Immersion cooling apparatus

Abstract

A device for cooling a heat-dissipating component comprising a body having at least one sidewall, an enclosed volume, an expansion volume, a quantity of heat transfer fluid disposed within the enclosed volume, and means for releasing the heat transfer fluid from the enclosed volume to the expansion volume. Upon release into the expansion volume, the heat transfer fluid can contact the heat-dissipating device.

1 . An article for cooling a heat-dissipating component comprising: 
 a body comprising at least one sidewall and a breachable seal cooperating to define an enclosed volume, said breachable seal having an inner surface proximate said enclosed volume and an outer surface; and    a quantity of heat transfer fluid disposed within said enclosed volume.    
   
   
       2 . The article of  claim 1  wherein said heat transfer fluid comprises at least one of a perfluorocarbon, hydrofluorocarbon, hydrofluoroether, and perfluoroketone.  
   
   
       3 . The article of  claim 1  wherein said breachable seal comprises at least one of a polymer film, a metal foil, and a multilayer barrier film.  
   
   
       4 . The article of  claim 3  wherein said breachable seal comprises a burst strength that is less than said sidewall.  
   
   
       5 . The article of  claim 1  wherein said sidewall comprises at least one of a polymer film, a metal foil, and a multilayer barrier film.  
   
   
       6 . The article of  claim 5  wherein at least a portion of said sidewall is substantially transparent.  
   
   
       7 . The article of  claim 1  further comprising at least one puncturing member comprising a striking surface.  
   
   
       8 . The article of  claim 7  wherein said striking surface is positioned within said enclosed volume.  
   
   
       9 . The article of  claim 7  wherein said striking surface is positioned proximate said outer surface of said breachable seal.  
   
   
       10 . The article of  claim 1  wherein said breachable seal is affixed to said sidewall.  
   
   
       11 . The article of  claim 1  wherein said breachable seal is removable.  
   
   
       12 . The article of  claim 1  further comprising at least one tether having one end affixed to said seal.  
   
   
       13 . The article of  claim 1  further comprising a means for breaching said seal.  
   
   
       14 . The article of  claim 1  further comprising a reactive metal positioned within said enclosed volume.  
   
   
       15 . The article of  claim 1  further comprising an adsorbent positioned within said enclosed volume.  
   
   
       16 . The article of  claim 1  further comprising an attachment interface to affix said body to a substrate or heat-dissipating component.  
   
   
       17 . The article of  claim 1  further comprising an attachment means to affix said body to a substrate or heat-dissipating component.  
   
   
       18 . The article of  claim 1  further comprising a boiling enhancement comprising at least one of carbon foam and a microporous coating.  
   
   
       19 . The article of  claim 18  further comprising a thermal interface material affixed to at least a portion of said boiling enhancement.  
   
   
       20 . The article of  claim 19  wherein said thermal interface material comprises a eutectic alloy.  
   
   
       21 . The article of  claim 1  further comprising a boiling enhancement affixed to said body by a retaining clip.  
   
   
       22 . A thermosyphon comprising an article according to  claim 1 .  
   
   
       23 . A cooling system comprising an article according to  claim 1 .  
   
   
       24 . A computer comprising an article according to  claim 1 .  
   
   
       25 . An article for cooling a heat-dissipating component comprising a body having at least one sidewall, an enclosed volume, an expansion volume, a quantity of heat transfer fluid disposed within said enclosed volume, and means for releasing said heat transfer fluid from said enclosed volume to said expansion volume.  
   
   
       26 . The article of  claim 25  wherein said heat transfer fluid comprises at least one of a perfluorocarbon, hydrofluorocarbon, hydrofluoroether, and perfluoroketone.  
   
   
       27 . The article of  claim 25  wherein said sidewall comprises at least one of a polymer film, a metal foil, and a multilayer barrier film.  
   
   
       28 . A cooling system comprising an article according to  claim 25 .  
   
   
       29 . A computer comprising an article according to  claim 25 .  
   
   
       30 . A method of installing an article for cooling a heat-dissipating component comprising: 
 affixing a body to a substrate supporting a heat-dissipating component, said body comprising at least one sidewall and a breachable seal cooperating to define an enclosed volume, and a quantity of heat transfer fluid disposed within said enclosed volume; and    breaching said seal to allow said heat transfer fluid to contact said heat-dissipating component.    
   
   
       31 . The method of  claim 30  further comprising affixing a boiling enhancement to said heat-dissipating component.  
   
   
       32 . The method of  claim 31  wherein said boiling enhancement is affixed to said heat-dissipating component with a thermal interface material comprising a eutectic alloy.  
   
   
       33 . The method of  claim 31  wherein said boiling enhancement is soldered to at least a portion of said heat-dissipating component.  
   
   
       34 . The method of  claim 30  wherein said heat-dissipating component comprises an integrated circuit.  
   
   
       35 . The method of  claim 30  further comprising placing a condenser in fluid communication with said body.