Apparatus and method for electrochemically processing a microelectronic workpiece

Abstract

A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first e electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece. The foregoing reactor architecture is particularly useful in connection with electroplating of the microelectronic workpiece and, more particularly, in electroplating operations that employ a consumable anode, such as a phosphorized copper anode.

1 - 52 . (canceled)  
   
   
       53 . A reactor for electrochemically processing a microelectronic workpiece comprising: 
 a fluid vessel;    an ion selective membrane positioned in the vessel between a first fluid flow region and a second fluid flow region;    a first fluid flow entry positioned to provide a first processing fluid to the first fluid flow region;    a first fluid flow exit positioned to remove the first processing fluid from the first fluid flow region;    a first electrode in fluid communication with the first fluid flow region;    a second fluid flow entry positioned to provide a second processing fluid different than the first processing fluid to the second fluid flow region;    a second fluid flow exit positioned to remove the second processing fluid from the second fluid flow region; and    a second electrode positioned to contact the microelectronic workpiece while the second electrode and the microelectronic workpiece are in fluid communication with the second fluid flow region.    
   
   
       54 . The reactor of  claim 53  wherein the membrane is selectively permeable to an ionic species in at least one of the first and second processing fluids.  
   
   
       55 . The reactor of  claim 53  wherein the first electrode is an anodic electrode and wherein the second electrode is a cathodic electrode.  
   
   
       56 . The reactor of  claim 53 , further comprising the first and second processing fluids.  
   
   
       57 . The reactor of  claim 56  wherein the first and second processing fluids provide chemical species for applying a metallic material to the microelectronic workpiece.  
   
   
       58 . The reactor of  claim 56  wherein the membrane is selectively permeable to an ionic species in at least one of the first and second processing fluids.  
   
   
       59 . The reactor of  claim 53 , further comprising a fluid reservoir coupled to the second fluid entry.  
   
   
       60 . The reactor of  claim 53  wherein the membrane has an at least partially conical shape.  
   
   
       61 . The reactor of  claim 53  wherein the membrane inclines upwardly in a radially outward direction.  
   
   
       62 . The reactor of  claim 53 , further comprising a perforated element positioned between the second electrode and the membrane.  
   
   
       63 . The reactor of  claim 53  wherein the first electrode includes an anode positioned in the vessel.