Laser-based technique for the fabrication of embedded electrochemical cells and electronic components

Abstract

A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

1 . An electronic device comprising: 
 a substrate having a conductive pattern on a top surface thereof;    a first micromachined recess formed in said substrate;    at least one electronic component disposed in said first recess;    and an electrical connection between said at least one electronic component and said conductive pattern.    
   
   
       2 . The device of  claim 1 , wherein said at least one electronic component is an electrochemical cell.  
   
   
       3 . The device of  claim 2 , wherein said electrochemical cell comprises an aqueous material.  
   
   
       4 . The device of  claim 1 , wherein said at least one electronic component comprises a complete electronic or opto-electronic component.  
   
   
       5 . The device of  claim 1 , wherein said at least one electronic component is comprised of a film comprising layers of electrochemically active material, electrolyte, current collector and an encapsulating material.  
   
   
       6 . The device of  claim 1 , wherein said at least one electronic component is comprised of a multilayer film comprising a current collector, an electrochemically active material, one of an electrolyte or a separator, a second electrochemically active material, a second current collector, and an encapsulating material.  
   
   
       7 . The device of  claim 1 , wherein said at least one electronic component comprises a transmission line.  
   
   
       8 . The device of  claim 1  further comprising a second micromachined recess in said substrate and said at least one electronic component comprises one electronic component in each of the recesses.  
   
   
       9 . The device of  claim 8  wherein said second micromachined recess is disposed adjacent to said first recess, and formed through a same side of said substrate.  
   
   
       10 . The device of  claim 8  wherein said second micromachined recess is formed in said substrate on a side opposite from where said first recess is located.  
   
   
       11 . The device of claim  32 , further comprising a via is formed between said first recess and said second recess.  
   
   
       12 . The device of  claim 1 , wherein said at least one electronic component comprises two electronic components stacked on top of each other and disposed in said first recess.