Bladder based package control/singulation

Abstract

An apparatus and method for singulating IC devices or semiconductor devices and/or components thereof. The apparatus includes a flexible membrane or bladder configured to receive an applied fluid pressure on a surface thereof and expand in response to the applied fluid pressure. Upon expansion of the flexible membrane, a semiconductor device or semiconductor device component is contacted by the flexible membrane and immobilized. The semiconductor device may then be subjected to a predetermined test or manufacturing operation. Subsequent any processing to the semiconductor device or component, the fluid pressure is released such that the flexible membrane contracts and releases the semiconductor device to be advanced for further processing, testing, or preparation for shipping.

1 . An article handling device comprising: 
 a first flexible membrane for contacting at least one semiconductor device using fluid pressure for stopping the at least one semiconductor device when the first flexible membrane substantially conforms to a surface of an semiconductor device, the surface of the semiconductor device including one surface of a surface having conductive elements thereon and an opposite surface from the surface having conductive elements thereon; and    a second flexible membrane for contacting at least one other semiconductor device using fluid pressure for stopping advancement of the at least one other semiconductor device when the second flexible membrane substantially conforms to a surface of an semiconductor device, the surface of the another semiconductor device including one surface of a surface having conductive elements thereon and an opposite surface from the surface having conductive elements thereon.    
   
   
       2 . An article handling device for a semiconductor device comprising: 
 a plate having a first opening therethrough; and    a first flexible membrane attached to a portion of said plate adjacent the first opening for receiving a first fluid pressure adjacent the first opening of the first plate for causing the first flexible membrane to extend outwardly to immobilize at least one semiconductor device moving adjacent thereto by said first flexible membrane having a portion thereof substantially conforming to a surface of the at least one semiconductor device, the surface of the at least one semiconductor device including one surface of a surface having conductive elements thereon and a surface opposite a surface having conductive elements thereon.    
   
   
       3 . The device according to  claim 2 , wherein the first flexible membrane comprises one of latex and a rubber.  
   
   
       4 . The device according to  claim 2 , wherein the first flexible membrane is configured to contact at least one of a plurality of conductive elements on the at least one semiconductor device.  
   
   
       5 . The device according to  claim 2 , further comprising a second opening in the plate having a second flexible membrane attached adjacent thereto to receive a second fluid pressure adjacent the second opening of the first plate to extend outwardly through the second opening of the second plate to contact and immobilize at least one other semiconductor device moving adjacent to the second flexible membrane.  
   
   
       6 . The device according to  claim 5 , wherein the second flexible membrane is configured to reposition the at least one other semiconductor device upon contact therewith.  
   
   
       7 . A handling device for a semiconductor device comprising: 
 a plate having a first opening therethrough; and    a first flexible membrane attached to a portion of said plate adjacent the first opening for receiving a first fluid pressure adjacent the first opening of the first plate for causing the first flexible membrane to extend outwardly to immobilize at least one semiconductor device moving adjacent thereto by said first flexible membrane having a portion thereof substantially conforming to a surface of the at least one semiconductor device, the surface of the at least one semiconductor device including one surface of a surface having conductive elements thereon and a surface opposite a surface having conductive elements thereon.    
   
   
       8 . The device according to  claim 7 , wherein the first flexible membrane comprises one of latex and a rubber.  
   
   
       9 . The device according to  claim 7 , wherein the first flexible membrane is configured to contact at least one of a plurality of conductive elements on the at least one semiconductor device.  
   
   
       10 . The device according to  claim 7 , further comprising a second opening in the plate having a second flexible membrane attached adjacent thereto to receive a second fluid pressure adjacent the second opening of the first plate to extend outwardly through the second opening of the second plate to contact and immobilize at least one other semiconductor device moving adjacent to the second flexible membrane.  
   
   
       11 . The device according to  claim 10 , wherein the second flexible membrane is configured to reposition the at least one other semiconductor device upon contact therewith.