US2006118426A1PendingUtilityA1

Producing method of stamper for light guide plate

21
Assignee: TAESAN LCD CO LTDPriority: Dec 7, 2004Filed: Dec 27, 2004Published: Jun 8, 2006
Est. expiryDec 7, 2024(expired)· nominal 20-yr term from priority
Inventors:Tae Hyun Choi
G02F 1/13G02B 6/13G03F 7/0017G02B 6/0065C25D 1/10G02B 6/0033
21
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Disclosed is a producing method of a stamper for a light guide plate, wherein the method includes the steps of: cleansing a conductor layer deposited layer; plating the conductor layer with a conductive material; spin coating a photoresist on the plating layer; placing a desired pattern mask, exposing and developing; wet etching the plating layer in a portion where the photoresist is partially removed; removing the remaining photoresist; fabricating a master by nickel plating a completed pattern surface; and releasing the master and nickel plating the master again to produce a stamper.

Claims

exact text as granted — not AI-modified
1 . A producing method of a stamper for a light guide plate, the method comprising the steps of: 
 cleansing a conductor layer deposited layer;    plating the conductor layer with a conductive material;    spin coating a photoresist on the plating layer;    placing a desired pattern mask, exposing and developing;    wet etching the plating layer in a portion where the photoresist is partially removed;    removing the remaining photoresist;    fabricating a master by nickel plating a completed pattern surface; and    releasing the master and nickel plating the released master again to produce a stamper.    
   
   
       2 . The method according to  claim 1 , wherein the conductive material is selected from copper, nickel and chrome.  
   
   
       3 . The method according to  claim 1 , wherein the etching depth is same with the thickness of the plating layer.  
   
   
       4 . The method according to  claim 1 , wherein an etching solution for use in the etching process is a mixture of nitric acid and ultra pure water, or a mixture of sulfuric acid, peroxide and ultra pure water.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.