US2006185474A1PendingUtilityA1

Copper powder

47
Assignee: YAMADA TOMOYAPriority: Feb 18, 2005Filed: Feb 17, 2006Published: Aug 24, 2006
Est. expiryFeb 18, 2025(expired)· nominal 20-yr term from priority
B22F 1/05B22F 1/00B22F 9/20H05K 1/092Y02P10/20C22C 9/02B23K 35/302C22B 15/0091B22F 2998/00
47
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Claims

Abstract

A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 D M -1.5 D M . This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.

Claims

exact text as granted — not AI-modified
1 . A copper powder containing 10-20,000 ppm of Sn.  
     
     
         2 . A copper powder containing 100-2,000 ppm of Sn.  
     
     
         3 . A copper powder according to  claim 1 , whose average particle diameter DM is 0.1-2 μm.  
     
     
         4 . A copper powder according to  claim 1 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.  
     
     
         5 . A copper powder according to  claim 1 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.  
     
     
         6 . A copper powder according to  claim 1 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.  
     
     
         7 . A copper powder suitable for use as filler in a conductive paste, containing 10-20,000 ppm of Sn, whose average particle diameter DM is 0.1-2 μm and the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.  
     
     
         8 . A copper powder according to  claim 2 , whose average particle diameter DM is 0.1-2 μm.  
     
     
         9 . A copper powder according to  claim 2 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.  
     
     
         10 . A copper powder according to  claim 3 , whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.  
     
     
         11 . A copper powder according to  claim 2 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.  
     
     
         12 . A copper powder according to  claim 3 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.  
     
     
         13 . A copper powder according to  claim 4 , obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions.  
     
     
         14 . A copper powder according to  claim 2 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.  
     
     
         15 . A copper powder according to  claim 3 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.  
     
     
         16 . A copper powder according to  claim 4 , obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1,000 ppm of Sn.

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