High-frequency switch in multi-layer substrate

Abstract

A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure.

1 . A switch module comprising: 
 a build-up multi-layer structure, said build-up multi-layer structure comprises a plurality of conductive layers and a plurality of dielectric layers laminated upon each another, wherein any two of said plurality of conductive layers have at least any said plurality of dielectric layers between; and    at least a passive device being formed of a portion of at least any said plurality of conductive layer and being electrically connected to a plurality of conductive pads, wherein said plurality of conductive pads are placed upon at least a surface of said build-up multi-layer structure.    
   
   
       2 . A switch module according to  claim 1 , wherein said passive device comprises a capacitance device.  
   
   
       3 . A switch module according to  claim 2 , wherein an upper polarization plate and a lower polarization plate of said capacitance device are respectively placed upon distinct but adjacent two of said plurality of conductive layers, and said upper polarization plate and said lower polarization plate overlap with positions of up-and-down symmetry.  
   
   
       4 . A switch module according to  claim 3 , wherein said upper polarization plate and said lower polarization plate are respectively connected to any said plurality of conductive pads by a conductive connection structure, wherein said conductive connection structure is placed on the dielectric layer between said upper polarization plate and said lower polarization plate.  
   
   
       5 . A switch module according to  claim 4 , wherein said conductive connection structure comprises a conductive blind hole.  
   
   
       6 . A switch module according to  claim 1 , wherein said passive device comprises a resistance device.  
   
   
       7 . A switch module according to  claim 6 , wherein said resistance device further comprises a principle part of resistor contacting said plurality of conductive pads and being placed upon said surface.  
   
   
       8 . A switch module according to  claim 1 , wherein said passive device comprises a capacitance device.  
   
   
       9 . A switch module according to  claim 8 , wherein said capacitance further comprises at least a conductive coil contacting said plurality of conductive pads and being placed upon said surface.  
   
   
       10 . A switch module according to  claim 9 , wherein said capacitance device further comprises at least two conductive blind holes respectively contacting said conductive coil and one of said plurality of conductive pads, and at least a conductive tracking line placed on said build-up multi-layer structure for contacting said two conductive blind holes.  
   
   
       11 . A switch module according to  claim 1  further comprising at least a conductive connection structure being placed upon said build-up multi-layer structure and penetrating at least one of said plurality of dielectric layer.  
   
   
       12 . A switch module according to  claim 2 , wherein said conductive connection structure comprises at least a conductive buried hole.  
   
   
       13 . A Single-Pole Double-Throw (SPDT) module comprising: 
 a build-up multi-layer structure, said build-up multi-layer structure comprising: 
 a plurality of conductive layers paralleled each another, wherein two of said plurality of conductive layers being placed upon two surfaces of said build-up multi-layer structure;  
 a plurality of dielectric layers, wherein any said plurality of dielectric layers being interfered between any two of said plurality of conductive layers; and  
 a plurality of conductive connection structures, wherein a portion of said plurality of conductive connection structures piercing through a portion of said plurality of dielectric layers to contact and connect to at least any two of said plurality of conductive layers;  
 a resistance device being formed of a portion of the conductive layer placing upon said surface;  
 a capacitance device having at least an upper polarization plate, a lower polarization plate, distinct two of said plurality of conductive connection structures and two first conductive pads, wherein said upper polarization plate and said lower polarization plate being respectively formed of a portion of any two distinct and adjacent said conductive layers, said distinct two of said plurality of conductive connection structures being respectively contacting said upper polarization plate and said lower polarization plate, said distinct two of said plurality of said conductive connection structures being respectively contacting any said plurality of first conductive pads, and any said plurality of first conductive pads being a portion of the conductive layer placing upon any said surfaces; and  
 an inductance device having at least a conductive coil and two second conductive pads, said conductive coil and said two second conductive pads being a portion of the conductive layer placing upon any said surfaces and said conductive coil being electrically connected to said two second conductive pads.  
   
   
   
       14 . A SPDT module according to  claim 13 , wherein any said plurality of conductive connection structures comprises at least a conductive blind hole penetrating at least one of said plurality of conductive dielectric layers.  
   
   
       15 . A SPDT module according to  claim 14 , wherein any said plurality of conductive connection structures further comprises at least a conductive tracking line contacting and connecting to said conductive blind hole.  
   
   
       16 . A SPDT module according to  claim 13 , wherein said upper polarization plate and said lower polarization plate have overlapping position between.  
   
   
       17 . A SPDT module according to  claim 13 , wherein any said plurality of conductive layers is formed of a copper foil layer.  
   
   
       18 . A SPDT module according to  claim 13  further comprising a diode device fastening upon the conductive layer of any said surfaces.