US2006191659A1PendingUtilityA1
Method for manufacturing a mold
Est. expiryDec 3, 2024(expired)· nominal 20-yr term from priority
G02B 6/0036G02B 6/0065
37
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Claims
Abstract
The present invention relates to a method for manufacturing a mode for a light guide plate. The method includes the following steps: providing an organic substrate ( 30 ) having a main body ( 31 ) and a pattern ( 33 ) formed on a surface thereof; depositing a Ni film ( 32 ) on the pattern; forming a Ni layer ( 44 ) on the Ni film by an electroless plating method; removing the organic substrate thereby obtaining a Ni mold preform ( 60 ) with a pattern being formed thereon; attaching the Ni mold preform to a mold substrate ( 70 ) and obtaining a mold the light guide plate ( 80 ). The present invention has the advantages of simple processes and cost effectiveness.
Claims
exact text as granted — not AI-modified1 . A method for manufacturing a mold comprising:
providing an organic substrate having a main body and a pattern provided on the main body; depositing a Ni film on the pattern of the organic substrate; forming a Ni layer on the Ni film by an electroless plating method; removing the organic substrate thereby obtaining a Ni mold preform with a pattern being formed thereon; and attaching the Ni mold preform to a mold substrate thereby obtaining a mold having the pattern thereon.
2 . The method as claimed in claim 1 , wherein the material of the organic substrate is comprised of polymethylmethacrylate.
3 . The method as claimed in claim 1 , wherein the material of the organic substrate is polyester carbonate.
4 . The method as claimed in claim 1 , wherein the pattern of the organic substrate is formed by a photolithography method.
5 . The method as claimed in claim 1 , wherein the main body and the pattern of the organic substrate are integrally formed by an injection molding process.
6 . The method as claimed in claim 1 , wherein the pattern comprises a plurality of semi-spheres.
7 . The method as claimed in claim 1 , wherein the pattern comprises a plurality of cylinders.
8 . The method as claimed in claim 1 , wherein the Ni film is formed by a chemical vapor deposition method.
9 . The method as claimed in claim 1 , wherein the Ni film is formed by a sputtering deposition method.
10 . The method as claimed in claim 1 , wherein during performing the electroless plating method, an acid solution is employed as a plating solution.
11 . The method as claimed in claim 11 , wherein the PH value of the acid solution is in the range from about 4.2 to about 4.8.
12 . The method as claimed in claim 1 , wherein during performing the electroless plating method, an alkaline solution is employed as a plating solution.
13 . The method as claimed in claim 1 , wherein the organic solvent contains acetone.
14 . The method as claimed in claim 1 , wherein the Ni mold preform and the mold substrate are combined by a hot pressing method.Cited by (0)
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