Circuit substrate and its manufacturing method

Abstract

A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

1 - 25 . (canceled)  
   
   
       26 . A circuit substrate, comprising: 
 layered organic films each supporting circuit modules and being electrically and/or optically connected to each other.    
   
   
       27 . A circuit substrate, comprising: 
 layered organic films each supporting electric circuits having respective function modules, said electric circuits being electrically and/or optically connected to each other.    
   
   
       28 . A circuit substrate, comprising: 
 layers, each being selected from any one of a first organic film supporting a circuit with a function module, a second organic film supporting a thinned function circuit, and a third organic film supporting a bare chip function device, with circuits of said layers being electrically and/or optically connected to each other.    
   
   
       29 . The circuit substrate according to  claim 28 , wherein 
 said thinned function circuit on said second organic film has a thickness of at most 10 μm, and    each of said first, second and third organic films have a thickness of at most 100 μm.    
   
   
       30 . The circuit substrate according to  claim 28 , further comprising: 
 a metal connection for electrically connecting circuits of different ones of said layers.    
   
   
       31 . The circuit substrate according to  claim 28 , 
 wherein said second organic film supports a bare chip function device.    
   
   
       32 . The circuit substrate according to  claim 28 , 
 wherein said function module is for transforming an electric, optical or audio signal into another signal.    
   
   
       33 . The circuit substrate according to  claim 28 , 
 wherein said thinned function circuit is a capacitor, inductor or register.    
   
   
       34 . The circuit substrate according to  claim 28 , 
 wherein said circuit substrate has a thickness of at most 7 μm.    
   
   
       35 . A circuit substrate incorporated within a cellular phone, personal data assistant, computer, identification card, electric wallet, remote controller or memory card, wherein said circuit substrate has layers each being selected from any one of a first organic film supporting a circuit with a function module, a second organic film supporting a thinned function circuit, and a third organic film supporting a bare chip function device, with circuits of said layers being electrically and/or optically connected to each other.  
   
   
       36 . A circuit substrate comprising: 
 layered circuit modules each including a component for signal transmission and processing, a circuit, and an electrical and/or optical connector for connecting said circuit of one of said circuit modules to said circuit of another one of said circuit modules.    
   
   
       37 . A circuit substrate comprising: 
 circuit modules layered one on top another, each of said circuit modules comprising 
 (i) two flexible circuit boards each supporting components for transmitting or processing a signal, and a circuit for connecting said components, and  
 (ii) a flexible connecting portion formed integrally with said two flexible circuit boards and supporting a circuit for electrically and/or optically connecting said circuits on said circuit boards.  
   
   
   
       38 . The circuit substrate according to  claim 37 , wherein 
 said circuit modules are layered so that said connecting portions do not overlap each other.    
   
   
       39 . The circuit substrate according to  claim 37 , wherein 
 one of said circuit boards of one of said circuit modules is positioned above one of said circuit boards of another one of said circuit modules, and    the other of said circuit boards of said one of said circuit modules is positioned under the other of said circuit boards of said another one of said circuit modules.    
   
   
       40 . The circuit substrate according to  claim 37 , wherein 
 adjacent circuit boards of at least two of said circuit modules are at least in part in contact with or bonded to each other.    
   
   
       41 . The circuit substrate according to  claim 40 , wherein 
 a contact or bonded area of said adjacent circuit boards is at most  50  % of an entire area of each of said circuit boards.    
   
   
       42 . The circuit board according to  claim 41 , wherein 
 said adjacent circuit boards are electrically or optically connected to each other in said contact or bonded area.    
   
   
       43 . A circuit substrate comprising: 
 a first circuit module and a second circuit module,    each of said first and second circuit modules having first and second circuit boards and a connection portion for connecting said first and second circuit boards, each of said first and second circuit boards supporting components for transmitting or processing a signal, and each of said first and second circuit boards also supporting a circuit for connecting said components, with said connection portion supporting another circuit for connecting said circuits on said circuit boards,    wherein said first and second circuit modules are layered so that said first and second circuit boards of said first circuit module are layered on said first and second circuit boards of said second circuit module.    
   
   
       44 . The circuit substrate according to  claim 43 , 
 wherein said first circuit board of said first circuit module is placed on or above said first circuit board of said second circuit board, and said second circuit board of said first circuit module is placed below or under said second circuit board of said second circuit module.    
   
   
       45 . A process for manufacturing a circuit substrate having circuit modules layered one on top of another, each of the circuit modules having flexible circuit boards each supporting components for transmitting or processing a signal, each of the flexible circuit boards also supporting a circuit connecting the components, and each of the circuit modules also having a flexible connecting portion integrated with the circuit boards for electrically and/or optically connecting the circuit boards, comprising: 
 detecting an operation of the circuits supported on one or more of the circuit boards of the circuit modules before completing layering of the circuit modules.