US2006138642A1PendingUtilityA1

Micromechanical getter anchor

Assignee: ROBBINS ROGER APriority: Nov 30, 2000Filed: Jan 31, 2006Published: Jun 29, 2006

Est. expiryNov 30, 2020(expired)· nominal 20-yr term from priority

Inventors:Roger A. Robbins Jwei Liu Jack Smith Edward Fisher Joyce Holton

H10W 90/754H10W 72/5522H10W 72/01515H10W 72/583H10W 72/075H10W 72/59H10W 72/50H10W 70/682H10W 76/48H10W 70/68B81B 7/0038G02B 26/0833H04N 5/7458B81B 2203/0307

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Claims

Abstract

One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers. The layers form a cavity in the substrate 906 with a wide bottom portion-formed in the middle layer 902 and a relatively narrower top portion-formed by the top layer 904 . The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Claims

exact text as granted — not AI-modified

1 - 18 . (canceled)  
     
     
         19 . An anchor to hold material in place within a micromechanical device package, said anchor comprising: 
 a package substrate; and    a member attached to said package substrate, said member shaped to provide mechanical retention of said material formed over said member.    
     
     
         20 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate.    
     
     
         21 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate by one point.    
     
     
         22 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate by one end.    
     
     
         23 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate by at least two points.    
     
     
         24 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate by at least two ends.    
     
     
         25 . The anchor of  claim 19 , said member comprising: 
 at least one elongated member attached to said package substrate though an intermediate bond pad.    
     
     
         26 . The anchor of  claim 19 , said member comprising: 
 at least one wire member attached to said package substrate.    
     
     
         27 . The anchor of  claim 19 , said member comprising: 
 at least one bond wire member attached to said package substrate.    
     
     
         28 . A micromechanical device package comprising: 
 a package substrate;    a package lid enclosing a package cavity;    a micromechanical device in said package cavity; and    a getter anchor in said package cavity.    
     
     
         29 . The micromechanical device package of  claim 28 , wherein said getter anchor comprises at least one member attached to said package substrate.  
     
     
         30 . The micromechanical device package of  claim 28 , wherein said member is attached to said package substrate by one point.  
     
     
         31 . The micromechanical device package of  claim 28 , wherein said member is attached to said package substrate by one end.  
     
     
         32 . The micromechanical device package of  claim 28 , wherein said member is attached to said package substrate by at least two points.  
     
     
         33 . The micromechanical device package of  claim 28 , wherein said member is attached to said package substrate by at least two ends.  
     
     
         34 . The micromechanical device package of  claim 28 , wherein said member is attached to said package substrate though an intermediate bond pad.  
     
     
         35 . The micromechanical device package of  claim 28 , wherein said member is a wire.  
     
     
         36 . The micromechanical device package of  claim 28 , wherein said member is a bond wire.  
     
     
         37 . The micromechanical device package of  claim 28 , wherein said anchor is a cavity anchor.  
     
     
         38 . The micromechanical device package of  claim 28 , wherein said cavity anchor is formed in said package substrate.  
     
     
         39 . The micromechanical device package of  claim 28 , wherein said cavity anchor is a slot formed in said package substrate.  
     
     
         40 . The micromechanical device package of  claim 28 , wherein said slot has a narrow top and a wider bottom portion.  
     
     
         41 . The micromechanical device package of  claim 28 , said cavity anchor formed to provide mechanical retention of a getter material.  
     
     
         42 . A method of packaging a micromechanical device, said method comprising: 
 providing a package substrate having a getter anchor;    attaching a micromechanical device to said package substrate;    attaching a getter material to said getter anchor; and    attaching a package lid to said package substrate.    
     
     
         43 . The method of  claim 42 , wherein providing a package substrate having a getter anchor comprises: 
 providing a ceramic package substrate having an anchor cavity formed therein.    
     
     
         44 . The method of  claim 42 , wherein providing a package substrate having a getter anchor comprises: 
 providing a package substrate having at least one member attached thereto, said member forming said getter anchor.    
     
     
         45 . The method of  claim 42 , wherein providing a package substrate having a member attached thereto comprises: 
 attaching at least one elongated member to said package substrate.    
     
     
         46 . The method of  claim 42 , wherein providing a package substrate having a member attached thereto comprises: 
 attaching at least one mushroom shaped member to said package substrate.    
     
     
         47 . The method of  claim 42 , wherein providing a package substrate having a member attached thereto comprises: 
 attaching at least one wire to said substrate.    
     
     
         48 . The method of  claim 42 , wherein providing a package substrate having a member attached thereto comprises: 
 attaching at least one wire loop to said substrate.    
     
     
         49 . The method of  claim 42 , wherein providing a package substrate having a member attached thereto comprises: 
 providing a package substrate having a member attached to a bond pad of said substrate.    
     
     
         50 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a getter material into an anchor cavity.    
     
     
         51 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a desiccant material into an anchor cavity.    
     
     
         52 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a molecular sieve material into an anchor cavity.    
     
     
         53 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a getter mixed with a carrier material into an anchor cavity.    
     
     
         54 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a getter mixed with a solvent material into an anchor cavity.    
     
     
         55 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 putting a getter mixed with a lubricant into an anchor cavity.    
     
     
         56 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching a desiccant material to said anchor.    
     
     
         57 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching a molecular sieve material to said anchor.    
     
     
         58 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching a getter mixed with a carrier material to said anchor.    
     
     
         59 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching a getter mixed with a solvent material to said anchor.    
     
     
         60 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching a getter mixed with a lubricant to said anchor.    
     
     
         61 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching an adhesive to said anchor; and    attaching a getter to said adhesive.    
     
     
         62 . The method of  claim 42 , wherein attaching a getter material to said getter anchor comprises: 
 attaching an adhesive to said anchor; and    attaching a preformed getter to said adhesive.    
     
     
         63 . A method of forming a package having an anchor, said method comprising: 
 forming a first package substrate layer;    forming a second package substrate layer, said second layer having a void;    forming a third package substrate layer;    laminating said first, second, and third layers such that said void forms an anchor cavity suitable for anchoring a getter.    
     
     
         64 . The method of  claim 63 , further comprising: 
 forming a fourth package substrate layer, said fourth package substrate layer having a void, wherein said second and fourth layers are adjacent when said layers are laminated such that a cavity anchor with a narrow top and a relatively wide bottom is formed by said voids in said second and fourth layers.    
     
     
         65 . A method of packaging a micromechanical device, said method comprising: 
 providing a package substrate;    attaching a micromechanical device to said package substrate;    attaching bond wires between said micromechanical device and said package substrate;    attaching a getter material to said bond wires; and    attaching a package lid to said package substrate.    
     
     
         66 . The method of  claim 65 , wherein attaching a getter material to said getter anchor comprises: 
 attaching an adhesive to said bond wires; and    attaching a getter to said adhesive.    
     
     
         67 . The method of  claim 65 , wherein attaching a getter material to said getter anchor comprises: 
 attaching an adhesive to said bond wires; and    attaching a preformed getter to said adhesive.

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