Guiding fin heat sink

Abstract

The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.

1 . A guiding fin heat sink, comprising: 
 a base;    a heat-dissipation unit deposed on a surface of said base, having a curved end surface which is opposite to an end surface stuck on said surface of said base, and more than one guiding channel which is made passing through at least two other end surfaces of said heat-dissipation unit;    more than one heat pipe, having one end which is deposed between said base and said heat-dissipation unit, and the other end which is made penetrating through said more than one guiding channel; and    a fan deposed on an end surface of said heat-dissipation unit.    
   
   
       2 . The heat sink according to  claim 1 , wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.  
   
   
       3 . The heat sink according to  claim 1 , 
 wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and    wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.    
   
   
       4 . The heat sink according to  claim 3 , wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.  
   
   
       5 . The heat sink according to  claim 3 , wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.  
   
   
       6 . The heat sink according to  claim 1 , wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.  
   
   
       7 . The heat sink according to  claim 1 , wherein said heat pipe is curved in a ‘U’ shape.  
   
   
       8 . The heat sink according to  claim 1 , wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.  
   
   
       9 . The heat sink according to  claim 1 , wherein said heat pipe is a circuit-type pipe.  
   
   
       10 . A heat-dissipating method using a guiding fin heat sink, comprising the following steps: 
 (a) Obtaining a heat-dissipation unit to be deposed on a CPU of a main board by a base;    (b) Corresponding an end of more than one guiding channel of said heat-dissipation unit to an opening on a side wall of a computer case; and    (c) Deposing a fan on said opening of said computer case, wherein, after absorbing heat generated by said CPU through said base, said heat is directly directed out of said computer case by said fan.    
   
   
       11 . A heat-dissipating method according to  claim 10 , wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.  
   
   
       12 . A heat-dissipating method according to  claim 10 , 
 wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and    wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.    
   
   
       13 . A heat-dissipating method according to  claim 10 , wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.  
   
   
       14 . A heat-dissipating method according to  claim 10 , wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.  
   
   
       15 . A heat-dissipating method according to  claim 10 , wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.  
   
   
       16 . A heat-dissipating method according to  claim 10 , wherein more than one heat pipe is deposed between said base and said heat-dissipation unit at one end and the other end is made penetrating through said more than one guiding channel.  
   
   
       17 . A heat-dissipating method according to  claim 10 , wherein said heat pipe is curved in a ‘U’ shape.  
   
   
       18 . A heat-dissipating method according to  claim 10 , wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.  
   
   
       19 . A heat-dissipating method according to  claim 10 , wherein said heat pipe is a circuit-type pipe.  
   
   
       20 . A heat-dissipating method according to  claim 10 , wherein said step (c) is corresponding an end of said guiding channel to an opening of said computer case; deposing a fan at an opposite end of said guiding channel; and, after heat generated by CPU is absorbed by said base, guiding an air flow into said guiding channel to make said heat be directly carried out of said computer case.