Thermal processing apparatus and thermal processing method

Abstract

A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor wafer and the light source is so adjusted as to attain predetermined intensity of irradiation. The distance of irradiation between the thermal diffuser and the hot plate and the light source can be changed or corrected by vertically moving the thermal diffuser and the hot plate. The thermal processing apparatus which uses the flash lamps, is thus capable of readily controlling the intensity of irradiation.

1 .- 14 . (canceled)  
   
   
       15 . A thermal processing method of irradiating a substrate with a flash thereby heating said substrate, comprising steps of: 
 preheating said substrate held by a holding element for holding said substrate with an assist-heating mechanism provided in said holding element;    adjusting the distance of irradiation between said holding element holding said substrate and a light source having a plurality of flash lamps; and    irradiating said substrate held by said holding element with said flash emitted from said light source.    
   
   
       16 . The thermal processing method according to  claim 15 , adjusting the position of said holding element holding said substrate.  
   
   
       17 . The thermal processing method according to  claim 16 , adjusting the position of said holding element to attain a distance of irradiation corresponding to predetermined intensity of irradiation on the basis of a correlation table associating the intensity of irradiation on the surface of said substrate irradiated with said flash emitted from said light source and the distance of irradiation with each other.  
   
   
       18 . The thermal processing method according to  claim 15 , adjusting the position of said light source.  
   
   
       19 . The thermal processing method according to  claim 18 , adjusting the position of said light source to attain a distance of irradiation corresponding to predetermined intensity of irradiation on the basis of a correlation table associating the intensity of irradiation on the surface of said substrate irradiated with said flash emitted from said light source and the distance of irradiation with each other.