Thin film evaporation heat dissipation device that prevents bubble formation

Abstract

Apparatus for removing heat from a heat generating device comprising a two-phase heat dissipation device having a dispersion device disposed within the heat dissipation device. The heat dissipation device includes a sealed housing having a vaporization region within the sealed housing and a condensation region within the sealed housing, a working fluid disposed within said seal housing; and the dispersion device being adapted to disperse said working fluid toward the sealed housing vaporization region. The heat dissipation device may further include a divider plate dispose within the sealed housing, wherein the divider plate substantially divides the sealed housing into a vapor path chamber and a liquid path chamber.

1 . A heat dissipation device, comprising: 
 a sealed housing having a vaporization region within said sealed housing and a condensation region within said sealed housing;    a working fluid disposed within said seal housing; and    a dispersion device disposed within said sealed housing, said dispersion device being adapted to disperse said working fluid.    
   
   
       2 . The heat dissipation device of  claim 1 , wherein said dispersion device disperses said working fluid toward said sealed housing vaporization region.  
   
   
       3 . The heat dissipation device of  claim 1 , further including a divider plate dispose within said sealed housing, wherein said divider plate substantially divides said sealed housing into a vapor path chamber and a liquid path chamber.  
   
   
       4 . The heat dissipation device of  claim 3 , wherein said divider plate abuts said dispersion device.  
   
   
       5 . The heat dissipation device of  claim 1 , further including at least one wick structure.  
   
   
       6 . The heat dissipation device of  claim 5 , wherein said at least one wick structure abuts an interior surface of said sealed housing.  
   
   
       7 . The heat dissipation device of  claim 6 , wherein said at least one wick structure extends from at least a position proximate said condensation region to at least a position proximate said dispersion device.  
   
   
       8 . The heat dissipation device of  claim 1 , a thermally insulative material on at least a portion of an exterior surface of said sealed housing.  
   
   
       9 . The heat dissipation device of  claim 1 , a heat sink on an exterior of said sealed housing proximate the condensation region.  
   
   
       10 . An assembly, comprising: 
 a heat generating device;    a sealed housing having a vaporization region within said sealed housing and a condensation region within said sealed housing, wherein said heat generating mechanism abuts an exterior surface of said sealed housing proximate said vaporization region;    a working fluid disposed within said seal housing; and    a dispersion device disposed within said sealed housing, said dispersion device being adapted to disperse said working fluid.    
   
   
       11 . The assembly of  claim 10 , wherein said heat generating device comprises a microelectronic device.  
   
   
       12 . The assembly of  claim 10 , wherein said dispersion device disperses said working fluid toward said sealed housing vaporization region.  
   
   
       13 . The assembly of  claim 10 , further including a divider plate dispose within said sealed housing, wherein said divider plate substantially divides said sealed housing into a vapor path chamber and a liquid path chamber.  
   
   
       14 . The assembly of  claim 13 , wherein said divider plate abuts said dispersion device.  
   
   
       15 . The assembly of  claim 10 , further including at least one wick structure.  
   
   
       16 . The assembly of  claim 15 , wherein said at least one wick structure abuts an interior surface of said sealed housing.  
   
   
       17 . The assembly of  claim 16 , wherein said at least one wick structure extends from at least a position proximate said condensation region to at least a position proximate said dispersion device.  
   
   
       18 . The assembly of  claim 10 , a thermally insulative material on at least a portion of an exterior surface of said sealed housing.  
   
   
       19 . The assembly of  claim 10 , a heat sink on an exterior of said sealed housing proximate the condensation region.  
   
   
       20 . An electronic system, comprising: 
 a substrate within a housing;    at least one microelectronic device attached to said substrate;    a heat dissipation device, comprising: 
 a sealed housing having a vaporization region within said sealed housing and a condensation region within said sealed housing;  
 a working fluid disposed within said seal housing; and  
 a dispersion device disposed within said sealed housing, said dispersion device being adapted to disperse said working fluid; and  
   an input device interfaced with said substrate; and    a display device interfaced with said substrate.    
   
   
       21 . The electronic system of  claim 20 , wherein said dispersion device of said heat dissipation device disperses said working fluid toward said sealed housing vaporization region.  
   
   
       22 . The electronic system of  claim 20 , wherein said heat dissipation device further includes a divider plate dispose within said sealed housing, wherein said divider plate substantially divides said sealed housing into a vapor path chamber and a liquid path chamber.