US2006191659A1PendingUtilityA1

Method for manufacturing a mold

37
Assignee: HUANG CHUAN-DEPriority: Dec 3, 2004Filed: Dec 2, 2005Published: Aug 31, 2006
Est. expiryDec 3, 2024(expired)· nominal 20-yr term from priority
G02B 6/0036G02B 6/0065
37
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Claims

Abstract

The present invention relates to a method for manufacturing a mode for a light guide plate. The method includes the following steps: providing an organic substrate ( 30 ) having a main body ( 31 ) and a pattern ( 33 ) formed on a surface thereof; depositing a Ni film ( 32 ) on the pattern; forming a Ni layer ( 44 ) on the Ni film by an electroless plating method; removing the organic substrate thereby obtaining a Ni mold preform ( 60 ) with a pattern being formed thereon; attaching the Ni mold preform to a mold substrate ( 70 ) and obtaining a mold the light guide plate ( 80 ). The present invention has the advantages of simple processes and cost effectiveness.

Claims

exact text as granted — not AI-modified
1 . A method for manufacturing a mold comprising: 
 providing an organic substrate having a main body and a pattern provided on the main body;    depositing a Ni film on the pattern of the organic substrate;    forming a Ni layer on the Ni film by an electroless plating method;    removing the organic substrate thereby obtaining a Ni mold preform with a pattern being formed thereon; and    attaching the Ni mold preform to a mold substrate thereby obtaining a mold having the pattern thereon.    
   
   
       2 . The method as claimed in  claim 1 , wherein the material of the organic substrate is comprised of polymethylmethacrylate.  
   
   
       3 . The method as claimed in  claim 1 , wherein the material of the organic substrate is polyester carbonate.  
   
   
       4 . The method as claimed in  claim 1 , wherein the pattern of the organic substrate is formed by a photolithography method.  
   
   
       5 . The method as claimed in  claim 1 , wherein the main body and the pattern of the organic substrate are integrally formed by an injection molding process.  
   
   
       6 . The method as claimed in  claim 1 , wherein the pattern comprises a plurality of semi-spheres.  
   
   
       7 . The method as claimed in  claim 1 , wherein the pattern comprises a plurality of cylinders.  
   
   
       8 . The method as claimed in  claim 1 , wherein the Ni film is formed by a chemical vapor deposition method.  
   
   
       9 . The method as claimed in  claim 1 , wherein the Ni film is formed by a sputtering deposition method.  
   
   
       10 . The method as claimed in  claim 1 , wherein during performing the electroless plating method, an acid solution is employed as a plating solution.  
   
   
       11 . The method as claimed in  claim 11 , wherein the PH value of the acid solution is in the range from about 4.2 to about 4.8.  
   
   
       12 . The method as claimed in  claim 1 , wherein during performing the electroless plating method, an alkaline solution is employed as a plating solution.  
   
   
       13 . The method as claimed in  claim 1 , wherein the organic solvent contains acetone.  
   
   
       14 . The method as claimed in  claim 1 , wherein the Ni mold preform and the mold substrate are combined by a hot pressing method.

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