Medical devices comprising a multilayer construction

Abstract

A medical device comprising a first substrate, a second substrate and a powder coated tie layer between the first and second substrates resulting in a multilayer construction.

1 - 13 . (canceled)  
     
     
         14 . A method for assembling a medical device having at least two substrates comprising the steps of: 
 a) providing a first substrate having an inner or an outer surface;    b) providing a second substrate having an inner or an outer surface;    c) powder coating at least a portion of said outer surface of said first substrate or said inner surface of said second substrate resulting in a powder coated portion on at least one of said outer surface of said first substrate or said inner surface of said second substrate second substrate;    d) contacting said first substrate and said second substrate at least at said powder coated portion; and    e) thermally activating said powder coating to form an adhesive layer between said first substrate and said second substrate.    
     
     
         15 . The method of  claim 14  wherein said first substrate comprises a first material and said second substrate comprises a second material different from said first material.  
     
     
         16 . The process of  claim 14  wherein said first substrate is a dilatation balloon, and said second substrate is a catheter shaft or catheter distal tip.  
     
     
         17 . The process of  claim 14  wherein said first substrate comprises at least one polyolefin or compolymer thereof, said second substrate comprises at least one member selected from the group consisting of polyesters, polyurethanes, polyureas, polyamides, nylons, polymers of vinyl monomers, poly(meth)acrylates, copolymers thereof, or mixtures thereof.  
     
     
         18 . The process of  claim 14  wherein said tie layer comprises at least one polymer which is compatible with said first substrate and said second substrate or a blend of polymers in which at least one is compatible with said first substrate and at least one is compatible with said second substrate.  
     
     
         19 . The process of  claim 14  wherein said tie layer comprises a maleated polyolefin.  
     
     
         20 . The process of  claim 14  wherein said first substrate comprises a high density polyethylene and said second substrate comprises a polyether-block-amide.  
     
     
         21 . The process of  claim 20  wherein said tie layer comprises a maleated polyolefin.  
     
     
         22 . The process of  claim 20  wherein said tie layer comprises at least one polyethylene and at least one polyether-block-amide copolymer.  
     
     
         23 - 25 . (canceled)