US2006144278A1PendingUtilityA1

Methods for Testing Single-Use Devices

Assignee: SCHLUMBERGER TECHNOLOGY CORPPriority: Dec 20, 2004Filed: Dec 20, 2004Published: Jul 6, 2006
Est. expiryDec 20, 2024(expired)· nominal 20-yr term from priority
Inventors:David Gerez
F42C 21/00
39
PatentIndex Score
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Cited by
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Claims

Abstract

Methods for testing single-use electrical devices (e.g., explosive detonators and initiators) are provided to ensure operating reliability of such devices when used in the field. These methods facilitate testing of non-destructible components of single-use electrical devices at operating parameters during production or anytime before field use.

Claims

exact text as granted — not AI-modified
1 . A method for testing an electrical device having a single-use component and another component, comprising: 
 testing the device; and    electrically connecting the single-use component to the other component, wherein the testing is performed before the single-use component and the other component are electrically connected.    
   
   
       2 . The method of  claim 1 , wherein electrically connecting the single-use component and the other component comprises mounting the single-use component to a circuit board having a conductive path formed between the single-use component and the other component.  
   
   
       3 . The method of  claim 1 , further comprising: 
 mounting the single-use component and the other component to a circuit board before the testing is performed,    wherein electrically connecting the single-use component and the other component comprises completing a conductive path between the single-use component and the other component.    
   
   
       4 . A method for producing an electrical device having a single-use component and at least one other component, comprising: 
 providing a circuit board for receiving the single-use component and the at least one other component and a conductive path for electrically connecting the single-use component and the at least one other component;    installing the at least one other component on the circuit board;    installing the single-use component on the circuit board, wherein the conductive path is incomplete between the single-use component and the at least one other component;    testing the at least one other component; and    completing the conductive path between the single-use component and the at least one other component.    
   
   
       5 . The method of  claim 4 , wherein completing the conductive path between the single-use component and the at least one other component comprises: 
 applying solder between the between the single-use component and the at least one other component.    
   
   
       6 . The method of  claim 4 , wherein completing the conductive path between the single-use component and the at least one other component comprises: 
 connecting a wire between the single-use component and the at least one other component.    
   
   
       7 . The method of  claim 4 , wherein completing the conductive path between the single-use component and the at least one other component comprises: 
 mounting a resistor between the single-use component and the at least one other component.    
   
   
       8 . The method of  claim 4 , wherein completing the conductive path between the single-use component and the at least one other component comprises: 
 applying a conductive strip between the single-use component and the at least one other component.    
   
   
       9 . The method of  claim 4 , wherein installing the components on the circuit board comprises: 
 mounting the single-use component on one side of the circuit board; and mounting the at least one other component on the other side of the circuit board.    
   
   
       10 . The method of  claim 9 , wherein completing the conductive path between the single-use component and the at least one other component comprises: 
 forming a hole in the circuit board between the single-use component and the at least one other component; and    filling the hole with a conductive element.    
   
   
       11 . The method of  claim 10 , wherein the conductive element is solder.  
   
   
       12 . The method of  claim 10 , wherein the conductive element is a pin.  
   
   
       13 . The method of  claim 4 , wherein the electrical device is an explosive detonator.  
   
   
       14 . The method of  claim 13 , wherein the single-use component is selected from a group consisting of an exploding foil initiator, an exploding bridge wire initiator, a semiconductor bridge initiator, and a hotwire.  
   
   
       15 . The method of  claim 13 , wherein the at least one other component is selected from a group consisting of a filter, an addressable chip, a capacitor, a resistor, a transformer, a switch, and a diode.  
   
   
       16 . The method of  claim 4 , wherein the electrical device is an igniter.  
   
   
       17 . The method of  claim 16 , wherein the single-use component is selected from a group consisting of an exploding foil initiator, an exploding bridge wire initiator, a semiconductor bridge initiator, and a hotwire.  
   
   
       18 . The method of  claim 16 , wherein the at least one other component is selected from a group consisting of a filter, an addressable chip, a capacitor, a resistor, a transformer, a switch, and a diode.  
   
   
       19 . A method for producing an electrical device having a single-use component and a multi-use component, comprising: 
 providing a circuit board having a conductive pad for receiving the single-use component, a conductive pad for receiving the multi-use component, and a conductive path for electrically connecting the conductive pad of the single-use component and the conductive pad of the multi-use component;    installing the multi-use component on one of the conductive pads of the circuit board;    installing the single-use component on the other conductive pad of the circuit board, wherein the conductive path is incomplete between the conductive pads;    testing the multi-use component in a test fixture; and    completing the conductive path between the conductive pads.    
   
   
       20 . The method of  claim 17 , wherein completing the conductive path between the conductive pads comprises: 
 connecting a wire between the conductive pads.

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