Method for manufacturing heat sink devices

Abstract

A method for manufacturing heat sink device mainly comprises steps of: positioning a plurality of heat-sinking fins by a holding member after they are arranged and assembled; casting a metallic solution into a die for forming a base; locating lower ends of the heat-sinking fins into the metallic solution; and cooling the metallic solution to form a base which is integrated with the lower ends of the heat-sinking fins. The method can be applied to manufacturing heat sink devices for computers, electronic and machinery devices on which the heat would be accumulated.

1 . (canceled)  
   
   
       2 . (canceled)  
   
   
       3 . A method for manufacturing heat sink devices, comprising the steps of: 
 a. assembling, arranging and positioning a plurality of heat-sinking fins with a holding member after they are assembled and arranged;    b. providing a die and locating said plurality of heat-sinking fins to have lower ends of the heat-sinking fins in the die;    c. melting the lower ends of the plurality of heat-sinking fins to form a metallic solution in the die; and    d. forming a base integrally with the heat-sinking fins by cooling the metallic solution in the die.    
   
   
       4 . The method as claimed in  claim 3 , wherein the die is a box having a receiving chamber therewith, and the base is formed by the metallic solution cooling therein.  
   
   
       5 . (canceled)