Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Abstract

A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.

1 - 15 . (canceled)  
     
     
         16 . A method for fabricating a tape ball grid array package, the method comprising: 
 providing a conductive supporting structure, an integrated circuit chip and a substrate;    attaching the integrated circuit chip and the substrate to the conductive supporting structure;    electrically connecting the integrated circuit chip to a patterned metal layer of the substrate;    electrically connecting the conductive supporting structure to the patterned metal layer of the substrate via a direct electrical connection; and    attaching a plurality of solder balls to the substrate, including electrically connecting some of the solder balls to the patterned metal layer of the substrate.    
     
     
         17 . The method of  claim 16  further comprising electrically connecting the conductive supporting structure to a second patterned metal layer of the substrate.  
     
     
         18 . The method of  claim 16  wherein the electrically connecting of the conductive supporting structure to the patterned metal layer of the substrate includes wirebonding the conductive supporting structure to the patterned metal layer of the substrate.  
     
     
         19 . The method of  claim 16  wherein the conductive supporting structure includes a protruding member on the same side of the conductive supporting structure on which the integrated circuit chip is attached, the protruding member being configured to substantially surround the integrated circuit chip attached to the conductive supporting structure.  
     
     
         20 . The method of  claim 19  further comprising electrically connecting the protruding member to the patterned metal layer of the substrate.