Wafer chuck

Abstract

The influence of the slurry generated when polishing an orientation notch and the like is minimized. The holding members 10, 20 for holding the outer periphery of the wafer W and the driving mechanism 30 for driving the holding members 10, 20 all together in the closing direction are integrally combined.

1 . A wafer chuck comprising a plurality of holding members for pushing an outer periphery of a wafer in a radial direction and holding the wafer, and a driving mechanism for driving the holding members all together in a closing direction.  
   
   
       2 . The wafer chuck as claimed in  claim 1 , wherein each holding member is configured so as to hold the wafer by way of an elastic member.  
   
   
       3 . The wafer chuck as claimed in  claim 2 , wherein the elastic member is formed with a V-shaped groove for sandwiching the outer peripheral part of the wafer in a snapping manner.  
   
   
       4 . The wafer chuck as claimed in  claim 3 , wherein the V-shaped groove of the elastic member is formed into a circular arc shape so as to lie along the circumferential direction of the outer peripheral edge of the wafer.  
   
   
       5 . The wafer chuck as claimed in  claim 3 , wherein the elastic member further includes a guide groove having an apex angle greater than the apex angle of the V-shaped groove on an opening direction side of the V-shaped groove.  
   
   
       6 . The wafer chuck as claimed in  claim 2 , wherein the elastic member is made of fluorocarbon resin or fluorocarbon rubber molded article.  
   
   
       7 . The wafer chuck as claimed in  claim 1 , wherein the holding member is arranged on both sides in the radial direction of the wafer with the wafer sandwiched in between; and 
 the driving mechanism includes cylinders arranged in the radial direction of the wafer and connected to one of the holding members, and an interlocking mechanism for operating the other holding member in conjunction with the operation of the former holding means.    
   
   
       8 . The wafer chuck as claimed in  claim 1 , wherein the holding member is arranged on both sides in the radial direction of the wafer with the wafer sandwiched in between; and 
 the driving mechanism, feed screws arranged in the radial direction of the wafer and having screw parts in the direction opposite to each other in order to screw each screw part to the holding member, and a motor for rotating the feed screw may be arranged.    
   
   
       9 . The wafer chuck as claimed in  claim 7 , wherein a machining tool forward/backward path for approaching the wafer at a position orthogonal to the wafer and machining the outer peripheral edge of the wafer is formed on one of the holding members arranged on both sides in the radial direction of the wafer.  
   
   
       10 . The wafer chuck as claimed in  claim 1 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.  
   
   
       11 . The wafer chuck as claimed in  claim 8 , wherein a machining tool forward/backward path for approaching the wafer at a position orthogonal to the wafer and machining the outer peripheral edge of the wafer is formed on one of the holding members arranged on both sides in the radial direction of the wafer.  
   
   
       12 . The wafer chuck as claimed in  claim 2 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.  
   
   
       13 . The wafer chuck as claimed in  claim 3 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.  
   
   
       14 . The wafer chuck as claimed in  claim 4 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.  
   
   
       15 . The wafer chuck as claimed in  claim 5 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.  
   
   
       16 . The wafer chuck as claimed in  claim 6 , being used for polishing the V-notch or Orientation flat for determining the orientation of the wafer.