Dressing method for polishing pad

Abstract

The present invention provides a dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of performing dressing of the polishing pad by pressing a pad dresser against the polishing pad and performing dressing of the polishing pad by making a cleaning fluid fog drops each with a droplet grain size of 1 μm to 500 μm inclusive and spouting the fog drops to the polishing pad from a nozzle at a speed of 10 m/second to 500 m/second inclusive.

1 . A dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of: 
 performing dressing of the polishing pad by pressing a pad dresser against the polishing pad; and    performing dressing of the polishing pad by making a cleaning fluid fog drops each with a droplet grain size of 1 μm to 500 μm inclusive and spouting the fog drops to the polishing pad from a nozzle at a speed of 10 m/second to 500 m/second inclusive.    
   
   
       2 . The dressing method for a polishing pad according to  claim 1 , wherein the cleaning fluid is pressurized to 1 MPa to 50 MPa inclusive to be spouted from the nozzle.  
   
   
       3 . The dressing method for a polishing pad according to  claim 1 , wherein the pad dresser is a plate-shaped body with a number of diamond abrasives fixed on a surface of the plate-shaped body.  
   
   
       4 . The dressing method for a polishing pad according to  claim 2 , wherein the pad dresser is a plate-shaped body with a number of diamond abrasives fixed on a surface of the plate-shaped body.  
   
   
       5 . The dressing method for a polishing pad according to  claim 1 , wherein dressing of the polishing pad by the pad dresser is performed at the same time as polishing work, and dressing of the polishing pad by spout of the cleaning fluid is performed after the polishing work.  
   
   
       6 . The dressing method for a polishing pad according to  claim 2 , wherein dressing of the polishing pad by the pad dresser is performed at the same time as polishing work, and dressing of the polishing pad by spout of the cleaning fluid is performed after the polishing work.  
   
   
       7 . The dressing method for a polishing pad according to  claim 3 , wherein dressing of the polishing pad by the pad dresser is performed at the same time as polishing work, and dressing of the polishing pad by spout of the cleaning fluid is performed after the polishing work.  
   
   
       8 . The dressing method for a polishing pad according to  claim 4 , wherein dressing of the polishing pad by the pad dresser is performed at the same time as polishing work, and dressing of the polishing pad by spout of the cleaning fluid is performed after the polishing work.  
   
   
       9 . The dressing method for a polishing pad according to  claim 1 , wherein dressing of the polishing pad by the pad dresser is performed at the same time as polishing work, and dressing of the polishing pad by the pad dresser and dressing of the polishing pad by spout of the cleaning fluid are performed at the same time after the polishing work.  
   
   
       10 . The dressing method for a polishing pad according to  claim 1 , wherein dressing of the polishing pad by the pad dresser and dressing of the polishing pad by spout of the cleaning fluid are performed at the same time after polishing work.  
   
   
       11 . The dressing method for a polishing pad according to  claim 1 , wherein dressing of the polishing pad by the pad dresser is performed after polishing work, and thereafter, dressing of the polishing pad by the pad dresser and dressing of the polishing pad by spout of the cleaning fluid are performed at the same time.  
   
   
       12 . The dressing method for a polishing pad according to  claim 1 , wherein the pad dresser is provided with one through-hole or more, and the cleaning fluid is spouted from the one through-hole or more.  
   
   
       13 . The dressing method for a polishing pad according to  claim 1 , wherein the pad dresser is formed into a disk shape, and the cleaning fluid is spouted from an outer circumferential side of the pad dresser.  
   
   
       14 . The dressing method for a polishing pad according to  claim 1 , wherein the pad dresser is formed into an annular shape, and the cleaning fluid is spouted from an inner circumferential side of the pad dresser.  
   
   
       15 . The dressing method for a polishing pad according to  claim 1 , wherein dressing of the polishing pad is performed while the pad dresser and the nozzle are relatively moved with respect to the polishing pad.  
   
   
       16 . A dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of: 
 performing dressing of the polishing pad by making a cleaning fluid fog drops each with a droplet grain size of 1 μm to 500 μm inclusive and spouting the fog drops to the polishing pad from a nozzle at a speed of 10 m/second to 500 m/second inclusive; and    cleaning the polishing pad with a rinse fluid at a higher flow rate than the cleaning fluid.    
   
   
       17 . A dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of: 
 performing dressing of the polishing pad by making a cleaning fluid fog drops each with a droplet grain size of 1 μm to 500 μm inclusive and spouting the fog drops to the polishing pad from a nozzle at a speed of 10 m/second to 500 m/second inclusive; and    thereafter, cleaning the polishing pad with a rinse fluid at a higher flow rate than the cleaning fluid.    
   
   
       18 . The dressing method for a polishing pad according to  claim 16  wherein the cleaning fluid is pressurized to 1 MPa to 50 MPa inclusive to be spouted from the nozzle.  
   
   
       19 . The dressing method for a polishing pad according to  claim 17  wherein the cleaning fluid is pressurized to 1 MPa to 50 MPa inclusive to be spouted from the nozzle.