Method of forming a deformed pattern over a substrate

Abstract

A method of deforming a pattern comprising the steps of forming, over a substrate, a layered-structure with an upper surface including at least one selected region and at least a re-flow stopper groove, wherein the re-flow stopper groove extends outside the selected region and separate from the selected region; selectively forming at least one pattern on the selected region; and causing a re-flow of the pattern, wherein a part of an outwardly re-flowed pattern is flowed into the re-flow stopper groove, and then an outward re-flow of the pattern is restricted by the re-flow stopper groove extending outside of the pattern, thereby to form a deformed pattern with at least an outside edge part defined by an outside edge of the re-flow stopper groove.

1 . A method of forming a substrate, including at least the steps of: 
 forming an organic film over a substrate; and    infiltrating chemicals into said organic film to cause a deformation of said organic film, thereby forming a shapeless organic film over said substrate.    
   
   
       2 . A method of forming a deformed organic film over a substrate, said method including the steps of: 
 forming an organic film over said substrate; and    exposing said organic film to a solution containing an organic solvent to cause said organic film to undergo deformation to a flowable mass, thereby forming a deformed organic film over said substrate.    
   
   
       3 . The method as claimed in  claim 2 , wherein said deformed organic film is used as a mask pattern.  
   
   
       4 . The method as claimed in  claim 2 , wherein said deformed organic film is used as a mask pattern to selectively etch a part of a layered structure of said substrate.  
   
   
       5 . The method as claimed in  claim 2 , wherein said steps of exposing comprises a step of dipping said substrate into said solution.  
   
   
       6 . The method as claimed in  claim 2 , wherein said steps of exposing comprises a step of exposing said organic film to a steam of said solution.  
   
   
       7 . The method as claimed in  claim 2 , wherein said deformation of said organic film is made by dissolving and re-flowing said organic film.  
   
   
       8 . The method as claimed in  claim 2 , wherein said organic film includes plural organic films different in thickness from each other.  
   
   
       9 . The method as claimed in  claim 2 , wherein said organic film comprises a photo-sensitive organic film.  
   
   
       10 . The method as claimed in  claim 2 , wherein said photo-sensitive organic film is a photo-resist film.  
   
   
       11 . The method as claimed in  claim 2 , wherein said organic solvent includes at least one of ethylcellosolveacetate (ECA) or N-methyl-2-pyrolidinone.  
   
   
       12 . A method of forming a pattern over a substrate, said method including the steps of: 
 forming an organic film over said substrate; and    exposing said organic film to a solution containing an organic solvent to cause a deformation of said organic film, thereby forming a pattern comprising a deformed organic film over said substrate.    
   
   
       13 . The method as claimed in  claim 12 , wherein said pattern is used as a mask pattern.  
   
   
       14 . The method as claimed in  claim 12 , wherein said pattern is used as a mask pattern to selectively etch a part of a layered structure of said substrate.  
   
   
       15 . The method as claimed in  claim 12 , wherein said steps of exposing comprises a step of dipping said substrate into said solution.  
   
   
       16 . The method as claimed in  claim 12 , wherein said steps of exposing comprises a step of exposing said organic film to a steam of said solution.  
   
   
       17 . The method as claimed in  claim 2 , wherein said deformation of said organic film is made by dissolving and re-flowing said organic film.  
   
   
       18 . The method as claimed in  claim 12 , wherein said organic film includes plural organic films different in thickness from each other.  
   
   
       19 . The method as claimed in  claim 12 , wherein said organic film comprises a photo-sensitive organic film.  
   
   
       20 . The method as claimed in  claim 19 , wherein said photo-sensitive organic film is a photo-resist film.  
   
   
       21 . The method as claimed in  claim 12 , wherein said organic solvent includes at least one of ethylcellosolveacetate (ECA) or N-methyl-2-pyrolidinone.