Heat-dissipating fin set in combination with thermal pipe

Abstract

A heat pipe structure, having a tubular member, a support member and a wick structure. The tubular member is hollow to accommodate the support member and the wick structure therein. The wick structure is located between the tubular member and the support member. The wick structure is supported by the support member to be attached to an interior wall of the tubular member. The material melting point of the wick structure is lower than those of the tubular member and the support member. Therefore, the support member maintains good supporting function during sintering process, such that the wick structure can be adequately attached to interior wall of the tubular member.

1 . A heat-dissipating device, comprising: 
 a heat-dissipating fin set including a plurality of fin plates, each of the fin plates having at least one closed through hole and an accommodating section atop the through hole and a heat-conducting material being placed into the accommodating section; and    a thermal pipe passing through the through hole;    a thermal conductance provided between the through hole and the thermal pipe,    wherein the heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material filling a gap between the through hole and the thermal pipe.    
   
   
       2 . The heat-dissipating device as in  claim 1 , wherein the accommodating section is a downward dent formed at top face of each fin plate and the heat-conducting material is placed in the dent.  
   
   
       3 . The heat-dissipating device as in  claim 2 , wherein the heat-conducting material is heat-conducting glue.  
   
   
       4 . The heat-dissipating device as in  claim 1 , wherein the accommodating section is a through guiding hole formed on the fin plate and atop the through hole, the heat-conducting material is placed in the guiding hole.  
   
   
       5 . The heat-dissipating device as in  claim 4 , wherein the guiding hole is of rounded shape.  
   
   
       6 . The heat-dissipating device as in  claim 4 , wherein the guiding hole is of tapered shape with narrow bottom.  
   
   
       7 . The heat-dissipating device as in  claim 4 , wherein the guiding hole is of inverted water-drop shape.  
   
   
       8 . The heat-dissipating device as in  claim 4 , wherein the guiding hole is of inverted triangular shape.  
   
   
       9 . The heat-dissipating device as in  claim 4 , wherein the heat-conducting material is tin strip.  
   
   
       10 . The heat-dissipating device as in  claim 4 , wherein the heat-conducting material is tin paste.  
   
   
       11 . The heat-dissipating device as in  claim 4 , wherein the heat-conducting material is wax.