Chip scale package with heat spreader

Abstract

A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.

1 . A paddle frame strip providing a plurality of heat sinks, each heat sink connected to a surface of a semiconductor die, comprising: 
 an elongate metallic strip, comprising:    left and right rails;    a plurality of paddle frames positioned between said left and right rails;    wherein each said paddle frame includes a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining said paddle to said cross members and to said rails.    
     
     
         2 . The paddle frame strip of  claim 1 , wherein said paddle frame strip is leadless.  
     
     
         3 . The paddle frame strip of  claim 1 , wherein said paddle frame strip comprises at least one heat sink.  
     
     
         4 . The paddle frame strip of  claim 1 , wherein said paddle has a suitable thickness for a heat sink.  
     
     
         5 . The paddle frame strip of  claim 1 , wherein said paddle frame strip is formed of one of aluminum, silver, and alloys thereof.  
     
     
         6 . A strip providing a plurality of heat sinks, each heat sink connected to a semiconductor die, comprising: 
 a strip, comprising:    left and right rails; and    a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining the paddle to the cross members and to the rails.    
     
     
         7 . The strip of  claim 6 , wherein the strip includes no leades.  
     
     
         8 . The strip of  claim 6 , wherein each paddle has a suitable thickness for a heat sink.  
     
     
         9 . The strip of  claim 6 , wherein the strip comprises at least one of aluminum, silver, and alloys thereof.  
     
     
         10 . A strip of heat sinks, each heat sink connected to a semiconductor die, comprising: 
 a strip, comprising:    left and right rails; and    a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally located paddle, and support bars joining the paddle to the cross members and to the rails.    
     
     
         11 . The strip of  claim 10 , wherein the strip includes no leads.  
     
     
         12 . The strip of  claim 10 , wherein each paddle has a suitable thickness for a heat sink.  
     
     
         13 . The strip of  claim 10 , wherein the strip comprises at least one of aluminum, silver, and alloys thereof.