Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization

Abstract

Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition to provide a desired texture in the first region. In another embodiment, an apparatus for conditioning the polishing pad includes an end effector, a monitoring device, and a controller operatively coupled to the end effector and the monitoring device. The controller has a computer-readable medium containing instructions to perform a conditioning method, such as the above-mentioned method.

1 - 53 . (canceled)  
   
   
       54 . An apparatus for conditioning a polishing pad used for polishing a micro-device workpiece, comprising: 
 an end effector;    a monitoring device; and    a controller operatively coupled to the end effector and the monitoring device, the controller having a computer-readable medium containing instructions to perform a method comprising: 
 determining surface condition in a first region of the polishing pad;  
 determining surface condition in a second region of the polishing pad;  
 adjusting at least one of a relative velocity between the polishing pad and the end effector, an existing downforce on the polishing pad, and a sweep velocity of the end effector in response to the determined surface condition of the first region to provide a desired first surface texture in the first region; and  
 adjusting at least one of the relative velocity between the polishing pad and the end effector, the existing downforce on the polishing pad, and the sweep velocity of the end effector in response to the determined surface condition of the second region to provide a desired second surface texture in the second region.  
   
   
   
       55 . The apparatus of  claim 54  wherein the monitoring device comprises an optical analyzer.  
   
   
       56 . The apparatus of  claim 54  wherein the monitoring device comprises a load cell configured to measure a frictional force in a plane defined by the polishing pad.  
   
   
       57 . The apparatus of  claim 54  wherein the end effector comprises abrasive elements for abrading the polishing pad.  
   
   
       58 . The apparatus of  claim 54  wherein the monitoring device is configured to sense the surface condition of the polishing pad.  
   
   
       59 . An apparatus for conditioning a polishing pad used for polishing a micro-device workpiece, comprising: 
 an end effector;    a sensor; and    a controller operatively coupled to the end effector and the sensor, the controller having a computer-readable medium containing instructions to perform a method comprising: 
 monitoring surface condition in a first region of the polishing pad; and  
 adjusting at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition to provide a desired texture in the first region.  
   
   
   
       60 . The apparatus of  claim 59  wherein the sensor comprises an optical sensor.  
   
   
       61 . The apparatus of  claim 59  wherein the sensor comprises a load cell configured to measure a frictional force in a plane defined by the polishing pad.  
   
   
       62 . The apparatus of  claim 59  wherein the sensor is configured to detect the surface condition of the polishing pad.  
   
   
       63 . The apparatus of  claim 59  wherein the sensor is configured to continuously monitor the surface condition of the polishing pad.  
   
   
       64 . An apparatus for conditioning a polishing pad used for polishing a micro-device workpiece, comprising: 
 an end effector;    a means for sensing surface condition; and    a controller operatively coupled to the end effector and the means for sensing, the controller having a computer-readable medium containing instructions to perform a method comprising: 
 determining roughness of surface texture in a first region of the polishing pad; and  
 controlling at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad and a sweep velocity of the end effector in response to the determined roughness to provide a desired texture in the first region.  
   
   
   
       65 . The apparatus of  claim 64  wherein the means for sensing comprises an optical analyzer.  
   
   
       66 . The apparatus of  claim 64  wherein the means for sensing comprises a load cell configured to measure a frictional force in a plane defined by the polishing pad.  
   
   
       67 . An apparatus for conditioning a polishing pad used for polishing a micro-device workpiece, comprising: 
 an end effector;    a monitoring device; and    a controller operatively coupled to the end effector and the monitoring device, the controller having a computer-readable medium containing instructions to perform a method comprising: 
 engaging an end effector with the polishing pad and moving at least one of the end effector and the polishing pad relative to the other;  
 monitoring surface condition in a first region of the polishing pad; and  
 providing a desired texture in the first region of the polishing pad by regulating at least one of a relative velocity between the polishing pad and the end effector, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition of the first region.  
   
   
   
       68 . The apparatus of  claim 67  wherein the monitoring device comprises an optical analyzer.  
   
   
       69 . The apparatus of  claim 67  wherein the monitoring device comprises a load cell configured to measure a frictional force in a plane defined by the polishing pad.