Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same

Abstract

Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

1 - 5 . (canceled)  
   
   
       6 . A method for cutting a liquid crystal display (LCD) panel having a shorting bar, the method comprising steps of: 
 irradiating a CO 2  laser light onto the LCD panel along a first cutting line, the first cutting line being in substantially parallel with the shorting bar outside of the shorting bar; and    irradiating the CO 2  laser light onto the LCD panel along a second cutting line, the second cutting line being in substantially parallel with the shorting bar inside of the shorting bar.    
   
   
       7 . The method of  claim 6 , further comprising a step of irradiating the CO 2  laser light onto a corner of the LCD panel to round the corner of the LCD.  
   
   
       8 . The method of  claim 6 , further comprising a step of cooling the LCD panel onto which the CO 2  laser light is irradiated.  
   
   
       9 . A method for manufacturing a liquid crystal display (LCD) panel, the method comprising steps of: 
 irradiating a first laser light onto a thin film transistor (TFT) parent substrate along a TFT cutting line to form a TFT substrate;    irradiating a second laser light onto a color filter parent substrate along a color filter cutting line to form a color filter substrate; and    combining the TFT substrate and the color filter substrate.    
   
   
       10 . The method of  claim 9 , wherein the first laser light and second laser light are a CO 2  laser light.  
   
   
       11 . The method of  claim 9 , further comprising steps of: 
 irradiating a first YAG laser light onto the TFT parent substrate; and    irradiating a second YAG laser light onto the color filter parent substrate.    
   
   
       12 . The method of  claim 9 , further comprising steps of: 
 irradiating the CO 2  laser light onto a corner of the TFT substrate to round the corner of the TFT substrate.    irradiating the CO 2  laser light onto a corner of the color filter substrate to round the corner of the color filter substrate.    
   
   
       13 . A method for cutting a thin film transistor (TFT) parent substrate, the method comprising a step of irradiating a CO 2  laser light having an elliptical cross-section onto the TFT parent substrate along a TFT cutting line to form a TFT substrate.  
   
   
       14 . The method of  claim 14 , further comprising a step of irradiating the CO 2  laser light onto a corner of the TFT substrate to round the corner of the TFT substrate.  
   
   
       15 . The method of  claim 14 , further comprising a step of irradiating a YAG laser light onto the TFT parent substrate prior to the step of irradiating the CO 2  laser light.  
   
   
       16 . The method of  claim 13 , further comprising a step of cooling the TFT parent substrate onto which the CO 2  laser light is irradiated.  
   
   
       17 . A method for cutting a color filter parent substrate, the method comprising a step of irradiating a CO 2  laser light having an elliptical cross-section onto the color filter parent substrate along a color filter cutting line to form a color filter substrate.  
   
   
       18 . The method of  claim 17 , further comprising a step of irradiating the CO 2  laser light onto a corner of the color filter substrate to round the corner of the color filter substrate.  
   
   
       19 . The method of  claim 18 , further comprising a step of irradiating a YAG laser light onto the color filter parent substrate prior to the step of irradiating the CO 2  laser light.  
   
   
       20 . The method of  claim 19 , further comprising a step of cooling the color filter parent substrate onto which the CO 2  laser light is irradiated.