching said transparent member includes the steps of    molding one molded body having a plurality of transparent members, one of said plurality of transparent members being arranged at a corresponding one of a plurality of regions sectioned by phantom lines in a grid pattern; and    dividing said one molded body along said phantom lines to form each of said plurality of transparent members.    
   
   
       6 . The method of manufacturing the optical device according to  claim 5 , wherein 
 said one molded body comprises a double-faced sheet having a base material, a temporary adhesive layer attached to one side of said base material and an actual adhesive layer attached to the other side of said base material and to said transparent member, and is cut along said phantom lines with said temporary adhesive layer temporarily fixed to another member;    after said plurality of transparent members are formed, each of said plurality of transparent members is removed from said base material; and    said transparent member is then bonded to the top surface of said protecting member by said actual adhesive layer.    
   
   
       7 . A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate, a protecting member provided at said substrate so as to surround said chip and a transparent member attached to a top surface of said protecting member, comprising the steps of: 
 preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;    mounting a plurality of chips to said plurality of regions, respectively;    integrally attaching a whole protecting member having a plurality of protecting members to said whole substrate;    forming one intermediate body by attaching one molded body to a top surface of said whole protecting member, said one molded body having a plurality of transparent members arranged at the plurality of regions, respectively, sectioned by said phantom lines in a grid pattern; and    dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said protecting member, said transparent member and said chip.    
   
   
       8 . A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate and a sealing member with transparency provided at said substrate for the purpose of sealing said chip, comprising the steps of: 
 preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;    mounting a plurality of chips to said plurality of regions, respectively;    forming one intermediate body by integrally providing a whole sealing member having a plurality of sealing members at said whole substrate; and    dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said sealing member and said chip.