Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same

Abstract

The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.

1 . A mold for fabricating a barrier rib, comprising: 
 a plurality of protruding parts; and    a plurality of recessed parts,    wherein, the protruding parts and the recessed parts are arranged at regular intervals, the recessed parts have a shape corresponding to embossed portions of the barrier rib to be fabricated, and the protruding parts have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered.    
   
   
       2 . The mold as set forth in  claim 1 , wherein the mold is made of material selected from the group consisting of metal, semiconductors, and insulating material, and edges of the protruding parts have one of a shape which is formed by two sides meeting at a predetermined angle and a rounded shape.  
   
   
       3 . A method of fabricating a two-layered barrier rib, comprising: 
 (i) applying ink-philic material on a transparent substrate to form a lower ink-philic layer;    (ii) applying ink-phobic material on the ink-philic layer to form an upper ink-phobic layer;    (iii) providing the mold for fabricating the barrier rib according to  claim 1  on the ink-phobic layer and leaving a resulting structure for a predetermined time;    (iv) radiating UV or applying heat onto a backside of the transparent substrate to conduct curing; and    (v) removing the mold.    
   
   
       4 . The method as set forth in  claim 3 , wherein viscosity of the ink-phobic material is lower than viscosity of the ink-philic material.  
   
   
       5 . The method as set forth in  claim 3 , further comprising applying at least one of heat and pressure after the mold is provided in the step (iii).  
   
   
       6 . The method as set forth in  claim 3 , wherein the ink-philic layer is made of hydrophilic material and the ink-phobic layer is made of hydrophobic material when a hydrophilic ink is used, and the ink-philic layer is made of the hydrophobic material and the ink-phobic layer is made of the hydrophilic material when an oily ink is used.  
   
   
       7 . The method as set forth in  claim 4 , wherein the ink-philic layer is made of hydrophilic material and the ink-phobic layer is made of hydrophobic material when a hydrophilic ink is used, and the ink-philic layer is made of the hydrophobic material and the ink-phobic layer is made of the hydrophilic material when an oily ink is used.  
   
   
       8 . The method as set forth in  claim 6 , wherein the hydrophobic material is one or more copolymers selected from the group consisting of isoprene, styrene, acrylate containing fluorine, methacrylate containing fluorine, monomers thereof, oligomers thereof, homopolymers or copolymers thereof, and organic or inorganic complexes containing silicon.  
   
   
       9 . The method as set forth in  claim 6 , wherein the hydrophilic material is material selected from the group consisting of polyethylene glycol-, polyurethane-, polyamide-, and poly(2-hydroxy ethyl methacrylate)-based homopolymer or copolymer.  
   
   
       10 . The method as set forth in  claim 7 , wherein the hydrophobic material is one or more copolymers selected from the group consisting of isoprene, styrene, acrylate containing fluorine, methacrylate containing fluorine, monomers thereof, oligomers thereof, homopolymers or copolymers thereof, and organic or inorganic complexes containing silicon.  
   
   
       11 . The method as set forth in  claim 7 , wherein the hydrophilic material is material selected from the group consisting of polyethylene glycol-, polyurethane-, polyamide-, and poly(2-hydroxy ethyl methacrylate)-based homopolymer or copolymer.  
   
   
       12 . The method as set forth in  claim 3 , further comprising surface treating or coating a surface of the mold using material constituting the ink-philic layer.  
   
   
       13 . The method as set forth in  claim 4 , further comprising surface treating or coating a surface of the mold using material constituting the ink-philic layer.  
   
   
       14 . The method as set forth in  claim 3 , further comprising conducting cooling to achieve curing between the steps (iii) and (iv) when one or both of the ink-phobic material and the ink-philic material are thermoplastic material.  
   
   
       15 . A barrier rib fabricated according to the method of  claim 3 .  
   
   
       16 . The barrier rib as set forth in  claim 15 , wherein the barrier rib is used to fabricate one of a color filter for flat panel displays, an organic light emitting display, and an organic thin film transistor, using an inkjet printing process.  
   
   
       17 . The barrier rib as set forth in  claim 15 , wherein the barrier rib is used for a display part of one of a flat panel display, including an electrophoresis display and an electrowetting display, a PDP or a flexible display.  
   
   
       18 . The barrier rib as set forth in  claim 15 , wherein the barrier rib is used for a combinatorial test plate.