US2006205327A1PendingUtilityA1

Polishing apparatus and method

Assignee: HUANG KUO-CHENGPriority: Mar 8, 2005Filed: Mar 7, 2006Published: Sep 14, 2006
Est. expiryMar 8, 2025(expired)· nominal 20-yr term from priority
B24B 29/02B24B 13/01
32
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Claims

Abstract

The present invention provides a polishing apparatus and a polishing method, which are particular for the non-spherical lens. The polishing apparatus includes a base for carrying an object; and a polishing head, wherein the polishing head has a polishing layer made of a resin, a diamond and a graphite for polishing the object; a buffer layer connected to the polishing layer for the polishing head to tilt and shift; and a shaft connected to the buffer layer.

Claims

exact text as granted — not AI-modified
1 . A polishing apparatus, comprising: 
 a base for carrying an object thereon; and    a polishing head located above said base, wherein said polishing head comprises:    a polishing layer for polishing said object; 
 a buffer layer connected to said polishing layer for said polishing head to tilt and shift; and  
 a shaft connected to said buffer layer.  
   
   
   
       2 . The polishing apparatus according to  claim 1 , wherein said polishing layer is made of a material selected from the group consisting of a resin, an abrasive particle and a graphite.  
   
   
       3 . The polishing apparatus according to  claim 2 , wherein said abrasive particle is one selected from the group consisting of a diamond, a silicon carbide (SiC) and a cubic boron nitride (CBN).  
   
   
       4 . The polishing apparatus according to  claim 2 , wherein a particle size of said abrasive particle is ranged from #800 to #4000.  
   
   
       5 . The polishing apparatus according to  claim 2 , wherein an amount of said graphite is ranged from 25% to 35% by weight in said polishing layer.  
   
   
       6 . The polishing apparatus according to  claim 1 , wherein said shaft is a metal shaft.  
   
   
       7 . The polishing apparatus according to  claim 1 , wherein said polishing layer further comprises a diversion channel.  
   
   
       8 . The polishing apparatus according to  claim 7 , wherein said diversion channel contains a polishing slurry located therein.  
   
   
       9 . The polishing apparatus according to  claim 8 , wherein said diversion channel comprises at least one opening for discharging said polishing slurry.  
   
   
       10 . The polishing apparatus according to  claim 1 , wherein said buffer layer has a material being one selected from the group consisting of sponges, elastic gels, and springs.  
   
   
       11 . The polishing apparatus according to  claim 1 , wherein said object is a non-spherical lens.  
   
   
       12 . A polishing head for polishing an object, comprising: 
 a polishing layer; and    a buffer layer connected to said polishing layer for said polishing head to tilt and shift.    
   
   
       13 . The polishing head according to  claim 12 , wherein said polishing layer is made of materials comprising a resin, an abrasive particle, and a graphite.  
   
   
       14 . The polishing head according to  claim 13 , wherein said abrasive particle is one selected from the group consisting of a diamond, a silicon carbide (SiC) and a cubic boron nitride (CBN).  
   
   
       15 . The polishing head according to  claim 13 , wherein a particle size of said abrasive particle is ranged from #800 to #4000.  
   
   
       16 . The polishing head according to  claim 13 , wherein an amount of said graphite is ranged from 25% to 35% by weight in said polishing layer.  
   
   
       17 . The polishing head according to  claim 12 , wherein said polishing layer further comprises a diversion channel.  
   
   
       18 . The polishing head according to  claim 17 , wherein said diversion channel contains a polishing slurry located therein.  
   
   
       19 . The polishing head according to  claim 18 , wherein said diversion channel comprises at least one opening for discharging said polishing slurry.  
   
   
       20 . The polishing head according to  claim 12 , wherein said buffer layer has a material being one selected from the group consisting of sponges, elastic gels, and springs.  
   
   
       21 . The polishing head according to  claim 12 , wherein said object is a non-spherical lens.  
   
   
       22 . A polishing method, comprising steps of: 
 providing said polishing apparatus according to  claim 1 , wherein said object has a first central curvature radius R and a first conic constant K;    making said polishing head to have a second central curvature radius R±ΔR and a second conic constant K±ΔK; and    polishing said object with said polishing head.    
   
   
       23 . The polishing method according to  claim 22 , wherein said ΔR is ranged from 0.001 R to 0.1 R and said ΔK is ranged from 0.001K to 0.1K.  
   
   
       24 . The polishing method according to  claim 22 , wherein said object is a concave object.  
   
   
       25 . The polishing method according to  claim 22 , wherein said object is a convex object.  
   
   
       26 . A polishing method, comprising steps of: 
 providing an object having a first central curvature radius R and a first conic constant K;    providing a polishing head having a second central curvature radius R±ΔR, and a second conic constant K±ΔK, wherein said ΔR is ranged from 0.001 R to 0.1 R and said ΔK is ranged from 0.001K to 0.1K; and    polishing said object with said polishing head.    
   
   
       27 . The polishing method according to  claim 26 , wherein said object is a concave object.  
   
   
       28 . The polishing method according to  claim 26 , wherein said object is a convex object.

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