Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. The second metal face includes heat sink fins therein. One or more semiconductor light emitting devices are mounted in the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits and/or optical coupling media also may be provided in the package. Related packaging methods also may be provided.

1 . A mounting substrate for a semiconductor light emitting device comprising: 
 a solid metal block including first and second opposing metal faces;    the first metal face including therein a cavity that is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity; and    the second metal face including therein a plurality of heat sink fins.    
   
   
       2 . A mounting substrate according to  claim 1  further comprising a reflective coating in the cavity.  
   
   
       3 . A mounting substrate according to  claim 1  further comprising first and second conductive traces in the cavity that are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.  
   
   
       4 . A mounting substrate according to  claim 1  further comprising: 
 an insulating layer on the first metal face; and    a conductive layer on the insulating layer that is patterned to provide a reflective coating in the cavity and first and second conductive traces in the cavity that are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.    
   
   
       5 . A mounting substrate according to  claim 4  wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.  
   
   
       6 . A mounting substrate according to  claim 4  wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.  
   
   
       7 . A mounting substrate according to  claim 1  wherein the first metal face further includes a pedestal therein and wherein the cavity is in the pedestal.  
   
   
       8 . A mounting substrate according to  claim 3  wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.  
   
   
       9 . A mounting substrate according to  claim 1  in combination with at least one semiconductor light emitting device that is mounted in the cavity.  
   
   
       10 . A mounting substrate according to  claim 9  in further combination with a lens that extends across the cavity.  
   
   
       11 . A mounting substrate according to  claim 7  in combination with at least one semiconductor light emitting device that is mounted in the cavity in the pedestal.  
   
   
       12 . A mounting substrate according to  claim 11  in further combination with a lens that extends across the pedestal and across the cavity.  
   
   
       13 . A mounting substrate according to  claim 9  in further combination with a flexible film that includes an optical element therein on the first metal face, wherein the optical element extends across the cavity.  
   
   
       14 . A mounting substrate according to  claim 11  in further combination with a flexible film that includes an optical element therein on the first metal face, wherein the optical element extends across the pedestal and across the cavity.  
   
   
       15 . A mounting substrate according to  claim 13  wherein the optical element comprises a lens.  
   
   
       16 . A mounting substrate according to  claim 14  wherein the optical element comprises a lens.  
   
   
       17 . A mounting substrate according to  claim 10  in further combination with a coating comprising phosphor on the lens.  
   
   
       18 . A mounting substrate according to  claim 12  in further combination with a coating comprising phosphor on the lens.  
   
   
       19 . A mounting substrate according to  claim 13  in further combination with a coating comprising phosphor on the optical element.  
   
   
       20 . A mounting substrate according to  claim 14  in further combination with a coating comprising phosphor on the optical element.  
   
   
       21 . A mounting substrate according to  claim 10  wherein the lens includes phosphor dispersed therein.  
   
   
       22 . A mounting substrate according to  claim 12  wherein the lens includes phosphor dispersed therein.  
   
   
       23 . A mounting substrate according to  claim 13  wherein the optical element includes phosphor dispersed therein.  
   
   
       24 . A mounting substrate according to  claim 14  wherein the optical element includes phosphor dispersed therein.  
   
   
       25 . A mounting substrate according to  claim 9  in further combination with a coating comprising phosphor on the at least one semiconductor light emitting device.  
   
   
       26 . A mounting substrate according to  claim 11  in further combination with a coating comprising phosphor on the at least one semiconductor light emitting device.  
   
   
       27 . A mounting substrate according to  claim 3  further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second traces.  
   
   
       28 . A mounting substrate according to  claim 3  further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.  
   
   
       29 . A mounting substrate according to  claim 9  wherein the at least one semiconductor light emitting device comprises at least one light emitting diode.  
   
   
       30 . A mounting substrate according to  claim 9  in combination with an optical coupling media in the cavity at least partially surrounding the light emitting device.  
   
   
       31 . A mounting substrate for semiconductor light emitting devices comprising: 
 a solid metal block including first and second opposing metal faces;    the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity; and    the second metal face including therein a plurality of heat sink fins.    
   
   
       32 . A mounting substrate according to  claim 31  further comprising a reflective coating in the plurality of cavities.  
   
   
       33 . A mounting substrate according to  claim 31  further comprising first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to at least one semiconductor light emitting device that is mounted in the respective cavity.  
   
   
       34 . A mounting substrate according to  claim 31  further comprising: 
 an insulating layer on the first metal face; and    a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to at least one semiconductor light emitting device that is mounted in the cavity.    
   
   
       35 . A mounting substrate according to  claim 34  wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.  
   
   
       36 . A mounting substrate according to  claim 34  wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.  
   
   
       37 . A mounting substrate according to  claim 31  wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.  
   
   
       38 . A mounting substrate according to  claim 33  wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.  
   
   
       39 . A mounting substrate according to  claim 31  in combination with at least one semiconductor light emitting device that is mounted in a respective cavity.  
   
   
       40 . A mounting substrate according to  claim 39  in further combination with a plurality of lenses, a respective one of which extends across a respective one of the cavities.  
   
   
       41 . A mounting substrate according to  claim 37  in combination with at least one semiconductor light emitting device that is mounted in a respective cavity in a respective pedestal.  
   
   
       42 . A mounting substrate according to  claim 41  in further combination with a plurality of lenses, a respective one of which extends across a respective one of the pedestals and across a respective one of the cavities.  
   
   
       43 . A mounting substrate according to  claim 39  in further combination with a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.  
   
   
       44 . A mounting substrate according to  claim 41  in further combination with a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.  
   
   
       45 . A mounting substrate according to  claim 43  wherein the optical element comprises a lens.  
   
   
       46 . A mounting substrate according to  claim 44  wherein the optical element comprises a lens.  
   
   
       47 . A mounting substrate according to  claim 40  in further combination with a coating comprising phosphor on the lenses.  
   
   
       48 . A mounting substrate according to  claim 42  in further combination with a coating comprising phosphor on the lenses.  
   
   
       49 . A mounting substrate according to  claim 43  in further combination with a coating comprising phosphor on the optical elements.  
   
   
       50 . A mounting substrate according to  claim 44  in further combination with a coating comprising phosphor on the optical elements.  
   
   
       51 . A mounting substrate according to  claim 40  wherein the lenses include phosphor dispersed therein.  
   
   
       52 . A mounting substrate according to  claim 42  wherein the lenses include phosphor dispersed therein.  
   
   
       53 . A mounting substrate according to  claim 43  wherein the optical elements include phosphor dispersed therein.  
   
   
       54 . A mounting substrate according to  claim 44  wherein the optical elements include phosphor dispersed therein.  
   
   
       55 . A mounting substrate according to  claim 39  in further combination with a coating comprising phosphor on the semiconductor light emitting device.  
   
   
       56 . A mounting substrate according to  claim 41  in further combination with a coating comprising phosphor on the semiconductor light emitting device.  
   
   
       57 . A mounting substrate according to  claim 33  further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second traces.  
   
   
       58 . A mounting substrate according to  claim 33  further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.  
   
   
       59 . A mounting substrate according to  claim 39  wherein the semiconductor light emitting devices comprise light emitting diodes.  
   
   
       60 . A mounting substrate according to  claim 39  in combination with an optical coupling media in the cavities at least partially surrounding the light emitting devices.  
   
   
       61 . A mounting substrate according to  claim 31  wherein the plurality of cavities are uniformly and/or nonuniformly spaced apart from one another in the first face.  
   
   
       62 . A semiconductor light emitting device packaging method comprising: 
 fabricating a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity, and the second metal face including therein a plurality of heat sink fins;    forming an insulating layer on the first metal face;    forming a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and are configured to connect to a plurality of semiconductor light emitting devices that are mounted in the cavities; and    mounting at least one semiconductor light emitting device in a respective cavity, and electrically connected to the first and second conductive traces in the respective cavity.    
   
   
       63 . A method according to  claim 62  wherein mounting is preceded by: 
 fabricating a reflective coating in the plurality of cavities.    
   
   
       64 . A method according to  claim 62  wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.  
   
   
       65 . A method according to  claim 62  wherein the solid metal block includes a through hole therein that extends from the first face to the second face, the method further comprising: 
 forming a conductive via in the through hole that is electrically connected to the first or second conductive traces.    
   
   
       66 . A method according to  claim 62  wherein mounting is followed by: 
 placing a respective lens across a respective one of the cavities.    
   
   
       67 . A method according to  claim 64  wherein mounting is followed by: 
 placing a respective lens across a respective one of the pedestals and across a respective one of the cavities.    
   
   
       68 . A method according to  claim 62  wherein mounting is followed by: 
 placing a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.    
   
   
       69 . A method according to  claim 64  wherein mounting is followed by: 
 placing a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.    
   
   
       70 . A method according to  claim 66  further comprising: 
 coating the lenses with phosphor.    
   
   
       71 . A method according to  claim 67  further comprising: 
 coating the lenses with phosphor.    
   
   
       72 . A method according to  claim 68  further comprising: 
 coating the optical element with phosphor.    
   
   
       73 . A method according to  claim 69  further comprising: 
 coating the optical element with phosphor.    
   
   
       74 . A method according to  claim 62  further comprising: 
 coating the semiconductor light emitting devices with phosphor.    
   
   
       75 . A method according to  claim 62  further comprising: 
 electrically connecting an integrated circuit to the first and second traces.    
   
   
       76 . A method according to  claim 62  further comprising: 
 electrically connecting a semiconductor light emitting device driver integrated circuit to the first and second traces.    
   
   
       77 . A method according to  claim 62  further comprising: 
 placing an optical coupling media in the cavities at least partially surrounding the light emitting devices.    
   
   
       78 . A semiconductor light emitting device package comprising: 
 a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity, and the second metal face including therein a plurality of heat sink fins;    an insulating layer on the first metal face;    at least one semiconductor light emitting device in a respective cavity; and    a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities and first and second conductive traces on the first face that extend into the plurality of cavities and that electrically connect to the at least one semiconductor light emitting device in the respective cavity.    
   
   
       79 . A package according to  claim 78  further comprising: 
 a reflective coating in the plurality of cavities.    
   
   
       80 . A package according to  claim 78  wherein the first metal face further includes a plurality of pedestals therein and wherein a respective one of the plurality of cavities is in a respective one of the plurality of pedestals.  
   
   
       81 . A package according to  claim 78  wherein the solid metal block includes a through hole therein that extends from the first face to the second face, the package further comprising: 
 a conductive via in the through hole that is electrically connected to the first or second conductive traces.    
   
   
       82 . A package according to  claim 78  further comprising: 
 a plurality of lenses, a respective one of which extends across a respective one of the cavities.    
   
   
       83 . A package according to  claim 80  further comprising: 
 a plurality of lenses, a respective one of which extends across a respective one of the pedestals and across a respective one of the cavities.    
   
   
       84 . A package according to  claim 78  further comprising: 
 a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective cavity.    
   
   
       85 . A package according to  claim 80  further comprising: 
 a flexible film that includes a plurality of optical elements therein on the first metal face, wherein a respective optical element extends across a respective pedestal and across a respective cavity.    
   
   
       86 . A package according to  claim 78  further comprising: 
 an integrated circuit on the solid metal block that is electrically connected to the first and second traces.    
   
   
       87 . A package according to  claim 78  further comprising: 
 a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second traces.    
   
   
       88 . A package according to  claim 78  further comprising: 
 an optical coupling media in the cavities at least partially surrounding the light emitting devices.