Die paddle clamping method for wire bond enhancement

Abstract

A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

1 . A clamping method for a semiconductor device assembly using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 providing at least a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth level extending outwardly for contact by the upper clamp member;    attaching a semiconductor device to the die mount paddle, the semiconductor device having a plurality of bond pads;    locating the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab; and    forming at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         2 . The method of  claim 1 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third level located below the first level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         3 . The method of  claim 1 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and the at least two bond wires one bond wire extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         4 . A clamping method for assembling a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying at least a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by the upper clamp member;    attaching a semiconductor device to the die mount paddle, the semiconductor device having a plurality of bond pads;    locating at least a portion the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab; and    forming at least one connection to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         5 . The method of  claim 4 , further comprising: forming the die mount paddle having an upper surface thereof at the third vertical level located below the first vertical level of the at least two inner leads; and 
 deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         6 . The method of  claim 4 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and at least two bond wires extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         7 . A method for immobilizing a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 providing at least a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    immobilizing portions of the leadframe using the upper clamp member contacting portions of the leadframe while portions of the lower clamp member contact portions of the leadframe; and    forming at least one connection to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         8 . The method of  claim 7 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third vertical level located below the first vertical level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         9 . The method of  claim 7 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and at least two bond wires extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         10 . A method for working on a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first vertical level, having at least two outer leads located at a second vertical level, having a die mount paddle located at a third vertical level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth vertical level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality bond pads;    locating at least a portion of the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab; and    connecting at least one of the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         11 . The method of  claim 10 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third vertical level located below the first vertical level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         12 . The method of  claim 10 , further comprising: 
 removing the strip of leadframes, and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and at least two bond wires extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         13 . A method for working on a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    preventing substantial movement of the die mount paddle by clamping a portion thereof; and    connecting at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         14 . The method of  claim 13 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third level located below the first level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         15 . The method of  claim 13 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and the at least one bond wire extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         16 . A method for working on a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying at least a portion of a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of the strip of leadframes on the lower clamp member of the apparatus bonding device having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    forcing portions of the die mount paddle into contact with portions of the lower clamp member; and    connecting at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         17 . The method of  claim 16 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third level located below the first level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         18 . The method of  claim 16 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the strip of leadframes, the semiconductor device, and the at least one bond wire extending between the strip of leadframes and the semiconductor device in a material.    
     
     
         19 . A method for forming a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying at least one leadframe from a strip of leadframes having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of the at least one leadframe on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    forcing portions of the die mount paddle into contact with portions of the lower clamp member; and    connecting at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         20 . The method of  claim 19 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third level located below the first level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         21 . The method of  claim 19 , further comprising: 
 removing the at least one leadframe and the semiconductor device from the lower clamp member; and    encapsulating a portion of the at least one leadframe, the semiconductor device, and the at least one bond wire extending between the strip of leadframe and the semiconductor device in a material.    
     
     
         22 . A method for forming a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying at least on leadframe from a strip of leadframes having opposed rails, having dam bars between the opposed rails, having at least two inner leads located at a first level, having at least two outer leads located at a second level, having a die mount paddle located at a third level and having at least one integral clamping tab, the at least one integral clamping tab located at a fourth level extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of the at least one leadframe on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    preventing substantial movement of portions of the die mount paddle by contacting portions of the die mount paddle with the upper clamp member and the lower clamp member; and    connecting at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         23 . The method of  claim 22 , further comprising: 
 forming the die mount paddle having an upper surface thereof at the third level located below the first level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         24 . The method of  claim 22 , further comprising: 
 removing the strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the at least one leadframe from a strip of leadframes, the semiconductor device, and the at least one bond wire extending between at least one leadframe from a strip of leadframes and the semiconductor device in a material.    
     
     
         25 . A method for forming a semiconductor device assembly having a semiconductor device and portions of a leadframe using an apparatus having an upper clamp member and a lower clamp member, the method comprising: 
 supplying at least one leadframe from a strip of leadframes, the strip having opposed rails, having dam bars between the opposed rails, having at least two inner leads, having at least two outer leads, having a die mount paddle located and having at least one integral clamping tab, the at least one integral clamping tab extending outwardly for contact by the upper clamp member, the die mount paddle having a semiconductor device attached thereto, the semiconductor device having a plurality of bond pads;    locating at least a portion of a the strip of leadframes on the lower clamp member of the apparatus having the upper clamp member overlying portions of the at least two inner leads and portions of the at least one integral clamping tab;    engaging portions of the die mount paddle into contact with portions of the lower clamp member; and    connecting at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.    
     
     
         26 . The method of  claim 25 , further comprising: 
 forming the die mount paddle having an upper surface thereof at a third vertical level located below an upper first vertical level of the at least two inner leads; and    deforming the at least one integral clamping tab to clamp portions thereof.    
     
     
         27 . The method of  claim 25 , further comprising: 
 removing the at least one leadframe from a strip of leadframes and the semiconductor device from the lower clamp member; and    encapsulating a portion of the leadframe from a strip of leadframes, the semiconductor device, and the at least one bond wire extending between the at least one leadframe from the strip of leadframes and the semiconductor device in a material.    
     
     
         28 . A method of bonding a portion of a connector to a portion of a lead of a leadframe having a semiconductor device having a plurality of bond pads attached to a portion of a die mount paddle of a leadframe, the method comprising: 
 locating the strip of leadframes on a lower clamp member of an apparatus having an upper clamp member overlying a portion of at least one lead and a portion of at least one integral clamping tab of the strip of leadframes; and    forming at least one bond wire to the plurality of bond pads of the semiconductor device and the portions of the at least two inner leads.