Single pass, dual thickness electroplating system for head suspension components

Abstract

A method for simultaneously electroplating exposed conductor regions on both sides of a disk drive suspension component by providing an electroplating system having a bath of electroplating solution with first and second anodes in the bath. The suspension component is positioned in the bath of electroplating solution between the first and second anodes. A first electroplating current is produced between the first anode and the exposed conductor regions on the first surface of the component. A second electroplating current is produced between the second anode and the exposed conductor regions on the second surface. Layers of conductive material are thereby plated onto the exposed conductor regions on both sides of the component. By controlling parameters of the first and second plating currents, such as time and magnitude, the layers of conductive material can be plated to the same or different thicknesses on the opposite sides of the conductors.

1 . A method for electroplating a component for a disk drive suspension, comprising: 
 providing an electroplating system having a bath of electroplating solution including a plating material and first and second anodes in the bath;    providing a suspension component having first and second opposing surfaces with exposed conductor regions;    positioning the suspension component in the bath of electroplating solution between the first and second anodes;    applying a first electroplating current between the first anode and the exposed conductor regions on the first surface to plate a first layer of conductive plating material on the exposed conductor regions on the first surface; and    applying a second electroplating current between the second anode and the exposed conductor regions on the second surface to plate a first layer of conductive plating material on the exposed conductor regions on the second surface.    
   
   
       1 . The method of  claim 1 , wherein applying the first and second electroplating currents causes the first and second surfaces to be plated with first layers of plating material having differing thicknesses.  
   
   
       2 . The method of  claim 1 , wherein applying the first and second electroplating currents causes the first and second surfaces to be plated with first layers of plating material having about the same thickness.  
   
   
       3 . The method of  claim 1 , wherein applying the first and second electroplating currents includes applying a greater current between one of the first and second anodes and the exposed conductor regions than the current applied between the other of the first and second anodes and the exposed conductor regions.  
   
   
       5 . The method of  claim 1 , wherein applying the first and second electroplating currents includes applying current between one of the first and second anodes and the exposed conductor regions for a longer period of time than the current applied between the other of the first and second anodes and the exposed conductor regions.  
   
   
       6 . The method of  claim 1 , wherein applying the first electroplating current between the first anode and the exposed conductor regions is performed simultaneously with the application of the second electroplating current between the second anode and the exposed conductor regions.  
   
   
       7 . The method of  claim 1 , wherein applying the first and second electroplating currents includes applying the first and second electroplating currents at different times.  
   
   
       8 . The method of  claim 1 , wherein applying the second electroplating current includes applying the second electroplating current after applying the first electroplating current.  
   
   
       9 . The method of  claim 1 , further comprising plating a second layer of conductive plating material onto the first layer of conductive plating material on the first surface and plating a second layer of conductive plating material onto the first layer of conductive plating material on the second surface.  
   
   
       10 . The method of  claim 9  wherein the second conductive layer on the first surface has a different thickness than the first conductive layer on the first surface.  
   
   
       11 . The method of  claim 9 , wherein the second conductive layer on the first surface has a different thickness than the second conductive layer on the second surface.  
   
   
       12 . A system for electroplating portions of opposing first and second surfaces of a disk drive suspension component, comprising: 
 an electroplating container holding an amount of electroplating solution;    a first anode;    a second anode;    structure for supporting the suspension component between the first and second anodes; and    power supply means in electrical communication with the first and second anodes to cause the first anode to produce a first electroplating current between the first anode and a first side of the suspension component and to cause the second anode to produce a second electrical current between the second anode and a second side of the suspension component.    
   
   
       13 . The system of  claim 12  further comprising a third anode spaced apart from first and second anodes, wherein the third anode is in electrical communication with power supply means to produce an electrical current between the third anode and one of the first and second sides of the suspension component.  
   
   
       14 . The system of  claim 12  and further comprising: 
 a web of material, including the suspension component;    an unwind member for dispensing the web of material into the plating solution; and    a rewind member for receiving the web of material dispensed through the plating solution;    wherein the first and second anodes are positioned between the unwind and rewind members.    
   
   
       15 . The system of  claim 12  wherein the electroplating solution comprises gold.  
   
   
       16 . The system of  claim 12  wherein the electroplating solution comprises nickel.  
   
   
       17 . The system of  claim 12  wherein the electroplating solution comprises silver.  
   
   
       18 . The system of  claim 12  wherein the electroplating solution comprises copper.  
   
   
       19 . The system of  claim 12  wherein the electroplating solution comprises palladium.  
   
   
       20 . The system of  claim 12  wherein the electroplating solution comprises a solder material.