Heat-Dissipating Fin Set in Combination with Thermal Pipe

Abstract

A heat-dissipating fin set in combination with thermal pipe includes a plurality of fin plates and each of the fin plates has at least one closed through hole at same location. Each of the thermal pipe passes through the through hole. Each of the fin plate has an accommodating section atop the through hole and used for accommodating a heat-conducting material. The heat-conducting material is placed into the accommodating section. The heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material fills a gap between the through hole and the thermal pipe, whereby a thermal conductance is provided between the through hole and the thermal pipe.

1 . A heat-dissipating device, comprising: 
 a heat-dissipating fin set including a plurality of fin plates, each of the fin plates having at least one closed through hole and an accommodating section atop the through hole, the accommodating section being formed in a downward dent extending but not in connecting with the through hole and a heat-conducting material being placed into the dent; and    a thermal pipe passing through the through hole;    wherein the heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material filling a gap between the through hole and the thermal pipe so that a thermal conductance provided between the through hole and the thermal pipe.    
   
   
       2 . The heat-dissipating device as in  claim 1 , wherein the heat-conducting material is heat-conducting glue.  
   
   
       3 . The heat-dissipating device as in  claim 1 , wherein the heat-conducting material is tin strip.  
   
   
       4 . The heat-dissipating device as in  claim 1 , wherein the heat-conducting material is tin paste.  
   
   
       5 . The heat-dissipating device as in  claim 1 , wherein the heat-conducting material is wax.